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Method for manufacturing conductive pattern by selectively activating insulating material through laser and chemical combination

A technology of chemical bonding and conductive pattern, applied in conductive pattern formation, printed circuit manufacturing, electrical components, etc., can solve the problems of low cost performance of lasers, low photon energy, increased difficulty, etc., and achieve good control of plating effect and processing range. Large, good processing consistency

Pending Publication Date: 2021-10-29
德中(天津)技术发展股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The carbon dioxide laser has a wavelength of about 10.6 μm, which is in the mid-infrared band of the infrared band, which is exactly the same as the stretching and rotational vibration frequency of plastic macromolecules, and is easily absorbed by plastics, but the incident depth reaches hundreds of microns, and the photon energy is low, about 0.12 Electron volts, large thermal effect, low cost performance of lasers
It can be seen that the method of combining laser processing and plastic electroless plating to manufacture 3D-MID is affected by multiple factors, each of which has various inherent functions and limitations, which increases the difficulty of implementing this technology in engineering

Method used

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  • Method for manufacturing conductive pattern by selectively activating insulating material through laser and chemical combination
  • Method for manufacturing conductive pattern by selectively activating insulating material through laser and chemical combination
  • Method for manufacturing conductive pattern by selectively activating insulating material through laser and chemical combination

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0125] (1) Determine the upper limit of chemical treatment parameters of ABS material and the lower limit of laser processing intensity.

[0126]Starting from the process conditions of ABS plastic electroless plating, first confirm the chemical treatment steps of one of the processes: degreasing - pre-dipping - activation - debonding - electroless copper deposition. In this example:

[0127] ①It is preferable to use an alkaline degreaser for degreasing. The solution composition is: sodium carbonate 15g / L, sodium phosphate 30g / L, sodium hydroxide 50g / L, surfactant 2g / L, temperature 50~80℃, time 5~ 10min.

[0128] ②Pre-impregnation-activation-debonding, wherein the pre-impregnated solution composition is: hydrochloric acid 200ml / L, room temperature, time 1~3min; the activated solution composition is: palladium chloride 0.05g / L, stannous chloride 10g / L , hydrochloric acid 200ml / L, sodium chloride 50g / L, temperature 25~35℃, time 1~5min; the solution composition of degumming is: ...

Embodiment 2

[0157] (1) Determine the upper limit of chemical treatment parameters of ABS+40%PC material and the lower limit of laser processing intensity.

[0158] The chemical properties of ABS+PC and ABS materials are similar, and the plastic electroless plating process is similar to the process steps of ABS, specifically: degreasing-chemical roughening-prepreg-activation-debonding-chemical copper precipitation. In an example:

[0159] ①It is preferable to use an alkaline degreaser for degreasing. The solution composition is: sodium carbonate 15g / L, sodium phosphate 30g / L, sodium hydroxide 50g / L, surfactant 2g / L, temperature 50~80℃, time 5~ 10min.

[0160] ②The composition of the chemical roughening solution is: sulfuric acid 220ml / L, temperature 65~80℃, time 10~30min.

[0161] ③Pre-soak-activation-debonding, wherein the pre-soak solution composition is: hydrochloric acid 200ml / L, room temperature, time 1~3min; the activated solution composition is: palladium chloride 0.05g / L, stannou...

Embodiment 3

[0188] (1) Determine the upper limit of the chemical processing parameters of the LCP material and the lower limit of the laser processing intensity.

[0189] Starting from the process conditions of ABS plastic electroless plating, first confirm the chemical treatment steps of one of the processes: degreasing - pre-dipping - activation - debonding - electroless copper deposition. In this example:

[0190] ①It is preferable to use an alkaline degreaser for degreasing. The solution composition is: sodium carbonate 15g / L, sodium phosphate 30g / L, sodium hydroxide 50g / L, surfactant 2g / L, temperature 50~80℃, time 5~ 10min.

[0191] ②Pre-impregnation-activation-debonding, wherein the pre-impregnated solution composition is: hydrochloric acid 200ml / L, room temperature, time 1~3min; the activated solution composition is: palladium chloride 0.05g / L, stannous chloride 10g / L , hydrochloric acid 200ml / L, sodium chloride 50g / L, temperature 25~35℃, time 1~5min; the solution composition of ...

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Abstract

The invention relates to a method for manufacturing a conductive pattern by selectively activating an insulating material through combination of laser and chemistry, and the method comprises the following steps: finding out upper and lower limits of chemical and laser processing intensity, and determining processing parameters within the limits; acquiring the corresponding relation between the beam waist diameter of the focused light beam and the size of the circuit pattern through actual measurement, taking the beam waist diameter of the light beam as a variable, taking energy and power on the unit area as constant quantities, and generating laser machining parameters and machining data for the machining task; changing laser parameters on line, carrying out the laser processing and chemical treatment, and changing the surface performance and morphology of the material. According to the method, the effects of chemical action and laser action are controlled and accumulated, and only the area which is subjected to chemical treatment and laser processing at the same time has the activity needed by chemical plating and the surface state needed by electroplating. The quality is reliable and the speed is fast; the method is environment-friendly, clear in process route, specific in parameters and indexes and controllable in process. The method is suitable for manufacturing circuits on planar and three-dimensional plastic, ceramic and glass entities.

Description

technical field [0001] The invention belongs to the technical field of circuit manufacturing, and relates to the manufacturing technology of 3D-MID devices, in particular to a method and equipment for selectively activating insulating materials by combining laser and chemically to manufacture conductive patterns. Background technique [0002] 3D-MID, namely three-dimensional molded interconnect device (Three Dimensional Molded Interconnect Device), is to manufacture conductive patterns on the insulating surface of the injection-molded workpiece to form a set of functions such as support and protection of the plastic shell, as well as a combination of mechanical entities and electrical conductors. An electronic device with functions such as shielding, antenna, etc. produced by the combination of graphics. Because 3D-MID has both mechanical and electrical functions, it is also known as Three Dimensional Mechatronic Integrated Device. [0003] In recent years, the wide applica...

Claims

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Application Information

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IPC IPC(8): H05K3/10
CPCH05K3/105H05K2203/107
Inventor 胡宏宇王恒亮
Owner 德中(天津)技术发展股份有限公司
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