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Heat dissipation module of circuit board

A heat dissipation module and circuit board technology, applied in the direction of circuit heating devices, circuits, printed circuits, etc., can solve the problems of easy generation of test noise, high noise, and inability to dissipate heat in time

Active Publication Date: 2015-02-11
KING YUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high-frequency and high-speed calculation of the system, the circuit board processor generates a large amount of heat per unit time. If the heat is not removed in time, the temperature of the processor itself will rise, especially the heat generated cannot be dissipated in time, which will affect its performance and even cause Crash while testing halted
In order to solve the above problems, the general existing method is to install a fan in the production test machine to directly blow to the high heat area of ​​the circuit board, and take away the accumulated heat of the circuit board through the air flow of the fan, but this method produces large noise and is easy to Generates test noise and is less flexible in space configuration

Method used

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  • Heat dissipation module of circuit board
  • Heat dissipation module of circuit board
  • Heat dissipation module of circuit board

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Embodiment Construction

[0040] Such as figure 1 , figure 2 as well as image 3 Shown are the front exploded view, front perspective view and partial exploded view of the upper side of the main circuit board of the first preferred embodiment of the circuit board cooling module of the present invention. As shown in the figure, a circuit board cooling module in this embodiment includes: a main circuit board 1, a first heat sink 2, a plurality of heat conducting fins 31, 32, an air pump 41, a muffler 42, a An insulating gasket 5 and a second heat sink 6 .

[0041] The first heat sink 2 is disposed on the upper side of the main circuit board 1 , and includes: a first heat sink body 21 , a first heat sink cover 22 and a plurality of seals 23 . The first heat sink body 21 has an air intake hole 211 , an exhaust hole 212 and an air channel 213 communicating with the air intake hole 211 and the exhaust hole 212 . The first heat dissipation cover 22 includes a plurality of openings 221 , and the first hea...

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Abstract

The invention relates to a heat dissipation module of a circuit board. The heat dissipation module comprises a main circuit board, a first heat dissipation base, a heat-conducting fin and a pneumatic pump, wherein the first heat dissipation base is arranged at the upper side of the main circuit board and is provided with an air inlet, an air vent and an air runner communicated with the air inlet and the air vent. In addition, the heat-conducting fin is clamped between the main circuit board and the first heat dissipation base; the pneumatic pump is connected to the air inlet; heat accumulated in the main circuit board is conducted to the first heat dissipation base by virtue of the heat-conducting fin; airflow generated by the pneumatic pump flows through the air runner so as to take away the heat accumulated in the first heat dissipation base, so that a heat source generated by the main circuit board can be effectively reduced.

Description

technical field [0001] The invention relates to a circuit board heat dissipation module, in particular to a circuit board heat dissipation module which can effectively reduce the temperature of the circuit board. Background technique [0002] Generally, the circuit boards used for production and testing are increasing in data processing volume and real-time processing requirements, and the temperature generated by the circuit boards is also increasing day by day, so the heat dissipation requirements are becoming more and more important. Due to the high-frequency and high-speed calculation of the system, the circuit board processor generates a large amount of heat per unit time. If the heat is not removed in time, the temperature of the processor itself will rise, especially the heat generated cannot be dissipated in time, which will affect its performance and even cause The machine crashes and the test stops. In order to solve the above problems, the general existing method...

Claims

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Application Information

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IPC IPC(8): H05K1/02
CPCH01L23/3675H01L23/467H05K1/0203H05K1/0209H05K2201/064
Inventor 吴国荣黄省腾
Owner KING YUAN ELECTRONICS
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