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Semiconductor device fixing structure

A fixed structure, semiconductor technology, applied in the field of electronics, can solve the problems of difficult assembly, increased overall layout space size, etc., to achieve the effect of small space occupation, reduction of ground wiring paths, and reliable connection

Active Publication Date: 2021-11-30
FSP POWERLAND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such assembly is difficult, which increases the size of the overall layout space

Method used

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  • Semiconductor device fixing structure
  • Semiconductor device fixing structure
  • Semiconductor device fixing structure

Examples

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Embodiment Construction

[0032] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0033] It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual impleme...

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Abstract

The invention provides a semiconductor device fixing structure. The semiconductor device fixing structure comprises a substrate, a heat dissipation plate, a mainboard, an insulating spacer and a metal elastic piece, wherein the heat dissipation plate is arranged on the substrate; the mainboard is arranged on the heat dissipation plate, the mainboard extends towards the outer side of the heat dissipation plate, and a semiconductor device is arranged on the mainboard; the insulating spacer is arranged on the heat dissipation plate, and the semiconductor device is coated with the insulating spacer; and a first part of the metal elastic piece is arranged on the insulating spacer, the first part is used for extruding the insulating spacer, a second part of the metal elastic sheet is fixed on the heat dissipation plate or the substrate, and the first part and the second part are arranged at an angle. The semiconductor device fixing structure provided by the invention is simple in structure.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a semiconductor device fixing structure. Background technique [0002] In the power layout of switching power supplies, semiconductor devices, as the core power devices, often bear most of the circuit loss and show it in the form of heat. The high junction temperature has a great influence on the working efficiency and life of the semiconductor device. Therefore, it is generally necessary to add a radiator to dissipate heat for the semiconductor device. [0003] In the form of assembly where heat dissipation is attached to the case, especially the primary side, it is necessary to deal with the electrical distance between the semiconductor device and the surrounding metal devices or structures to meet the requirements of safety regulations. Generally, heat-shrinkable sleeves are covered with metal bead, and screws are used to fix and compress semiconductor devices to achieve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/02H05K5/00H05K5/02H05K7/14H01L23/367
CPCH05K1/18H05K1/182H05K1/0215H05K1/021H05K5/0026H05K5/0234H05K7/1417H01L23/367
Inventor 吕广贤陶鹤英徐明孙巨禄
Owner FSP POWERLAND TECH
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