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Ultrathin palladium plating and gold plating process for lead wire frame

A lead frame and lead frame technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of cost increase and achieve the effects of cost saving, stable contact resistance, and bright and silvery appearance

Active Publication Date: 2012-12-12
ACKOTEC ZHONGSHAN ELECTRONICS PARTS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as precious metal prices continue to rise, so do costs
In this way, it is technically faced with the challenge of how to reduce the thickness of the gold / palladium layer to save costs while maintaining or even improving the quality and reliability of the lead frame

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Put the lead frame base into an alkaline degreasing electrolytic solution containing 60g / L of degreasing powder, electrolyze for 30s at a current density of 5 amperes / dm2, and an electrolytic solution temperature of 50°C, and then wash the lead frame base with tap water blow dry again;

[0049] Soak the above-mentioned lead frame substrate in an acidic oxidant solution containing 80 g / L of open-pot salt at room temperature for 20 seconds, then wash the lead frame substrate with tap water, and then wash and dry it with deionized water;

[0050] Put the above-mentioned lead frame substrate into a nickel plating solution containing 50 g / L of nickel sulfamate and 55 g / L of boric acid at a temperature of 50° C. and a pH value of 4.5 for 60 seconds at a current density of 5 amps / dm2. The thickness of the electroplated nickel layer is 0.5-2 μm, and then the lead frame substrate is cleaned with deionized water and then dried;

[0051] Put the above-mentioned lead frame substra...

Embodiment 2

[0057] Put the lead frame base into an alkaline degreasing electrolytic solution containing 70g / L degreasing powder, electrolyze for 25s at a current density of 10 amperes / dm2 and a temperature of the electrolytic solution at 55°C, and then wash the lead frame base with tap water blow dry again;

[0058] Put the above-mentioned lead frame substrate into an acidic oxidant solution containing 100 g / L of open-pot salt at room temperature and soak for 15 seconds, then wash the lead frame substrate with tap water, and then wash and dry it with deionized water;

[0059] Put the above-mentioned lead frame substrate into a nickel plating solution containing 60 g / L of nickel sulfamate and 45 g / L of boric acid at a temperature of 55°C and a pH value of 4.0 at a current density of 15 amps / dm2 for 55 seconds. The thickness of the electroplated nickel layer is 0.5-2 μm, and then the lead frame substrate is cleaned with deionized water and then dried;

[0060] Put the above-mentioned lead ...

Embodiment 3

[0066] Put the lead frame base into an alkaline degreasing electrolytic solution containing 80g / L of degreasing powder, electrolyze for 20s at a current density of 25 amps / dm2, and an electrolytic solution temperature of 60°C, then wash the lead frame base with tap water blow dry again;

[0067] Soak the above-mentioned lead frame substrate in an acidic oxidant solution containing 120 g / L of open-pot salt at room temperature for 10 seconds, then wash the lead frame substrate with tap water, and then wash and dry it with deionized water;

[0068] Put the above-mentioned lead frame substrate into a nickel plating solution containing 70 g / L of nickel sulfamate and 35 g / L of boric acid at a temperature of 60° C. and a pH value of 3.5 for 50 seconds at a current density of 25 amps / dm2. The thickness of the electroplated nickel layer is 0.5-2 μm, and then the lead frame substrate is cleaned with deionized water and then dried;

[0069] Put the above-mentioned lead frame substrate i...

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Abstract

The present invention discloses an ultrathin palladium plating and gold plating process for a lead wire frame. The process comprises the following steps: carrying out electrolysis degreasing, carrying out an activation treatment on a lead wire frame substrate, carrying out electrodeposition of a nickel plating layer, carrying out an activation treatment on the nickel layer, carrying out electrodeposition of a palladium plating thin layer, and carrying out high-frequency pulse electrodeposition of a gold plating thin layer, wherein a palladium-plated lead wire frame substrate is placed into a gold plating liquid to carry out electrodeposition for 10-20 s, cleaned with gold recovery water, dried and is subjected to gold protection to obtain the finished product. According to the present invention, under the premise of ensurence of passing of the test trial, the ultrathin gold-palladium plating layer is formed, wherein a thickness of the electroplated palladium layer is 0.02-0.1 mum, and is far lower than a thickness of 2-5 mum of the electroplated palladium layer in the existing process, and the electroplated gold layer is 0.003-0.01 mum, and is far lower than a thickness of 0.3-1.2 mum of the electroplated gold layer in the existing process, such that excellent performances of the original palladium plating layer and the original gold plating layer are ensured, gold consumption and palladium consumption are reduced, use of noble metals is substantially reduced, metal utilization rate is effectively improved, and cost is saved.

Description

【Technical field】 [0001] The invention relates to an electroplating process for a lead frame, in particular to an ultra-thin palladium-plating and gold-plating process for a lead frame, and belongs to the technical field of integrated circuit chip processing and manufacturing. 【Background technique】 [0002] Gold has extremely high chemical stability, insoluble in common acids, only soluble in aqua regia, so the gold coating has strong corrosion resistance, good anti-tarnish ability, and the coating has good ductility and is easy to polish, so it is often used as a decorative coating , such as plated jewelry, watch parts, artwork, etc. Gold has good electrical conductivity, is easy to weld, and can withstand high temperatures. The thermal conductivity of gold is 70% of that of silver. Therefore, it is widely used in the electroplating of precision instruments, printed plates, integrated circuits, military electronic tube shells, electrical contacts and other parts that requ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/12C25D3/12C25D3/50C25D3/48C25D5/48C25D5/34H01L21/60H01L23/48
CPCH01L2924/0002
Inventor 刘国强
Owner ACKOTEC ZHONGSHAN ELECTRONICS PARTS
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