78results about How to "Guaranteed Signal Integrity" patented technology

The invention designs a method for reducing the number of cables through interconversion between a parallel bus and a serial bus. A CPLD or FPGA programmable logic chip is adopted, and the CPLD or FPGA programmable logic chip has a delay-locked loop (DLL) function and a double data rate (DDR) function, the base pin rate if the chip and the frequency of a system clock are at least more than two times of frequencies all the low speed signals. Various low speed bus signals and various low speed signals are sent into the programmable logic chip, channel associated synchronized clocks or other clocks are sent into the programmable logic chip, too. An FIFO memory cell is used for caching data during serial-to-parallel convention. A DDR sampling unit is used for synchronously sampling when the low speed signals are in the rising edge and the falling edge of clocks, so that the frequency of the system clock in the programmable logic chip can be reduced by two times, so requirement of the frequency of the system clock in the chip can be reduced.

The invention discloses a method for filling a redundancy metal in a semiconductor manufacturing process. In the method, redundancy metal filling is evaluated and adjusted by combining analogue flatness and extracting the capacitance between metal wires; and all flatness hotspots and capacitance hotspots of a circuit layout are eliminated by a plurality of iteration processes; therefore, not onlythe consistency of the circuit layout thickness after performing chemical mechanical polishing (CMP) can be ensured to improve the yield of chips, but also the damage to functions of the chips causedby the introduction of the redundancy metal can be prevented to ensure the signal completeness of the metal wires in the circuit layout.

The invention discloses a common voltage generating circuit and method, and a display device. The common voltage generating circuit comprises: a first signal generator which provides a visual angle control signal; a second signal generator providing a reference square wave signal; a first switching module outputting one of a first pull-up signal and a second pull-up signal according to the visualangle control signal; a second switching module outputting one of a first power supply signal and a second power supply signal according to the visual angle control signal; and a comparator used for receiving a reference voltage signal and outputting a first common voltage according to the reference voltage signal, the reference square wave signal, the first pull-up signal and the first power supply signal or outputting a second common voltage according to the reference voltage signal, the reference square wave signal, the second pull-up signal and the second power supply signal. The first common voltage and the second common voltage with different amplitudes can be provided for the display device, and meanwhile the circuit is small in size, simple in structure and low in cost.

The invention discloses a novel microwave three-dimensional integrated system-in-package interconnection structure. The microwave three-dimensional integrated system-in-package interconnection structure comprises a substratum medium substrate, a microstrip line, a grounded metallization hole array, a millimeter wave monolithic integrated circuit and a silicon substrate, and the grounded metallization hole array, the millimeter wave monolithic integrated circuit and the silicon substrate are arranged on substratum medium substrate; grounded planar metal is arranged on the grounded metallizationhole array, and the millimeter wave monolithic integrated circuit is arranged between a silicon substrate and grounded planar metal; a cavity is formed in the silicon substrate above a sensitive position of the millimeter wave monolithic integrated circuit; the microstrip line is connected with the millimeter wave monolithic integrated circuit through a planar transmission line. Compared with traditional golden wire bonding, the interconnection size among chips is obviously reduced, which is beneficial to maintenance of signal integrity during transmission of radio frequency and high-speed digital signals.

This invention provides a classifying antenna and a mobile terminal. The classifying antenna comprises a classifying antenna main body, a matching circuit, a filter and a static protection circuit, wherein the classifying antenna main body is used for receiving and sending electromagnetic waves; the matching circuit is matched with the classifying antenna main body to receive the electromagnetic waves and send the electromagnetic waves to the filter; the filter is used for filtering radio frequency signals of at least two frequency bands; the matching circuit at least comprises a first inductor (L1) and a first capacitor (C) connected between the classifying antenna main body and the filter in series; the static protection circuit is a static suppressor (CR) connected onto the feeder line of the classifying antenna main body; and, one end of the static suppressor (CR) is connected with the feeder line of the classifying antenna main body, and the other end is connected with the ground. By adoption of the classifying antenna, the static protection performance of the mobile terminal is effectively improved; and the reliability of the mobile terminal is improved.

