30results about How to "Sufficient binding force" patented technology

The invention discloses a device for concrete penetration field measurement and a method for concrete penetration field measurement, wherein the field measurement device comprises an outer neck, an inner neck and a sealing ring; the outer neck is fitted and closely connected with the inner structure of the inner neck, so as to form a measurement device body; the outer neck and the inner neck are equally divided into two symmetrical parts and tightly connected through the bolt; the handle is located on the outer neck; priming wires are evenly distributed on the surfaces of the outer neck and the inner neck; the sealing ring is located at the inside diameter place of the inside neck, and tightly fit with a water filling opening. On the basis of guaranteeing good tightness effect, the sealing device provides enough combining force to connect and fix the water filling opening with the wall body. By using the technology, the concrete penetration field measurement can be completed.

The invention provides a VCM elastic sheet and a processing method thereof. The method comprises the steps of carrying out the first copper etching and glue etching on the surface of a copper layer ofa VCM elastic sheet body, and forming a plurality of blind holes; attaching dry films to the two sides of the VCM elastic sheet body, and opening the dry films at the blind holes after exposure and development; attaching dry films to the two faces of the blind hole for the second time after copper electroplating is conducted in the blind hole, and then carrying out second-time dry film exposure development, copper etching and film stripping; and carrying out exposure and development after dry films are attached to the two sides for the third time, exposing a bonding pad position to be platedwith gold and gold-plated clamping points, and removing the dry films on the surface after gold is plated on the bonding pad position to obtain the VCM elastic sheet. According to the invention, copper etching is carried out on the surface of the copper layer, an initial circuit comprising the plurality of blind holes is formed, and then a copper layer and a steel sheet are conducted in a manner of electroplating copper in the blind holes, and the bonding pad position to be plated with gold and the gold-plated clamping points are exposed on the surface of the copper layer in a manner of exposing and developing a negative film, so that more electronic elements can be mounted on the bonding pad position to realize more functions.

The present invention can provide a strap for compressing outer surfaces of a battery module to prevent deformation of the battery module caused by battery cell swelling, the strap for compressing battery module which has a closed loop structure larger than the outer circumference of the battery module and a welded portion provided in a folded form at at least a portion in the closed loop such that the folded portions overlap with each other when a preset pressure is applied.

The invention belongs to the technical field of piezoelectric sensing materials, and in particular relates to a flexible integrated piezoelectric sensing material and a preparation method thereof. The present invention adopts electrospinning method to prepare PVDF, PVDF-TrFE macromolecule flexible film, adopts carbon nanotube, PEDOT:PSS to carry out composite, carries out room temperature lamination with PVDF electrospinning film to obtain the piezoelectric sensor with excellent mechanical and electrical properties composite material. The preparation method of the present invention is simple and easy, the parameters are adjustable, no adhesive is used in the compounding and laminating process, no other invalid components are introduced, the material responds sensitively, the piezoelectric current is low, it is safe and harmless to the human body, and it is completely adaptable to the human body. Requirements for wearable sensor devices.

The invention discloses a device for concrete penetration field measurement and a method for concrete penetration field measurement, wherein the field measurement device comprises an outer neck, an inner neck and a sealing ring; the outer neck is fitted and closely connected with the inner structure of the inner neck, so as to form a measurement device body; the outer neck and the inner neck are equally divided into two symmetrical parts and tightly connected through the bolt; the handle is located on the outer neck; priming wires are evenly distributed on the surfaces of the outer neck and the inner neck; the sealing ring is located at the inside diameter place of the inside neck, and tightly fit with a water filling opening. On the basis of guaranteeing good tightness effect, the sealing device provides enough combining force to connect and fix the water filling opening with the wall body. By using the technology, the concrete penetration field measurement can be completed.

An anisotropic conductive film and a semiconductor device using the same are disclosed. The anisotropic conductive film has a three-layer structure including a first insulating layer, a conductive layer, and a second insulating layer, wherein the stress-strain curve of the anisotropic conductive film has a value greater than 0 and less than or equal to 0.2 kg as expressed by Equation 1 below The slope A of force / (mm2 %), and the maximum stress (Smax) at or above 0.4 kgf / mm2: slope (A, unit: kgf / (mm2%)) =(1 / 2Smax‑S0) / x‑‑‑(1), where Smax: maximum stress, x: strain (%) at half (1 / 2) of the maximum stress, S0: stress at 0 strain. The anisotropic conductive film of the present invention has improved pre-compression properties, and can promote main compression by adjusting the slope A and the maximum stress so that the initial properties of the anisotropic conductive film before curing are controlled.

