203results about How to "High manufacturing requirements" patented technology

In a non-contact IC (integrated circuit) module having an IC chip and a coil, the non-contact IC module communicates with a terminal via a booster unit. A communication system extends a communication distance of data modulated by using a carrier frequency (sub-carrier frequency). A communication auxiliary apparatus is used in a communication between a non-contact information medium and an external appliance.

A method of manufacturing a metal oxide semiconductor comprising the step of: conducting a transformation treatment on a semiconductor precursor layer containing a metal salt to form the metal oxide semiconductor, wherein the metal salt comprises one or more metal salts selected from the group consisting of a nitrate, a sulfate, a phosphate, a carbonate, an acetate and an oxalate of a metal; and the semiconductor precursor layer is formed by coating a solution of the metal salt.

An LED lamp includes a plurality of LED light units, a connecting member engaged with first ends of the LED light units, a mounting member engaged with second ends of the LED light units, and two strengthening members. The LED light units are juxtaposed together and placed side by side. Each LED light unit comprises a heat sink and a plurality of LED modules engaged with a bottom of the heat sink. The strengthening members extend through two outmost side portions of the LED light units and connecting the connecting member and the mounting member to support the LED light units.

An LED lamp includes a plurality of LED light units juxtaposed together and a connecting member engaging with the LED light units. Each LED light unit includes a heat sink and an LED module engaged on the heat sink. The heat sink defines a groove group at each lateral portion thereof. The connecting member includes a plurality of inserts received in grooves of the groove groups of the heat sinks of neighboring LED light units and clasping the neighboring LED light units together thereby to secure the LED light units into the LED lamp.

The present invention provides methodologies and parameters for fabrication of the hybrid biomaterial by blending pure laminin or complex extracts of tissues containing laminin with biopolymers such as polycaprolactone (PCL), polylactic / polyglycolic acid copolymer (PLGA) or Polydioxanone (PDO) in fluoroalcohols (HFP, TFA), fabrication of substrates and scaffolds and devices from the hybrid biomaterial in forms such as films, nanofibers by electrospinning or microspheres, and the biological or biomedical use of the material or devices derived from it.

An LED lamp includes a plurality of LED light units juxtaposed together and a connecting member engaging with the LED light units. Each LED light unit includes a heat sink and an LED module engaged on the heat sink. The heat sink defines a groove group at each lateral portion thereof. The connecting member includes a plurality of inserts received in grooves of the groove groups of the heat sinks of neighboring LED light units and clasping the neighboring LED light units together thereby to secure the LED light units into the LED lamp.

Disclosed is a method suitable for large-scale producing silver nanostructures including nanoparticles and nanowires with high crystallization and purity in a short period of time. In this method, silver particles with mean diameter less than 200 nm and silver nanowires with length in micrometers are produced through a microwave-assisted wet chemistry method. Tens to hundreds grams of silver nanoparticles and nanowires are obtained in minutes by microwave irradiation treatment to a precursor pre-made by highly concentrated silver salt solution and other additives. These silver nanoparticles and nanowires have good dispersibility and are ideal for forming conductive adhesives.

The present invention includes a method for casting a silicon ingot by using a continuous casting method by means of an electromagnetic induction, and a method for cutting the silicon ingot as a starting material into plural silicon blocks. When the silicon blocks with a square section are cut out, the sectional shape of the silicon ingot is set to be rectangular. Not less than 6 pieces of equal-sized silicon blocks are cut out from the silicon ingot, thereby enabling to enhance the manufacturing efficiency to a great extent. And since the amount of excision of the edge per silicon block is reduced, the production yield can be enhanced. Further, since the proportion of columnar crystals with large grain size inside the ingot can be increased, it becomes possible to enhance the conversion efficiency of a solar battery using the silicon block as a substrate material.

An LED lamp includes a plurality of LED light units, a connecting member engaged with first ends of the LED light units, a mounting member engaged with second ends of the LED light units, and two strengthening members. The LED light units are juxtaposed together and placed side by side. Each LED light unit comprises a heat sink and a plurality of LED modules engaged with a bottom of the heat sink. The strengthening members extend through two outmost side portions of the LED light units and connecting the connecting member and the mounting member to support the LED light units.

Molten polymers are forced into T dies combined to form a multiple T die, the molten polymers are extruded through the T dies in monolayer. The monolayers extruded through the T dies are superposed and laminated outside the multiple T die while the polymers are in a molten or semi-molten state to form a intermediate molten multilayer. The multiple T die is advanced into a space between an open top half mold and a bottom half mold of a compression mold to deliver the intermediate multilayer onto the bottom half mold. The intermediate multilayer is cut to a predetermined length on the bottom half mold, and is processed for compression molding in the compression mold to form a multilayer article. A molding cycle for molding the multilayer article is carried out automatically at a remarkably improved manufacturing efficiency.

