30results about How to "High positional" patented technology

A clamping device comprising: a distal end side stationary blocks which are provided on a side of a distal end of a workpiece retaining base, and in which stationary tilt faces tilting downwardly to a central direction of the workpiece are formed; a proximal end side stationary blocks which are provided on a side of a proximal end of the workpiece retaining base, and in which upward stationary tilt faces tilting downward toward the central direction of the workpiece are formed; and a movable block which is arranged at a position proximal to the proximal end side stationary blocks, and is capable of advancing to or retracting from a side of the distal end side stationary blocks with the workpiece being held between the blocks, and in which a downward movable tilt face tilting upwardly toward the central direction of the workpiece is formed.

A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.

Provided is a method for manufacturing a translucent rigid substrate laminate which can improve a thickness precision while decreasing the risk of fractures. In the method for manufacturing a translucent rigid substrate laminate according to the present invention, translucent rigid substrates are placed opposite to each other such that bonding surfaces thereof are parallel to each other, both rigid substrates are brought toward each other while being kept parallel, the both rigid substrates are preliminarily bonded using a photo-curable fixing agent, the bonded translucent rigid substrates are roll-pressed, and the fixing agent is then cured.

A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-layered wiring board, and pressing force is imparted to the frame and a pressing piece at a central portion by a plurality of guide pins having spring property so as to tilt finely.

A method for manufacturing an electronic element wafer module is provided, the method comprising: a protective resin film forming step of forming a protective resin film on only light openings of the plurality of wafer-shaped optical elements; a light shielding film forming step of filming a light shielding film on an area except for the light openings or an entire area including the light openings; and an optical aperture forming step of removing the protective resin film, or removing the protective resin film and a light shielding film material on the protective resin film, to form an optical aperture structure by the light shielding film at the light openings.

In a mask assembly and a method of fabricating the same, when the mask assembly is fabricated by tensile welding a pattern mask to a mask frame, a tensile welding portion of the pattern mask welded to the mask frame is structurally changed. Thus, the pattern mask can be easily welded to the mask frame, and patterns of the pattern mask can be precisely aligned, thereby minimizing stain failure rate due to the mask assembly. The mask assembly includes: a mask frame including an opening and a support; and a pattern mask including a pattern portion having a plurality of patterns arranged in a matrix and a plurality of tensile welding portions extending from the pattern portion in a first direction and spaced apart from each other in a second direction perpendicular to the first direction. The method includes: providing a mask frame, a support, and a pattern mask as described above; disposing the pattern mask and the mask frame in a unique manner; combining the pattern mask with the mask frame by welding; measuring an aligned state of the pattern arranged in the first direction of the pattern mask; and welding a tensile welding portion using a secondary welding process according to an aligned state.

A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-layered wiring board, and pressing force is imparted to the frame and a pressing piece at a central portion by a plurality of guide pins having spring property so as to tilt finely.

A liquid ejecting head includes: a head body that includes a plurality of nozzles and ejects liquid drops from the nozzles; a frame that supports the head body; a fixation plate by means of which the head body is fixed to the frame; and a holding plate that applies holding pressure to the fixation plate toward the frame so that the fixation plate is fixed to the frame.

A method of producing a piezoeIectric resonator includes the steps of forming first to third internal electrodes by printing an electrically conductive paste onto a green sheet, punching out portions of the green sheet having the first to third internal electrodes formed thereon, so that at least three types of green sheets are punched out with a location of the internal electrode serving as a reference location, in which the first sheet is punched out by shifting a punching location by a first shift amount in a first direction with respect to the reference location, the second sheet is punched out by shifting a punching location by the first shift amount in a direction opposite to the first direction, and the third sheet is punched out at the reference location, forming a layered body by stacking the punched out green sheets, and forming a unit by cutting the layered body.

A micro-protruding structure which has a high positional precision and an angular (directional) precision, which is made of a linear material having a large aspect ratio, and which is provided for an analyzer, a display device, a machining device, a measuring device and an observation device. The micro-protruding structure is fabricated by growing a linear material of a carbon nano-tube from the bottom of the hole structure perforated by a focused ion beam. This permits a direction from the bottom of the hole structure to the opening to become nearly in alignment with the direction of the linear material that protrudes from the hole structure.

A fixing plate (40) is provided with through holes (45) for reducing the rigidity of the fixing plate (40) between a latch hole (41) and boss parts (42), the through holes being disposed between the latch hole (41) and the boss parts (42) and radially outward from the outer circumferential surface of an outer ring (31).

A production of voids between substrates is prevented when the substrates are bonded together, and the substrates are bonded together at a high positional precision while suppressing a strain. A method for bonding a first substrate and a second substrate includes a step of performing hydrophilization treatment to cause water or an OH containing substance to adhere to bonding surface of the first substrate and the bonding surface of the second substrate, a step of disposing the first substrate and the second substrate with the respective bonding surfaces facing each other, and bowing the first substrate in such a way that a central portion of the bonding surface protrudes toward the second substrate side relative to an outer circumferential portion of the bonding surface, a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate at the respective central portions, and a step of abutting the bonding surface of the first substrate with the bonding surface of the second substrate across the entirety of the bonding surfaces, decreasing a distance between the outer circumferential portion of the first substrate and an outer circumferential portion of the second substrate with the respective central portions abutting each other at a pressure that maintains a non-bonded condition.

