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62results about How to "Increase pattern" patented technology

Attribute based association rule mining

A data processing system processes data sets (such as low-resolution transaction data) into high-resolution data sets by mapping generic information into attribute-based specific information that is stored in a database. The extracting frequent pattern information from the database using frequent pattern growth techniques, a compact frequent pattern tree data structure efficiently holds frequent pattern information for multiple transactions having one or more items in each transaction. Frequent pattern data is transformed for ease of use with rule generation algorithms by removing redundant information (such as part group items) or by consolidating items corresponding to a part group and replacing those items with a proxy item for purposes of power set generation.
Owner:VERSATA DEV GROUP

Method for patterning a substrate using ion assisted selective deposition

A method of patterning a substrate includes providing a focusing plate adjacent to a plasma chamber containing a plasma, the focusing plate configured to extract ions from the plasma through at least one aperture that provides focused ions towards the substrate. The method further includes directing first ions through the at least one aperture to one or more first regions of the substrate so as to condense first gaseous species provided in ambient of the substrate on the one or more first regions of the substrate.
Owner:VARIAN SEMICON EQUIP ASSOC INC

Tape substrate and method for fabricating the same

A tape substrate including an insulating film, a copper foil pattern formed on the insulating film at one side of the insulating film, and provided with a connecting area where an electronic element is to be mounted, a barrier layer plated on the copper foil pattern at the connecting area, and formed with a plurality of pores, and a tin layer plated on the barrier layer, and alloyed with a portion of the copper foil pattern corresponding to the connecting area, through the pores. A method for fabricating the tape substrate is also disclosed. In accordance with the invention, it is possible to reduce the time taken for the copper foil pattern to come into contact with the electroless tin plating solution used in the tin plating process, thereby preventing the copper component of the copper foil pattern from being eluted. Accordingly, there is no open-circuit fault caused by formation of pores. The barrier layer makes it possible to obtain an improved plating efficiency and to reduce the thickness of the alloy layer. In addition, the barrier layer serves to reduce internal stress generated at the interface between the tin layer and the copper foil pattern, thereby suppressing formation of voids. Accordingly, there is an effect of preventing a short circuit caused by the growth of whiskers.
Owner:LG ELECTRONICS INC +1

Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method

ActiveUS8685196B2Readily and reliably applicable material preventing adhesionReadily and reliablyLamination ancillary operationsSynthetic resin layered productsEngineeringSolvent
In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and / or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board (1) are provided.
Owner:AT & S AUSTRIA TECH & SYSTTECHN AG
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