The invention relates to a one-board
welding process for
printed circuit board components. A large number of experiments conducted confirm that the
welding spot temperature is mainly affected by thickness of bare boards of printed circuit boards and quality of elements of the printed circuit boards. Based on the law that when the set temperature of every temperature zone of a
reflow oven is increased by a value, the obtained actual
temperature curve and the original
temperature curve are basically unchanged, a
simulation optimization method of oven temperature setting-up parameters is summed up. When the one-board
welding process for the
printed circuit board components is applied to passage
printed circuit board components, measured temperature curves of cold spots and hot spots of board surfaces of the passage printed circuit board components meet requirements of the lead-containing reflow welding, shapes of the welding spots are good, and
electrical performance of the assembling unit before and after experiment is normal when temperature
impact experiment is used for testing the quality of the welding spots. By the one-board
welding process for the printed circuit board components, the rapid
simulation optimization of process parameters is realized, the production efficiency of
aerospace electronic products and the product percent of pass are greatly improved and the hidden quality dangers are eliminated, so that the one-board
welding process for the printed circuit board components plays a very active role in guaranteeing the quality and the reliability of products.