39results about How to "Satisfactory heat resistance" patented technology

A resin composition is disclosed that includes a thermosetting base resin; a curing agent; an inorganic filler; and at least one fluorine resin powder selected from polyvinylidene fluoride, polychlorotetrafluoroethylene, and a tetrafluoroethylene / perfluoro(alkyl vinyl ether) / chlorotrifluoroethylene copolymer, and a semiconductor device which is fabricated by being sealed using a sealant formed of the resin composition.

The present invention relates to a pipe usable for an air intake circuit of a motor vehicle engine, and to this air intake circuit in particular for the intake of air at the outlet of a turbocompressor that comprises at least one such pipe.This pipe (1) comprises at least one inner elastomer layer (10), one outer elastomer layer (16), one intermediate elastomer layer (12) and one reinforcing structure (14) which is situated between the intermediate and outer layers and which comprises yarns based on an aliphatic polyester, such as a PET, each intermediate and outer layer being formed from a composition based on at least one acrylate copolymer (ACM).According to the invention, said composition is crosslinked by means of a system chosen from the group consisting of those based on at least one soap combined with sulfur, with a urea derivative and those based on a thiadiazole.

A heat fixing roll or belt having a silicone rubber layer which is formed by curing a silicone rubber composition comprising (A) 100 pbw of an organopolysiloxane having at least two silicon-bonded alkenyl radicals in a molecule, (B) 20-500 pbw of a metallic silicon powder having an average particle size of up to 100 μm, and (C) an effective amount of a curing agent. The silicone rubber layer has a high heat conductivity and long-term temperature durability.

This invention is intended to improve the heat resistance of PET bottles from a material aspect. A technical problem of this invention is to find a polyester resin which is suitable for heat and pressure resistant plastic bottles and which does not eat into productivity and is available at a low cost. The object of this invention is to provide a heat and pressure resistant plastic bottle that can be manufactured at a low cost and has pressure resistance at a high temperature and high impact strength. The means of fulfilling this object is a polyester resin comprising a major part of ethylene terephthalate units and containing at least one of minor copolymerizable components selected from a group consisting of isophthalic acid, cyclohexane dimethanol, and diethylene glycol, wherein three minor copolymerizable components have total content less than 3 mol. %.

A problem is to provide, in the field of polyhydroxy polyurethane resins the development of applications of which has not moved ahead by conventional technologies, a self-crosslinking polyhydroxy polyurethane resin, which enables to provide products, such as imitation leathers, excellent in abrasion resistance, chemical resistance, heat resistance and the like, and moreover, which is useful from the viewpoint of a reduction in greenhouse gas, contains carbon dioxide incorporated and fixed therein, and is responsive to environmental conservation. Provided are a self-crosslinking, polysiloxane-modified, polyhydroxy polyurethane resin having masked isocyanate groups in a structure of a polysiloxane-modified, polyhydroxy polyurethane resin derived from a reaction of a 5-membered cyclic carbonate compound and an amine-modified polysiloxane compound and having polysiloxane segments therein; a production process of the self-crosslinking resin; a resin material containing the self-crosslinking resin; and an imitation leather composed of a base fabric and a resin composition composed of the self-crosslinking resin as its principal component and impregnated in or laminated on the base fabric.

Provided are a curable composition for semiconductor encapsulation which produces a cured product that is excellent in heat resistance, electrical insulation properties at high temperatures, flexibility and heat cycle resistance, and a semiconductor device encapsulated by curing this curable composition. Specifically, there is provided a curable composition for semiconductor encapsulation containing, as component (A), a particular SiH group-containing siloxane compound; as component (B), a particular vinyl group-containing siloxane compound; as component (C), a compound having at least three SiH groups or at least three vinyl groups; and as component (D), a hydrosilylation catalyst.

A prism sheet is bonded to the bottom faces of rectangular prisms constituting a polarization beam splitter array. In the front face of the prism sheet, a plurality of rectangular prism elements are arranged in parallel to each other and a phase difference compensation film is formed on the surface. The edge lines of the rectangular prism elements are inclined at 45 degrees relative to the edge lines of the rectangular prisms. Linear polarized light of S-polarization component reflected by a polarized light separation film is reflected twice sequentially in a phase difference compensation film formed in a pair of oblique faces of the rectangular prism elements, so that the polarization direction is rotated by 90 degrees and then the light reenters the rectangular prism. Then, the light is transmitted through the polarized light separation film and then extracted from the rectangular prism.

The present invention provides an image supporting material for fixably supporting a color toner image, the material including a base material, a light scattering layer provided on the base material and containing a white pigment and a thermoplastic resin, and a color toner receptive layer provided on the light scattering layer and containing at least a thermoplastic resin, wherein the thermoplastic resin in the light scattering layer is constituted of a polyolefin or a polyolefinic copolymer having a temperature, at which viscosity becomes 5×103 Pa·s, of 100° C. or higher, and the thermoplastic resin in the color toner receptive layer is constituted of a resin obtained by melt mixing of a crystalline polyester resin and an amorphous resin and having a temperature, at which viscosity becomes 103 Pa·s, equal to or higher than 65° C. but lower than 80° C.