A fixing plate (40) is provided with through holes (45) for reducing the rigidity of the fixing plate (40) between a latch hole (41) and boss parts (42), the through holes being disposed between the latch hole (41) and the boss parts (42) and radially outward from the outer circumferential surface of an outer ring (31).

The present invention relates to a high-speed particle generating method and so on for generating high-speed particles from a high-speed particle generating target by condensing a pulsed laser beam to a micro-spot on the surface of a high-speed particle generating target. The high-speed particle generating method is a method that generates high-speed particles by condensing a pulsed laser beam generated from a pulsed laser beam generator through an irradiation optical system at a predetermined condensing point, and irradiating the pulsed laser beam to the high-speed particle generating target that is set at the predetermined condensing point, the method including a first step of preparing a reference data, a second step of measuring the wave front of the pulsed laser beam, and a third step of compensating the wave front of the pulsed laser beam based on the reference data.

Provided is a method for manufacturing a translucent rigid substrate laminate which can improve a thickness precision while decreasing the risk of fractures. In the method for manufacturing a translucent rigid substrate laminate according to the present invention, translucent rigid substrates are placed opposite to each other such that bonding surfaces thereof are parallel to each other, both rigid substrates are brought toward each other while being kept parallel, the both rigid substrates are preliminarily bonded using a photo-curable fixing agent, the bonded translucent rigid substrates are roll-pressed, and the fixing agent is then cured.

A driver includes a piezoelectric sheet, a fixing frame, a moving frame, and a control circuit. The piezoelectric sheet includes a first piezoelectric body portion which bends in a first direction, a second piezoelectric body portion which bends in a second direction that intersects at right angles with the first direction, and a connection portion which connects the first and second piezoelectric body portions. The fixing frame is fixed to the connection portion. The moving frame is supported on the first and second piezoelectric body portions. The control circuit applies voltage signals to the first and second piezoelectric body portions to bend the first and second piezoelectric body portions and which moves the moving frame in one of the first direction and the second direction or in a composite direction of the first direction and the second direction.

An atomic oscillator includes an atom cell that accommodates an alkali metal atom therein, a container that houses the atom cell, a substrate on which the container is disposed, and a thermally insulating mount that is fixed to the substrate and positions the container relative to the substrate.

A light amount control mechanism for a vehicle headlamp can maintain high positional precision of a movable shade in its rotation axis direction to suppress variation in light distribution while allowing stable rotation of the movable shade. The light amount control mechanism includes a movable shade configured to be rotatably supported by a housing and selectively pivots to a first position or a second position to switch a shielding amount of light emitted from a light source, and an actuator configured to drive the movable shade. The light amount control mechanism for a vehicle headlamp may further include a stopper configured to position and hold the movable shade at the first position and the second position, the stopper being constituted by a V-shaped convex portion formed on any one of the movable shade and the housing and a V-groove-shaped concave portion formed on the other thereof as a pair.

A light amount control mechanism for a vehicle headlamp can maintain high positional precision of a movable shade in its rotation axis direction to suppress variation in light distribution while allowing stable rotation of the movable shade. The light amount control mechanism includes a movable shade configured to be rotatably supported by a housing and selectively pivots to a first position or a second position to switch a shielding amount of light emitted from a light source, and an actuator configured to drive the movable shade. The light amount control mechanism for a vehicle headlamp may further include a stopper configured to position and hold the movable shade at the first position and the second position, the stopper being constituted by a V-shaped convex portion formed on any one of the movable shade and the housing and a V-groove-shaped concave portion formed on the other thereof as a pair.

An object of the present invention is to provide a conductive polymer composition which has good filterability and good film formability of a flat film on an electron beam resist and can be suitably used for an antistatic film for electron beam resist writing, showing excellent antistatic property in the electron beam writing process due to the property of low volume resistivity (Ω·cm), and, reducing an effect on lithography by making an effect of an acid diffused from the film minimum, and further having excellent peelability by H2O or an alkaline developer after writing.A conductive polymer composition which comprises (A) a polyaniline-based conductive polymer having at least one kind or more of a repeating unit represented by the following general formula (1), and (B) a carboxylic acid salt represented by the following general formula (2):

A micro-protruding structure which has a high positional precision and an angular (directional) precision, which is made of a linear material having a large aspect ratio, and which is provided for an analyzer, a display device, a machining device, a measuring device and an observation device. The micro-protruding structure is fabricated by growing a linear material of a carbon nano-tube from the bottom of the hole structure perforated by a focused ion beam. This permits a direction from the bottom of the hole structure to the opening to become nearly in alignment with the direction of the linear material that protrudes from the hole structure.