A crosslinkable, pre-adhesive composition is described comprising an acid-functional (meth)acrylate copolymer and an aziridine crosslinking agent, which when crosslinked provides a pressure-sensitive adhesive and pressure-sensitive adhesive articles.

The invention discloses an autonomous humanoid double-arm robot. The autonomous humanoid double-arm robot comprises a head, a double-wheel differential driving mobile platform, two seven-degree-of-freedom humanoid arms, a moving target simulation platform and a PTZ camera system; and a speedometer, a two-dimensional laser radar system, an ultrasonic obstacle avoidance sensor system, a binocular vision measurement system and the PTZ camera system are arranged in the double-wheel differential driving mobile platform. The autonomous humanoid double-arm robot has the advantages that the double-wheel differential driving mobile platform and the high-redundancy humanoid double-arm robot are utilized to form one high-redundancy humanoid double-arm mobile service robot system based on an ROS operating system; an advanced method for performing integral motion planning on the high-redundancy humanoid double-arm mobile service robot on the basis of an integral speed decomposition control algorithm is provided; a multi-modal information fusion target acquiring and identifying and capturing system based on a PTZ vision system and a laser sensor system is established; and a path planning methodbased on a three-dimensional C space enhanced type probability map improved A* algorithm is provided.

A TFT array substrate is disclosed. The TFT array substrate includes an array of TFT switches including scan lines, data lines intersecting the scan lines, and TFT switches. Each of the TFT switches includes a gate electrode electrically connected to a scan line, a source electrode electrically connected to a data line, and a drain electrode. The TFT array substrate also includes an array of pixel electrodes, each of the pixel electrodes is electrically connected to the drain electrode of a corresponding TFT switch. At least one first pixel electrode is disposed in the array of the pixel electrodes, and each first pixel electrode has an overlapping portion overlapped by at least one of the scan lines and the data lines. In addition, in the overlapping portion, a shielding electrode layer is located between the first pixel electrode and at least one of the scan line and the data line overlapping the first pixel electrode.

A semiconductor device includes a substrate, a region including a semiconductor element on the substrate, and at least one guard ring structure provided around the region. The guard ring structure includes a guard ring and at least one portion comprised of the substrate.

A toner including a binder resin, a colorant, and a silicon-containing polymer, which is manufactured by a method including: discharging a toner constituent liquid including toner constituents including the binder resin, the colorant, and the silicon-containing polymer, from at least one discharge opening to form liquid droplets thereof; and converting the liquid droplets into solid toner particles in a granulation space.

Disclosed is a method suitable for efficiently producing silver nanowires with high aspect ratio. In this method, silver nanowires with aspect ratio of more than 300 and purity of more than 80% are produced through an acid compound mediated microwave-assisted wet chemistry method. Such silver nanowires are especially suitable for the application in the flexible transparent electrodes, as they can simultaneously improve the electrical conductivity and transparency.

A channel layer is formed on a substrate by using an oxide semiconductor and then a sacrificial layer of an oxide containing In, Zn and Ga and representing an etching rate greater than the etching rate of the oxide semiconductor is formed on the channel layer. Thereafter, a source electrode and a drain electrode are formed on the sacrificial layer and the sacrificial layer exposed between the source electrode and the drain electrode is removed by means of wet etching.

The present invention relates to an ultraviolet detector and manufacture method thereof, in which a buffer layer is formed on a baseplate and a P-type GaN layer is formed on the baseplate by using epitaxial method. By availing ion-distribution-and-vegetation technology, a first N-type GaN layer is vegetated and invested in the P-type GaN layer by distributing and vegetating Si+ ions in that layer, and a second N-type GaN layer having a thicker ion concentration is invested in the N-type GaN layer. Finally, an annular and a circular metallic layer are formed between the P-type GaN layer and the first N-type GaN layer as well as inside the second N-type GaN layer, respectively, to serve for respective ohmic contact layers. The present invention is characterized in that an incident light can project upon a depletion layer of the GaN planar structure to have the detection efficiency significantly improved.

A method for manufacturing an optical fiber preform, including: a) providing a lining tube as a substrate tube, and doping and depositing by a PCVD or an MCVD process; b) in the reacting gas of silicon tetrachloride and oxygen, introducing a fluorine-containing gas for fluorine doping, introducing germanium tetrachioride for germanium doping, ionizing the reacting gas in the lining tube through microwaves to form plasma, depositing the plasma on the inner wall of the lining tube in the form of glass; c) after the completion of deposition, processing the deposited lining tube into a solid core rod by melting contraction through an electric heating furnace; d) sleeving the solid core rod into a pure quartz glass jacketing tube and manufacturing the two into an optical fiber preform; and e) allowing the effective diameter d of the optical fiber preform to become between 95 and 205 mm.

