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Two-layer overlay accuracy control level management method, calibration mark and measurement system

A technology of calibration marks and precision control, which is applied in semiconductor/solid-state device testing/measurement, microlithography exposure equipment, and photoplate making process on patterned surfaces, etc. It can solve problems such as high rework rate and consumption of measurement resources, and achieve The effect of reducing the rework rate

Active Publication Date: 2015-09-09
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology

[0010] Therefore, the above-mentioned method in the prior art consumes a large amount of measurement resources, and in addition, the calculation method of the overlay compensation value in the above-mentioned prior art can only be a single-layer compensation, and cannot perform efficient and correct two-layer compensation Value feedback, easy to cause high rework rate

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  • Two-layer overlay accuracy control level management method, calibration mark and measurement system
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  • Two-layer overlay accuracy control level management method, calibration mark and measurement system

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[0035] Embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the invention can have various changes in different examples without departing from the scope of the invention, and that the descriptions and illustrations therein are illustrative in nature rather than limiting the invention.

[0036] The following is attached Figure 3-5 , the method for solving the need for double-layer overlay precision control level management, the calibration mark structure and the measurement system for realizing the method of the present invention will be further described in detail through specific embodiments. It should be noted that the drawings are all in a very simplified form, using imprecise scales, and are only used to facilitate and clearly achieve the purpose of assisting in describing the embodiments of the present invention.

[0037] In the embodiment of the present inventi...

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Abstract

The invention provides a two-layer overlay accuracy control level management method, a calibration mark structure for implementing the method, and a measurement system comprising the calibration mark structure. According to the method, a combined calibration mark is enabled to include two-layer overlay information by means of modifying layout of an overlay calibration mark, collection of first two layers of overlay accuracy data in current level is completed by one-time measurement, and two-layer overlay accuracy can be controlled differently, so that automatic feedback optimization of overlay accuracy compensation can be completed, simplicity and feasibility are achieved, and production quality and cost control of enterprises can be facilitated more effectively.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing and application, in particular to a method for solving the need for double-layer overlay precision control level management, a calibration mark structure and a measurement system for realizing the method. Background technique [0002] With the continuous development of the semiconductor manufacturing process and the continuous reduction of the line width, the precision requirements for the lithography process and the lithography system are getting higher and higher, which is reflected in the accuracy of the overlay, that is, the greater the impact on the pass rate of the product. bigger and bigger. The so-called overlay accuracy, simply put, is the alignment accuracy of the alignment marks of the current layer relative to the marks of the previous layer in the photolithography process. As one of the three cores of lithography technology, lithography alignment generally re...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/20G03F9/00H01L21/66
CPCG03F7/70633
Inventor 朱祎明陈力钧吴鹏朱骏
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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