The invention relates to the technical field of
semiconductor packaging, and discloses a packaging structure and a packaging method of a
semiconductor chip. The packaging structure of the
semiconductor chip comprises a
wafer, an insulation structure and a conductive part. A functional area and electrodes are arranged on the first surface of the
wafer, the electrodes are distributed at intervals in the circumferential direction of the functional area, and the side walls, away from the functional area, of the electrodes are obliquely arranged; the insulating structure covers the first surface, one side of the insulating structure facing the
wafer is provided with an accommodating space, the functional area is arranged between the accommodating space and the first surface, and the side wall of the insulating structure is obliquely arranged and is coplanar with the side wall of the
electrode away from the functional area to form a
cutting slope inclining towards the middle of the insulating structure; and the conductive part covers the
cutting inclined surface and is electrically connected with the
electrode, and the conductive part extends to the end surface, opposite to the wafer, of the insulating structure along the outer contour of the insulating structure. According to the invention, the conductive part is of a planar structure on the side wall of the
chip, so that the number of inflection points on the conductive part is reduced, and the structural strength and durability of the conductive part are ensured.