The invention discloses a miniature ultra-wideband common mode noise suppression circuit which comprises a quarter-wavelength stepped impedance resonator layer, an embedded differential coupling microstrip line layer, a half-wavelength resonator layer and a reference ground layer, wherein the layers are separated by dielectric substrates. The quarter-wavelength stepped impedance resonator layer comprises a quarter-wavelength stepped impedance resonator, wherein one end of the quarter-wavelength stepped impedance resonator is open circuit, and the other end of the quarter-wavelength stepped impedance resonator is connected with a first branch in parallel. The tail end of the first branch is connected with the reference ground layer through a metal via. The embedded differential coupling microstrip line layer comprises an embedded differential coupling microstrip line. The half-wavelength resonator layer comprises a half-wavelength resonator, and both ends of the half-wavelength resonator are open circuit. The circuit is applicable to the GHz frequency band, and the signal integrity of differential signal transmission can be ensured while common mode noise suppression is realized.

The invention discloses a precise depth-controlled groove milling-based manufacture method of a microwave printed circuit board. The method includes the following steps that: a stepped groove is formed in a production board by means of depth-controlled groove milling, and the groove bottom of the stepped groove is located in a dielectric layer at the upper part of a copper layer at the inner sideof a Rogers high-frequency board; electroless copper plating and full-board electroplating treatment are performed on the production board, so that the groove bottom and groove wall of the stepped groove are plated with a copper layer; the production board is coated with a film, and an outer layer pattern is formed on the production board by means of explosion and development, pattern plating is performed on the production board; a plated layer at the bottom of the stepped groove is removed by means of milling, so that the dielectric layer at the bottom of the stepped groove is exposed; the dielectric layer at the bottom of the stepped groove is burned through laser, so that the copper layer at the inner side of the Rogers high-frequency board is exposed; and adhesive removing treatment isperformed on the production board, and the copper layer exposed at the bottom of the stepped groove is removed by means of alkaline etching. With the method of the invention adopted, the zero damageof the Rogers high-frequency board is realized, and the signal integrity of a high-frequency and high-speed printed circuit board during signal transmission can be ensured.

The invention discloses a storage apparatus and a data access method, and belongs to the technical field of storage. The apparatus comprises a PCB (Printed Circuit Board) and a plurality of storage particles symmetrically arranged on two side surfaces of the PCB; the storage particles on one side surface of the PCB form a Rank; the storage particles on the other side surface of the PCB form a Rank; the storage particles comprise a plurality of PINs; a plurality of routes are arranged in the PCB; one of the routes is connected with the two PINs located in the same positions of two sides of the PCB; and the apparatus further comprises a conversion module used for obtaining a system bus signal sent by a system bus and converting the system bus signal into a Rank selection signal and storage particle bus signals, a Rank judger used for determining the selected Rank according to the Rank selection signal, and a switching array used for outputting the storage particle bus signals corresponding to the PINs of the storage particles in the selected Rank to the routes according to corresponding relationships between the PINs of the storage particles in the selected Rank and the routes.

The invention provides a multi-chip package structure which comprises a substrate, at least two DRAM chips, a first bonding wire, a second chip, a second bonding wire and a package body. The substrate is provided with a first surface, a second surface, a plurality of wires and at least two windows, wherein the first surface and the second surface are opposite, the wires are arranged on the first surface and the second surface, and the windows penetrate through the first surface and the second surface. The at least two DRAM chips are arranged on the first surface of the substrate and cover one ends of the windows respectively. The first bonding wire penetrates through the windows and is electrically connected with the DRMA chips and the wires on the second surface of the substrate. The second chip is stacked on the DRMA chips, the second bonding wire is electrically connected to the second chip and the wires on the first surface of the substrate, and the package body is packaged on the periphery of the DRAM chips and the second chip and the periphery of the windows of the substrate and covers the first bonding wire and the second bonding wire.

