Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

One-board welding process for printed circuit board components

A welding process and assembly technology, which is applied in the field of printed board assembly single board welding process, can solve the small production batch of aerospace electronic products, the increase of single machine cost, and the inability to meet the development needs of high density and miniaturization of aerospace electronic products, etc. problem, to achieve rapid simulation optimization, miniaturization solution

Inactive Publication Date: 2012-08-01
BEIJING RES INST OF TELEMETRY
View PDF3 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First of all, there are many types of aerospace electronic products and the development cycle is short. It is unacceptable to conduct a trial and error test on each printed board assembly, no matter in terms of workload or production progress; secondly, the production batch of aerospace electronic products is small and the materials The price is expensive, and the input of test pieces will lead to a sharp increase in the cost of a single machine, which is unbearable
At present, when welding single boards of aerospace electronic products, we can only rely on experience to make very rough adjustments to the welding parameters. This state cannot meet the needs of high-density and miniaturized development of aerospace electronic products.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • One-board welding process for printed circuit board components
  • One-board welding process for printed circuit board components
  • One-board welding process for printed circuit board components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] 1. Basic conditions

[0059] 1.1 printed board

[0060] In terms of the thickness of the printed circuit board, the limit thickness of the printed circuit board used by our company is 0.8mm and 3.0mm at present. The commonly used printed circuit board thicknesses are 1.6mm, 1.8mm, 2.0mm, 2.2mm, and 2.4mm. Therefore, the above 7 kinds of thicknesses are selected for experiments to study the influence of the thickness of the printed circuit board on the temperature of the solder joints.

[0061] In terms of the number of layers of printed circuit boards, the limit of layers used by printed circuit boards is usually 2 layers and 20 layers. The number of layers of printed circuit boards is 10 layers. Therefore, in the selection of the number of printed circuit board layers, 2-layer boards, 10-layer boards and 20-layer boards were selected for experiments to consider the contribution of the number of printed circuit board layers to the solder joint temperature.

[0062] ...

Embodiment 2

[0103] 1. Basic conditions

[0104] 1.1 printed board

[0105] To analyze the commonly used thickness of printed circuit boards, on the basis of the original first batch of printed circuit boards, carry out further impact weight subdivision tests on printed circuit boards with 4 thicknesses of 1.8mm, 2.0mm, 2.2mm, and 2.4mm.

[0106] 1.2 Solder and Flux

[0107] Same as "First Embodiment"

[0108] 1.3 Production, testing tools and equipment

[0109] Same as "First Embodiment"

[0110] 2. Process implementation steps

[0111] 2.1 Temperature measurement point setting

[0112] For 10-1.8, 10-2.0, 10-2.2, 10-2.4, a total of 4 kinds of printed circuit boards are installed with temperature test points. The temperature measuring point setting is the same as "the first embodiment".

[0113] 2.2 silk screen

[0114] Same as "First Embodiment"

[0115] 2.3 Reflow soldering

[0116] Same as "First Embodiment"

[0117] 2.4 Test data and analysis

[0118] A total of 36 groups ...

Embodiment 3

[0141] 1. Basic conditions

[0142] 1.1 printed board

[0143] Use 2a-3, 10m-3, 10b-3, 10-1.8, 10-2.0, 10-2.2, 10-2.4 printed circuit boards.

[0144] 1.2 Solder and Flux

[0145] Same as "First Embodiment"

[0146] 1.3 Production, testing tools and equipment

[0147] Same as "First Embodiment"

[0148] 1.4 Components

[0149] 1) Types of components (soldering terminal form)

[0150] In the selection of component types, the research group based on the typical package components commonly used in the institute, and selected resistance-capacitance components, QFP package devices, QFN package devices, and BGA package devices as test components.

[0151] There are three packages of 0603, 0805 and 1812 for the resistance and capacitance parts;

[0152] QFP selects 100-pin, 240-pin plastic and metal package devices;

[0153] QFN selects the most commonly used 20-pin plastic package device;

[0154] BGA selects 100ball, 484ball, 672ball, 896ball, 1020ball plastic packaging an...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to a one-board welding process for printed circuit board components. A large number of experiments conducted confirm that the welding spot temperature is mainly affected by thickness of bare boards of printed circuit boards and quality of elements of the printed circuit boards. Based on the law that when the set temperature of every temperature zone of a reflow oven is increased by a value, the obtained actual temperature curve and the original temperature curve are basically unchanged, a simulation optimization method of oven temperature setting-up parameters is summed up. When the one-board welding process for the printed circuit board components is applied to passage printed circuit board components, measured temperature curves of cold spots and hot spots of board surfaces of the passage printed circuit board components meet requirements of the lead-containing reflow welding, shapes of the welding spots are good, and electrical performance of the assembling unit before and after experiment is normal when temperature impact experiment is used for testing the quality of the welding spots. By the one-board welding process for the printed circuit board components, the rapid simulation optimization of process parameters is realized, the production efficiency of aerospace electronic products and the product percent of pass are greatly improved and the hidden quality dangers are eliminated, so that the one-board welding process for the printed circuit board components plays a very active role in guaranteeing the quality and the reliability of products.

Description

technical field [0001] The invention relates to the technical field of electronic assembly, in particular to a single-board welding process of a printed board assembly. Background technique [0002] The surface mount production line (SMT line) is mainly composed of a screen printing machine (Stencil printer), a pick&place machine (Pick&Place machine), and a reflow oven (Reflow oven). The reflow soldering process (Reflow soldering process) realized in the reflow oven is an extremely important process on the SMT production line, and is the key to controlling the quality of SMT production. The control of the reflow soldering process determines the final quality of the SMT production line products. If the control of the reflow process is unreasonable, the process control of the early printed circuit board design, solder paste printing and component placement will lose meaning. [0003] Reflow soldering process control is technically expressed as the control of the reflow solder...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/34
Inventor 何伟刘芳曲双稳齐凤海
Owner BEIJING RES INST OF TELEMETRY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com