The invention relates to a diode efficient needle transfer mounting process, which comprises the steps of (1) manufacturing upper and lower frames of a patch diode and performing mold clamping, (2) welding, (3) plastic packaging, (4) curing and electroplating, (5) rib cutting, bending and shaping, (6) reflow soldering, and (7) inspection and shipment. In the diode efficient needle transfer mounting process, a matrix frame is adopted, so that the adhering efficiency can be improved, the productivity is increased, and the labor cost is saved. Meanwhile, the needle transfer needle head is changedinto a double-layer steel needle head, crystal particles are not cracked through a spring in the process of pressing the steel needle, influences imposed on the electric property of the diode are reduced, the distance between a steel needle tip to a lower plate surface is adjusted at the same time so as to achieve an appropriate length, thereby being capable of effectively controlling the adhesive amount, improving the utilization rate of raw materials, and reducing the loss. In addition, the size of the steel needle tip can be adjusted so as to improve control for the adhesive amount of solder paste.