Forming structure of fluorescent powder colloid of light-emitting module and manufacture method thereof

Abstract

The invention relates to a forming structure of the fluorescent powder colloid of a light-emitting module and a manufacture method thereof. The manufacture method comprises the following steps of: forming a circuittopology line on the surface of a circuit board; arranging a plurality of line points on the circuittopology line; then, respectively and electrically connecting electronic elements and a plurality of luminescent grains with the line joints; encircling the exteriors of the plurality of luminescent grains on the surface of the circuit board with a colloid ring; coating in a fixed range by the encirclement of the colloid ring with fluorescent powder colloid so that the visible light-emitting surfaces of the luminescent grains and the surface of the circuit board between the adjacent sides of the luminescent grains are coated with the fluorescent powder colloid; and roasting to form the light-emitting module. In the manner, the fluorescent powder colloid coated on the surface of the circuit board can generate a ductile surface light source because of a light overlapping area formed by lateral light between the adjacent sides of the luminescent grains. The fluorescent powder coating manner can improve the luminescence efficiency, the ray casting illumination and the luminescence evenness.

Description

technical field [0001] The invention relates to a fluorescent powder colloidal molding structure of a light-emitting module and a manufacturing method thereof, in particular, a circuit board is provided with a plurality of light-emitting grains, and the visible light-emitting surface of each light-emitting grain and the adjacent side of each light-emitting grain The surface of the circuit board in between is coated with fluorescent powder colloid, and the side light of each light-emitting crystal grain can generate an extensible surface light source, which effectively achieves the effect of high luminous efficiency of the light-emitting module. Background technique [0002] There are many types and types of general light-emitting devices. Under the trend of contemporary green and energy-saving, Light Emitting Diode (LED) has the advantages of more power saving, small size and high reliability, especially white light-emitting diodes. It is widely used in street lights, tunnel...

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Problems solved by technology

[0005] However, it is not enough to increase the luminous efficiency of the light-emitting grains only through the above-mentioned methods. Enterprises will also increase the luminous efficiency of the light-emitting grains in the subsequent packaging process. For example, put the light-emitting grains in the reflective cup structure, please refer to Figure 8 and Figure 9 Shown is the side view sectional view of the existing cup-shaped light-emitting diode and the light-emitting schematic diagram of the existing light-emitting module. It can be clearly seen from the figure that the light-emitting diode A is a traditional shell-shaped structure, and the light-emitting diode A is composed of The light-emitting crystal grain A1, the light-emitting grain A1 is placed in the cup-shaped structure A2, and the cup-shaped structure A2 has a reflective surface A21, and an encapsulation ring for protecting the light-emitting grain A1 is poured on the light-emitting grain A1 epoxy resin A3, and then a convex mirror A4 is set on the surface of the encapsulating epoxy resin A3, and the light-emitting crystal grain A1 can scatter the light toward the front end of the convex mirror A4 through the reflective surface A21, so that the light can be concentrated and irradiated to the expected direction, and then When the light-emitting diode A is electrically connected to the circuit board B with electronic components, the light-emitting module can be formed. However, because each light-emitting crystal grain A1 is located in the cup-shaped structure A2, the convex mirror A4 of the light-emitting diode A can only control the narrow Light in a small range, that is to say, the convex mirror A4 can only refract part of the light scattered by the light-emitting crystal grain A1 through the reflective surface A21, and the light emitted at a larger angle will not be refracted by the convex mirror A4 to form lost light , forming a situation where the central light is brighter and the surroundings are darker, the side light of each light-emitting chip A1 cannot overlap with each other, the light-emitting module can only generate each point light source, and the side light of the light-emitting chip A1 is caused by Blocked by the cup-shaped structure A2, not only cannot effectively reflect toward the convex mirror A4, but also when coated with fluorescent powder colloid, it is easier to form total reflection, resulting in light loss of the light-emitting crystal grain A1, and reducing the luminous efficiency of the light-emitting module

[0006] When a plurality of light-emitting crystals A1 of the light-emitting module emit light, the light sources generated by each light-emitting crystal A1 will also partially overlap and partially overlap each other, resulting in uneven brightness of the light from the light-emitting module, which cannot be uniformly irradiated. resulting in glare

[0007] On the other hand, after the phosphor colloid is coated, the light-emitting diode A will be further filled with the colloidal epoxy resin A3, and the light-emitting diode A will have two layers of colloid, and the two-layer colloid of the light-emitting diode A often It will cause the light-emitting crystal A1 to be sealed by the epoxy resin A3, resulting in poor heat dissipation, which will affect the luminous efficiency, and will also reduce the service life of the light-emitting diode A. In addition, the sealing of the epoxy resin A3 will make the light-emitting crystal A1 accumulate heat energy for a long time It is also easy to form yellowing of epoxy resin A3, resulting in poor light transmission and weakened luminous efficiency.

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