Pressure sensor

Abstract

In a pressure sensor 1 including a pressure detecting element 4 in an intermediate portion or at a deep side of a through hole 5 formed in a protrusion 3, a body portion (a base portion 2 and the protrusion 3) is made of ceramic or an insulative resin material and molded into a predetermined shape, and the pressure sensor is constituted as a molded interconnect device in which a conductive pattern 6 is formed on a surface thereof Accordingly, a smaller pressure sensor can be obtained.

Description

technical field [0001] The present invention relates to a pressure sensor for detecting fluid pressure. Background technique [0002] A conventional known pressure sensor having a sensor chip closes one end of a through hole formed in a package body as a pressure introduction hole (for example, Patent Document 1). [0003] According to the pressure sensor disclosed in Patent Document 1, the sensor chip is mounted on the resin package body through the glass base by wire bonding. In order to ensure the required detection accuracy, the glass base has the function of strengthening the package body to ensure the required detection accuracy of the sensor chip. [0004] However, the conventional pressure sensor has a problem that the size and weight increase accordingly because it includes a glass base. [0005] Since the sensor chip is mounted by wire bonding, there is a problem of complicating the mounting operation, and it becomes necessary to form a space for performing the w...

AI Technical Summary

Problems solved by technology

[0004] However, the conventional pressure sensor has such a problem that because it includes a glass base, the size and weight increase accordingly

[0005] Since the sensor chip is mounted by wire bonding, there is a problem of complicating the mounting operation, and it becomes necessary to form a space for performing the wire bonding, so that the size of the pressure sensor is increased.

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