Exposure method of exposure machine

Abstract

The invention relates to an exposure method of an exposure machine. The exposure machine is provided with an exposure platform for bearing an object to be processed and a manuscript. The exposure method of the exposure machine comprises the following steps of: arranging at least one light source group for generating an exposure light source illuminating toward the exposure platform above the exposure platform; and enabling the exposure light source to reach a preset area of the exposure platform according to a preset path displacement mode of the light source group so as to expose and display the object to be processed on the exposure platform. In tThe invention, can greatly reduce the bulb number is greatly reduced, relatively reduce the size of the whole exposure machine is reduced relatively, decrease the equipment cost is decreased and lessen the occurrence frequency of the heat-collecting phenomenon of the exposure machine is reduced. Particularly, the light source group only needs an area illuminated by the exposure light source through the exposure platform so as to save unnecessary processing cost.

Description

technical field [0001] The present invention relates to an exposure method for an exposure machine, and aims to provide an exposure machine that can perform exposure operations on a specific area of ​​an exposure platform, relatively does not generate heat accumulation, and can reduce equipment volume and cost, and related exposure method. Background technique [0002] Press, when the general printed circuit board or semiconductor wafer is exposed and developed, a layer of photoresist is first coated on the surface of the processed object, and then the circuit wiring pattern on the original is mapped to the surface of the processed object by the irradiation of the light source. On the photoresist layer, so that the chemical properties of the photoresist layer change due to the irradiation of the light source, and then use the photoresist remover to remove the photoresist irradiated by the light source or the unexposed photoresist from the surface of the processed object, to...

AI Technical Summary

Problems solved by technology

[0007] Such a design not only makes the structure of the overall exposure machine more complicated, but also the body of the overall exposure machine is relatively larger; moreover, it also uses the exposure light source covering the entire exposure platform to expose and develop the processed object; however, In the actual exposure and development process, not all the exposure areas of the workpiece are equivalent to the exposure platform, that is, some areas of the entire exposure platform do not need to be irradiated by the exposure light source, so many unnecessary processing costs are excessively wasted

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