383 results about "Plasma flow" patented technology

The invention is embodied in a plasma flow device or reactor having a housing that contains conductive electrodes with openings to allow gas to flow through or around them, where one or more of the electrodes are powered by an RF source and one or more are grounded, and a substrate or work piece is placed in the gas flow downstream of the electrodes, such that said substrate or work piece is substantially uniformly contacted across a large surface area with the reactive gases emanating therefrom. The invention is also embodied in a plasma flow device or reactor having a housing that contains conductive electrodes with openings to allow gas to flow through or around them, where one or more of the electrodes are powered by an RF source and one or more are grounded, and one of the grounded electrodes contains a means of mixing in other chemical precursors to combine with the plasma stream, and a substrate or work piece placed in the gas flow downstream of the electrodes, such that said substrate or work piece is contacted by the reactive gases emanating therefrom. In one embodiment, the plasma flow device removes organic materials from a substrate or work piece, and is a stripping or cleaning device. In another embodiment, the plasma flow device kills biological microorganisms on a substrate or work piece, and is a sterilization device. In another embodiment, the plasma flow device activates the surface of a substrate or work piece, and is a surface activation device. In another embodiment, the plasma flow device etches materials from a substrate or work piece, and is a plasma etcher. In another embodiment, the plasma flow device deposits thin films onto a substrate or work piece, and is a plasma-enhanced chemical vapor deposition device or reactor.

The present invention provides a standard interface for providing mechanical location, mechanical orientation, electrical connections, and water chamber seals for the exchange of a variety of plasma forming nozzles each associated with a specific plasma plume characteristic. The flexibility of the nozzle attachment is improved over prior designs by providing a standard exterior nozzle configuration and nozzle clamping assembly on the plasma gun so that multiple nozzles configurations (giving different plasma flow properties) can easily be used with the same devices. The joining of the nozzle to the receptacle forms a channel for cooling liquid to flow from the plasma gun through the nozzle to a return path in the plasma gun and creates an electrical contact between the plasma gun and the nozzle.