The invention discloses an improved APMP pulping method. In the method, different pulp grinding processes are used for obtaining an APMP with a high ionization degree, and the high rigidity of the APMP is used for providing a loose and thick framework for prepared paper; and an APMP with a low ionization degree is used for providing sufficient bonding force for the framework to ensure that the strength and the bulk of APMP prepared paper are combined organically so as to realize the opposition of weakening the strength and the bulk of an APMP prepared pulp. By comparing the APMP prepared pulpwith a chemical-mechanical pulp with the same ionization degree produced under the original process production condition, the APMP prepared pulp can have a higher bulk while keeping a certain strength, or have a higher strength while keeping a certain bulk, so the quality of produced paper is improved, or the mixing ratio of the APMP in the process of producing paper is increased to reduce the paper production cost.

An aluminized steel fastener type scaffold steel pipe comprises a scaffold steel pipe body. The scaffold steel pipe body is sequentially divided into a base body layer, an iron-and-aluminum alloy layer and an aluminum layer from inside to outside, the thickness of the iron-and-aluminum alloy layer is 14-29 micrometers, and the thickness of the pure aluminum layer is 15-100 micrometers. A preparation method of the aluminized steel fastener type scaffold steel pipe includes the following steps of using a common seamless or seamed steep pipe as a workpiece, drying and unoiling the workpiece, acid cleaning and removing rust, washing, activating the surface, promoting permeation, drying, and rapidly aluminizing in an induction mode. The scaffold steel pipe with the aluminized surface is acquired through the steps. The mechanical performance of the aluminized steel fastener type scaffold steel pipe can be guaranteed, the excellent corrosion resistant performance is possessed, the service life is long, and using cost of the scaffold steep pipe is reduced.

The invention discloses a hot pressing forming method and a mold for preparing a three-layer composite plastic sample, belonging to the technical field of measurement and research of space charge distribution of insulating materials. The invention aims to solve the problem that the thickness of the three-layer material is not uniform and the edges are not rounded, resulting in inaccurate measurement results when a common plate mold and a plate vulcanizer are used to make a three-layer composite sample. The invention adopts the shielding layer mold to prepare the semiconductive shielding layer, the insulating layer mold to prepare the insulating layer, and the composite molding mold to hot-press the two semiconductive shielding layers and the insulating layer to obtain a three-layer composite plastic sample. The three-layer structure of the composite plastic sample of the present invention has sufficient bonding force, and the edges embedded in the sample on both sides are smooth and rounded, which can improve the accuracy of space charge distribution measurement.

The invention relates to the technical field of papermaking, in particular to a production system for environmentally friendly containerboard paper, comprising a forming mechanism, the forming mechanism comprises a forming wire, the forming wire is connected end to end, the forming wire is connected with a driving mechanism, and the driving mechanism is used to drive the forming wire to rotate, Above the forming wire, from the feeding end to the discharging end of the forming wire, a bottom pulp headbox, a core pulp headbox and a face pulp headbox are sequentially installed. A dewatering channel for dewatering the pulp is formed between them. The bottom pulp headbox, the core pulp headbox and the face pulp headbox are all connected with a spray pipe at the bottom. A blower is installed between the bottom pulp headbox and the core pulp headbox. A blowing mechanism is also installed between the core pulp headbox and the face pulp headbox. The invention solves the problem of insufficient bonding force among the bottom paper, core paper and face paper of the boxboard paper in the prior art.

The patent of the present invention relates to a method for the internalization of lead-acid batteries for plate traction, including the following steps: 1. Prepare a sulfuric acid solution with a certain temperature and density; 2. Place the battery in a water bath and cool it with tap water; 3. The sulfuric acid solution is left to stand for a period of time, and starts charging when the temperature is lower than a certain temperature; 4. Internalization process. The internalization process is divided into six stages, including four stages of charging and two stages of standing still and adding water. The invention has the advantages of greatly shortening the production cycle, simplifying the production process, improving the initial capacity, high-rate discharge and cycle durability of the storage battery, and having good environmental effects during the production and operation of the storage battery.

An electrical device having PTC conductive polymer is made by combining electrodes, in which electroless nickel plating is formed on an electrolytic copper foil, with PTC conductive polymer. The electrodes have electroless-plated nickel layers at both sides of an electrolytic copper foil and the PTC conductive polymer is welded between the electrodes in a sandwich type.Because the electroless-plated nickel of the electrical device has even thickness, the electrical device gives improved PTC characteristics and good chemical and mechanical binding capacity between the electrodes and the PTC conductive polymer.

