219results about How to "Minimized increase" patented technology

A coated electrically conductive substrate has particular utility where there are multiple closely spaced leads and tin whiskers constitute a potential short circuit. This electrically conductive substrate has a plurality of leads separated by a distance capable of bridging by a tin whisker, a silver or silver-base alloy layer coating at least one surface of at least one of the plurality of leads, and a fine grain tin or tin-base alloy layer directly coating said silver layer. An alternative coated electrically conductive substrate has utility where debris from fretting wear may increase electrical resistivity. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of the substrate into a subsequently deposited layers, which include a sacrificial layer deposited on the barrier layer that is effective to form intermetallic compounds with tin, and a low resistivity oxide metal layer deposited on the sacrificial layer.An alternative coated electrically conductive substrate has particular utility where debris from fretting wear may oxidize and increase electrical resistivity, such an in a connector assembly. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of constituents the substrate into a plurality of subsequently deposited layers. The subsequently deposited layers include a sacrificial layer deposited on the barrier layer that is effective to form intermetallic compounds with tin, a low resistivity oxide metal layer deposited on said sacrificial layer, and an outermost layer of tin or a tin-base alloy directly deposited on the low resistivity oxide metal layer.In this alternative embodiment, the barrier layer is preferably nickel or a nickel-base alloy and the low resisitivity oxide metal layer is preferably silver or a silver-base alloy.When heated, the coated substrate of this second embodiment forms a unique structure having a copper or copper-base alloy substrate, an intervening layer formed from a mixture or metals including copper and tin, and an outermost layer which is a mixture of a copper-tin intermetallic containing phase and a silver-rich phase. It is believed that this silver-rich phase is particularly beneficial to reduce an increase in resistivity due to oxidation of fretting wear debris.

An adaptive controller for linearization of transmitters using predistortion of the input signal has reduced sensitivity to impairments such as gain variation, phase noise or modulation / demodulation frequency instability by linearizing an adaptively normalized gain provided through a separate estimation and cancellation of linear gain variations. Values of a nonlinear and a linear gain blocks, cascaded with the linearized transmitter and called respectively a predistortion block and a gain regulation block, are independently adjusted by two different adaptive controllers. In one embodiment, four banks of real gain elements compose the predistortion block and realize an arbitrary step-wise approximation of a generalized 2×2 transmit gain matrix of nonlinear functions. In a further embodiment cancellation of a DC level bias multi-channel impairment is provided by an adaptively adjusted signal adder inserted in the transmit chain between the predistortion block and the linearized transmitter.

A vasoocclusive coil is reinforced with a stretch resistant member to improve safety during retraction of the coil. The stretch resistant member is fixedly attached at one end to the vasoocclusive coil, and the other end of the stretch resistant member is detachably mounted to an elongated pusher member to allow for placement and release of the vasoocclusive coil within the patient's vasculature. The stretch resistant member may be formed from a therapeutic and / or bioactive non-metallic material to enhance the therapeutic properties of the vasoocclusive coil.

The semiconductor integrated communication circuit includes:a low-noise amplifier; a receive mixer; a receive VCO; a demodulation-processing circuit; a modulation-processing circuit; a transmit mixer; a transmit VCO; a second-order-distortion-characteristic-calibration circuit; a quadrature-receive-signal-calibration circuit; and a test-signal generator. The test-signal generator generates first and second test signals using the transmit VCO. In the second-order-distortion-characteristic-calibration mode, the second-order-distortion-characteristic-calibration circuit variably changes an operation parameter of the receive mixer thereby to calibrate the second-order distortion characteristic to achieve its best condition while the first test signal is supplied to the receive mixer. In the quadrature-receive-signal-calibration mode, the quadrature-receive-signal-calibration circuit calibrates IQ mismatch of a quadrature receive signal to achieve the best condition thereof while the second test signal is supplied to the receive mixer. The integrated communication circuit can minimize the increase in chip footprint of a test-signal-generating circuit used to perform calibrations of both the second-order characteristic and IQ mismatch.