41 results about "Molded interconnect device" patented technology

A system for connecting electrical devices to one another is provided. This system includes a horizontal or non-horizontal substrate and an anchor connected to or formed integrally with the substrate. The anchor is either a raised structure or a recessed structure, and further includes at least one retention member formed integrally with the anchor. At least one electronic component is mounted within the anchor and the at least one retention member secures the component to the substrate. At least one electrical trace is disposed on the substrate and the at least one electrical trace extends into the anchor, contacts the at least one electronic component, and forms an electrical connection between the substrate and the at least one electronic component.

In a pressure sensor including a pressure detecting element in an intermediate portion or at a deep side of a through hole formed in a protrusion, a body portion (a base portion and the protrusion) is made of ceramic or an insulative resin material and molded into a predetermined shape, and the pressure sensor is constituted as a molded interconnect device in which a conductive pattern is formed on a surface thereof. Accordingly, a smaller pressure sensor can be obtained.

A molded interconnect device (MID) having a multilayer circuit of a reduced thickness, in which a layer-to-layer connection(s) is formed with high reliability, is provided as a multilayer circuit board. The multilayer circuit board comprises a substrate having a first surface and a second surface extending from an end of the first surface at a required angle relative to the first surface, and the multilayer circuit formed on the first surface and composed of a plurality of circuit layers. Each of the circuit layers is provided with a conductive layer having a required circuit pattern and an insulation layer formed on the conductive layer by film formation. The layer-to-layer connection of the multilayer circuit is made through a second conductive layer formed on the second surface of the substrate.

The present invention provides a method of making a molded interconnect device. The method includes the steps of: injection molding a plastic body having thereon at least one patterned circuit trench structure; and filling a conductive material into the patterned circuit trench structure thereby forming a circuit trace on the plastic body.

Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.

Plug-socket connector apparatus for optical fiber termination comprises first and second plugs and a socket. The first and second plugs are both single ferrule plugs. The socket is a molded interconnect device and a plug holder, and includes terminals located on the bottom face of the socket, first and second bores located at one side of the socket, and first and second retainers. The retainers retain latches formed in the plugs so as to prevent the plugs from falling out of the bores and to restrict rotation angles of the plugs around the axes within predetermined rotation angle ranges, when the plugs is plugged in the bores.

An optical scanning endoscope with an optical fiber, and a fiber driving unit with a plurality of actuators which bend side surfaces of the optical fiber by applying a pressing force. A mounting member is a substantially cylindrical molded interconnect device (MID) component which supports the fiber driving unit. A control circuit supplies driving signals to each of the actuators to control the bending amount and direction of the optical fiber. A wiring member electrically connects wiring patterns on the mounting member with the control circuit. The mounting member has a planar surface section at one proximal-end-surface side of the cylindrical outer-peripheral surface. The wiring patterns include at least first patterns having one end portion disposed on the planar surface section to form soldering lands. The other end portions are electrically connected to the actuators on the proximal-end surface of the mounting member. The wiring member is connected to the soldering lands.

A molded interconnect device (MID) with a thermal conductive property and a method for production thereof are disclosed. A thermal conductive element is set in a support element to improve the thermal conductivity of the support element, and the support element is a non-conductive support or a metallizable support. A metallization layer is formed on a surface of the support element. If a heat source is set on the metallization layer, heat produced by the heat source will pass out from the metallization layer or the support element with the thermal conductivity material element.

An optical receptacle with low transmission loss, which is connectable with an optical plug, is provided. The optical receptacle includes a photoelectric conversion module having the capability of making photoelectric conversion between light signals and electrical signals, and a module housing. The photoelectric conversion module is a molded interconnect device (MID), which is provided with a module body having a post, an optical device mounted on the post, and an electrical circuit mounted on the module body. The module housing has a tubular projection, into which an end of the optical fiber supported by the optical plug can be inserted. When the optical plug is connected with an optical receptacle, the end of the optical fiber is positioned in the tubular projection so as to be in a closely opposing relation to the optical device mounted on the post.

This invention relates to products of aqueous and other chemical synthetic routes for encapsulation of a core material with an inorganic shell and finished compositions of a core-shell particulate material for application in thermoplastic, thermoset, and coatings resins prior to compounding or application or subsequent thermal processing steps. Disclosed is a composition of particles containing a shell of inorganic oxides or mixed-metal inorganic oxides and a core material of complex inorganic colored pigment, laser direct structuring additives, laser marking, or other beneficial metal oxides, metal compounds, or mixed-metal oxide materials, wherein the shell material is comprised of any single oxide or combination of oxides is taught. Preferred elements of composition for the shell are oxides and silicates of B, Ni, Zn, Al, Zr, Si, Sn, Bi, W, Mo, Cr, Mg, Mn, Ce, Ti, and Ba (or mixtures thereof). Applications may include, but are not limited to, coatings or plastic articles or materials for molded interconnect devices, durable goods, housings, assemblies, devices, and articles that are to be exposed to additional thermal processing. The resulting core-shell materials function in plastic and coatings formulations by minimizing or eliminating detrimental interactions with the resins and metal containing additives resulting in loss of mechanical properties.

Switches include electrical conductors for the transmission of switch signals. In some embodiments the conductor may include a flexible printed circuit. Alternatively, the conductor may be formed of a molded-interconnect device (MID), wherein portions of the switch include at least one electrical line / track.

Switches include electrical conductors for the transmission of switch signals. In some embodiments the conductor may include a flexible printed circuit. Alternatively, the conductor may be formed of a molded-interconnect device (MID), wherein portions of the switch include at least one electrical line / track.

Provided is a lens driving device which includes: a lens holder including a coil; a frame for receiving the lens holder; a driving circuit board disposed below the frame; a plurality of first conductive elastic bodies disposed in a manner to keep the lens holder moving in a Z-axis direction; and a plurality of second conductive elastic bodies disposed in a manner to keep the frame moving in a direction perpendicular to the Z-axis direction. The lens driving device further comprises a plurality of electrical contact-oriented Z-axis position sensor. The Z-axis position sensor senses the motion of the lens holder in the Z-axis direction. An electronic circuit between a portion of the plurality of electrical contacts and the coil of the lens holder comprises a Molded Interconnect Device and a portion of the first conductive elastic bodies. The Molded Interconnect Device is disposed on the frame.

The thermosetting resin composition for LDS of the invention includes a thermosetting resin, an inorganic filler, a non-conductive metal compound that forms a metal nucleus upon irradiation with active energy rays, and a coupling agent, in which the non-conductive metal compound includes one or more selected from the group consisting of a spinel-type metal oxide, a metal oxide having two or more transition metal elements in groups adjacent to each other, the groups being selected from groups 3 to 12 of the periodic table, and a tin-containing oxide, and the coupling agent includes one or more selected from the group consisting of mercaptosilane, aminosilane, and epoxysilane.