The invention discloses a method for improving the interface bonding strength of a titanium / aluminum composite plate, which belongs to the technical field of metal material surface engineering. The method comprises the following steps: putting the pretreated metal titanium plate and the aluminum plate on the sample stage of the vacuum plasma activation equipment; Negative bias, turn on the ion sputtering source, the argon gas is excited to form argon ions to bombard the surface of the metal titanium plate and aluminum plate, and perform the first etching treatment; then turn off the argon gas, and pass nitrogen gas into the vacuum chamber to form nitrogen ions to bombard the metal The surface of the titanium plate and the aluminum plate is subjected to a second activation treatment; finally, the two metal plates are taken out for composite rolling with flat rolls at room temperature. Both the metal titanium plate and the aluminum plate treated by the present invention have a fresh and clean activated surface, show good adhesion and bonding force, significantly improve the shear strength of the titanium / aluminum composite plate, and the rolled composite plate has a relatively high High interfacial bonding strength.

The invention discloses a glass slide of a biochip and a manufacture method thereof. The technical proposal is as follows: the glass slide of the biochip consists of the following ingredients by weight percentage: 44.7 percent to 50.9 percent of quartz sand, 28.9 percent to 46.25 percent of sodium carbonate, 0.1 percent to 12 percent of MnO2, 1 percent to 5 percent of borax, 0.1 percent to 10 percent of NaNO3, 0.1 percent to 2 percent of carbon powder, 0.1 percent to 2 percent of arsenic trioxide and 0.1 percent to 2 percent of K2CO3. The manufacture method of the glass slide of the biochip comprises the following steps: (1) under the condition of room temperature, the quartz sand and the sodium carbonate are mixed to be uniform firstly; (2) MnO2, the borax, NaNO3, the carbon powder, the arsenic trioxide and K2CO3 are added and stirred to be uniform; (3) the obtained mixture is thrown into a furnace, is heated, melted into slurry and stirred continuously for 1 hour; (4) the temperatureis fast cooled to 25 to 40 DEG C; (5) slicing is carried out; and (6) polishing is carried out and then the glass slide of the biochip is formed. The film base of the background value of the glass slide is superior to the film base of the common glass slide obviously, and as to the signal strength, the average signal strength of the glass slide is superior to the common glass slide.

The invention provides a preparation method for uniformly embedding diamond particles onto the surface of a Ni-P coating and belongs to the technical field of surface modification. According to the preparation method, a spring steel washer serves as a base body, Ni-P-micrometer diamond chemical composite plating treatment is conducted, and then thermal treatment at 120 DEG C-200 DEG C is conducted. According to the chemical composite plating, the surface of the spring steel washer base body is pre-plated with a layer of Ni-P coating firstly; then Ni-P-micrometer diamond composite plating is conducted on the pre-coating, and diamond is deposited on the coating; and finally the plating of the Ni-P coating is conducted continuously, the diamond embedded into the coating is deeply buried. In the final coating, the diamond is embedded into the Ni-P coating by 1 / 2-2 / 3 of the grain size, the rest of the diamond is exposed out of the surface of the coating, and the diamond particles are uniformly distributed on the surface of the coating. A horizontal autoroatation rotator hanging piece manner is adopted, the problem that the diamond is difficult to uniformly distribute due to the gravity influence is overcome, the purpose that the two surfaces of the spring steel washer are uniformly plated with the diamond particles at the same time is achieved, the plating time is shortened, and meanwhile the phenomenon that the diamond particles on different surfaces in different positions of the coating are nonuniformly distributed is eliminated.

The invention provides a VCM shrapnel and a processing method thereof. The method includes: performing first copper etching and glue etching on the surface of the copper layer of the VCM shrapnel body to form several blind holes; attaching dry film on both sides of the VCM shrapnel body, exposing After developing, open the dry film at the position of the blind hole; after electroplating copper in the blind hole, attach the dry film on both sides for the second time, and then carry out the second dry film exposure and development, copper etching, and remove the film; the third time is attached on both sides After drying the film, exposure and development are carried out to expose the pad position and the gold-plated pinch point to be plated. After the pad position is plated with gold, the surface dry film is removed to obtain a VCM shrapnel. In the present application, copper etching is performed on the surface of the copper layer to form an initial circuit including several blind holes, and then the copper layer and the steel sheet are electrically connected by electroplating copper in the blind holes, and the bottom sheet is passed on the surface of the copper layer. The way of exposure and development exposes the pad positions to be gold-plated and the gold-plated pinch points, and more electronic components can be mounted on the pad positions to achieve more functions.