A patterning process for forming a double-sided electrode structure includes: providing a substrate having two opposite surfaces, wherein a first photo-sensitive layer and a second photo-sensitive layer are respectively formed on the opposite surfaces; forming a first metal nanowire layer on the first photo-sensitive layer and a second metal nanowire layer on the second photo-sensitive layer; and performing a double-sided lithography process. The lithography process includes: performing an exposure process to define a removing area and a remaining area on both of the first and the second photo-sensitive layers; and removing the first and second photo-sensitive layers and the first and second metal nanowire layers in the defined removing areas by a developer solution, thereby patterning the first and second metal nanowire layers.

A demolding mechanism of a plastic bottle cap mold provided on a movable portion of the plastic bottle cap mold; the demolding mechanism comprises a supporting and place-giving device; the supporting and place-giving device is disposed corresponding to cores in the movable portion which are used for demolding; each of the cores is fixed at a molding position during injection of a bottle cap and retreats during demolding of the plastic bottle cap mold in order to free the molded bottle cap. A demolding method achieved by the above demolding mechanism is also provided.

A method for manufacturing an electronic element wafer module is provided, the method comprising: a protective resin film forming step of forming a protective resin film on only light openings of the plurality of wafer-shaped optical elements; a light shielding film forming step of filming a light shielding film on an area except for the light openings or an entire area including the light openings; and an optical aperture forming step of removing the protective resin film, or removing the protective resin film and a light shielding film material on the protective resin film, to form an optical aperture structure by the light shielding film at the light openings.

The disclosure discloses a mask device and an evaporation device, so as to manufacture a special-shaped display panel, improve the manufacturing efficiency of the special-shaped display panel and lower the cost. The mask device provided by the embodiment of the present disclosure comprises a framework and a first strip plate, where the first strip plate is fixed on the framework and extends along the first direction, the first strip plate includes a first area and a second area, and the width of the first area is greater than the width of the second area in the direction parallel to the surface of the first strip plate and vertical to the first direction.

The parabolic trough collector includes a single-axis parabolic mirror (1) and a receiver tube (2) arranged at the focal point (F) of the parabolic mirror (1). The receiver tube (2) includes an absorber tube (4) and an outer tubular glass jacket (3) around it. To compensate for focusing errors in the parabolic collector and thus to reduce associated geometric optical losses, the tubular jacket (3) is provided with structural elements (9a, 9b, 9c, 9d), which focus sunlight reflected from the mirror as well as sunlight that falls directly on the receiver tube from the sun on the absorber tube. The receiver tube is preferably arranged relative to the parabolic mirror, so that its center is displaced from the focal point (F) by a distance equal to half the spacing between the tubular jacket (3) and the absorber tube (4).

A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.

Optical mirror elements for high bandwidth free space optical communication are produced by an electroforming replication technique. Onto the precision surface of a mandrel that is a negative of the required optical surface a layer of metal is deposited forming an exact copy of the mandrel surface and is then separated to form the required optical element. During the production process the mandrel may be coated with a variety of materials that are then separated together with the electroformed optical element during the release step to form a monolithic structure that includes a reflective coating. The mandrel remains unchanged by the process and can then be re-used. The high cost of conventional polishing techniques is therefore limited to the production of the mandrel. The replication process results in the production of low cost optical elements suitable for high bandwidth free space optical data transmission.

A semiconductor device includes a substrate, a region including a semiconductor element on the substrate, and at least one guard ring structure provided around the region. The guard ring structure includes a guard ring and at least one portion comprised of the substrate.

A device (2) for accommodating functional elements in regions of a motor vehicle interior that are subjected to mechanical forces at least at times, having a base layer (8), an intermediate layer (10) and a cover layer (12), wherein the layers (8, 10, 12) are arranged so as to at least partially overlap one another, wherein the intermediate layer (10) has at least one support element (14) for the transmission of mechanical loads between the base layer (8) and cover layer (12), which element is made, in particular, of a firm but flexible material. In addition to the support element (14), additional functional elements (18) are arranged in the remaining space (16) between the base layer (8), the cover layer (12) and the support element (14).

A razor blade substrate having a substrate that includes a blade edge portion having a profiled geometry which is covered by a strengthening coating deposited on the razor blade substrate at least at the blade edge portion. The strengthening coating covering the blade edge tip, having a profiled geometry and having a tapering geometry with two coating sides converge toward a blade edge tip. The strengthening coating includes a strengthening layer made of a titanium- and boron-containing material.