A multi -chip module

Abstract

A multi-chip module, the multi-chip module includes a base and a lead frame located on the base, the multi-chip module further includes at least one multi-layer circuit board mounted on the lead frame, and the multi-layer circuit board includes at least three wiring layers, The top layer of the multi-layer circuit board is surface-mounted with a plurality of independent passive devices, and the top layer of at least one multi-layer circuit board is bonded with integrated passive devices. Through the technical scheme of the present invention, the difficulty of debugging the multi-chip module is reduced, the number of bonding wires used for setting passive devices in the multi-chip module is reduced, and the plastic-encapsulated key used in packaging the multi-chip module is reduced. The effect of the alignment.

Description

technical field [0001] Embodiments of the present invention relate to the field of chips, and in particular, to a multi-chip module. Background technique [0002] A Multichip Module (MCM) places multiple unpackaged integrated circuits (ICs) or semiconductor dies and other discrete components on a unified substrate, which can be viewed as a single component when used. Compared with the solution in which each IC is individually packaged, MCM saves raw materials, reduces the manufacturing process, and greatly reduces the occupied area. Compared with the traditional discrete solution, the MCM solution has a higher degree of integration and can save more area costs. Therefore, has been widely used. [0003] The traditional MCM uses Integrated Passive Device (IPD) to form the required circuit functions. Once the IPD is fabricated, its internal device parameters are difficult to modify, making the overall circuit debugging less flexible, and due to the limitations of the IPD devic...

AI Technical Summary

Problems solved by technology

[0003] The traditional MCM uses an integrated passive device (Integrated Passive Device, IPD) to form the required circuit function. Once the IPD is manufactured, its internal device parameters are difficult to modify, which makes the overall circuit debugging less flexible. , it may not be possible to realize all the circuit functions of the MCM. At this time, additional circuits need to be added off-chip, which affects the convenience of MCM applications.

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