The present invention discloses an ultrathin
palladium plating and
gold plating process for a lead
wire frame. The process comprises the following steps: carrying out
electrolysis degreasing, carrying out an activation treatment on a lead
wire frame substrate, carrying out electrodeposition of a
nickel plating layer, carrying out an activation treatment on the
nickel layer, carrying out electrodeposition of a
palladium plating
thin layer, and carrying out high-frequency pulse electrodeposition of a
gold plating thin layer, wherein a
palladium-plated lead
wire frame substrate is placed into a
gold plating liquid to carry out electrodeposition for 10-20 s, cleaned with gold
recovery water, dried and is subjected to gold protection to obtain the finished product. According to the present invention, under the premise of ensurence of passing of the test trial, the ultrathin gold-palladium plating layer is formed, wherein a thickness of the electroplated palladium layer is 0.02-0.1 mum, and is far lower than a thickness of 2-5 mum of the electroplated palladium layer in the existing process, and the electroplated
gold layer is 0.003-0.01 mum, and is far lower than a thickness of 0.3-1.2 mum of the electroplated
gold layer in the existing process, such that excellent performances of the original palladium plating layer and the original gold plating layer are ensured, gold consumption and palladium consumption are reduced, use of noble metals is substantially reduced,
metal utilization rate is effectively improved, and cost is saved.