The invention discloses a cable connector. The cable connector comprises a shell, a conductive terminal set arranged in the shell and a cable electrically connected with the conductive terminal set. The front end of the shell is provided with a plug-in groove, the conductive terminal group comprises a first terminal strip and a second terminal strip which are symmetrically arranged on the upper side and the lower side of the plug-in groove, and the first terminal strip and the second terminal strip are both composed of a plurality of conductive terminals. Each conductive terminal comprises a main body part, a contact part formed by bending from the front end of the main body part, and a welding part formed by extending backwards from the rear end of the main body part; and the welding part of the first terminal row and the welding part of the second terminal row are arranged in parallel. And the distance between the welding part of the first terminal strip and the welding part of the second terminal strip is 1-2.5 times of the minimum distance between the contact part of the first terminal strip and the contact part of the second terminal strip. The cable connector provided by the invention can avoid signal interference between the terminal strips to the greatest extent while meeting the requirement of low size, thereby ensuring the signal integrity of a product.

The invention belongs to the technical field of digital circuit testability verification, and discloses an embedded fault injection module, a high-speed digital circuit system and an embedded fault injection method. The embedded fault injection module comprises a signal path circuit which is used for ensuring that a high-speed digital circuit system has the same signal characteristics as before access after the embedded fault injection module is accessed and can intervene in a signal path during fault injection, a fault injection control circuit which is used for controlling the signal path circuit and controlling implementation of fault injection, a fault mode sub-module circuit that is used for storing a fault injection sequence according to a fault mode library of the high-speed digitalcircuit module and generating fault injection data of a low-speed signal, and a data communication circuit which is used for receiving and analyzing the fault mode simulation instruction of an uppercomputer and transmitting information to the fault injection control circuit. Therefore, a problem of high-speed signal fault injection of the high-speed digital circuit module can be solved.

The invention discloses an optical module. The optical module includes a shell, and a semiconductor optical element, a first circuit board and a second circuit board arranged in the shell, the first circuit board comprises a first substrate, a first transmission metal layer and a second transmission metal layer successively formed at on the upper surface of the first substrate, and a dielectric layer formed between the first transmission metal layer and the second transmission metal layer. The first transmission metal layer is provided with a signal transmission window, the second circuit board comprises a second substrate, a third transmission metal layer formed on the lower surface of the second substrate, and a fourth transmission metal layer formed on the upper surface of the second substrate, one end of the second circuit board is electrically connected with the semiconductor optical element, the third transmission metal layer at the other end of the second circuit board is arranged on the signal transmission window and electrically connected with the first transmission metal layer through the signal transmission window, and the fourth transmission metal layer and the second transmission metal layer are electrically connected.

The invention provides a method and a system for suppressing plane resonance by placing a capacitor position, comprising the following steps: S1, obtaining different values of Dk and Df and a height between a power supply layer and a ground layer based on different stack structures of chips; S2, impedance analysis is performed to find the position of the lowest natural frequency; S3, simulating the resonance diagram at the position of the lowest natural frequency, and analyzing the interference of the plane resonance to the signal; S4, set a different number of decoupling capacitors beneath the high speed device and re-simulate the resonance pattern until the planar resonance is within the desired range. The purpose of improving the resonance of the frequency band is realized by changing the cavity formed between the power supply layer and the ground layer. The ground elastic effect caused by cavity resonance can be reduced, and the electromagnetic interference caused by the ground elastic effect can be reduced. The effect of de-resonance on signals caused by the fact the decoupling capacitor is placed in different positions is expressed.

The invention discloses a double-backboard structure, which comprises a backboard A and a backboard B, wherein a daughter board connector is embedded in the backboard A, a positioning pin seat is further fixedly installed on one side face of the backboard A, a mother board connector is embedded in the backboard B, a positioning pin is fixedly mounted on one side surface of the backboard B, the positioning pin is inserted into the positioning pin seat, the backboard B is connected with the backboard A through matching of the positioning pin and the positioning pin seat, the backboard B is parallel to the backboard A, the mother board connector is connected with the daughter board connector in an inserted mode, the mother board connector is electrically connected with the daughter board connector, the mother board connector and the daughter board connector can be detached independently or along with a back panel, the structure is firm, and maintenance is convenient. The invention furtherdiscloses an ATR case, which comprises a case bottom plate, a case panel, a case back plate, a case right plate, a case left plate, a case top plate, a case internal board, a backboard A and a backboard B, wherein rigid connection can guarantee stability of signals and a system.