38results about How to "Low loss tangent" patented technology

Dielectrics are formed having high dielectric constants, low loss tangents, and other desirable electrical and physical properties. The dielectrics are annealed at temperatures allowing the use of copper foil substrates, and at low oxygen partial pressures.

A variable capacitor device using MEMS or micromachining techniques wherein thin-films of materials are deposited, patterned and etched to form movable micromechanical elements on the surface of a substrate composed of either semiconductor, glass, metal, or ceramic material. In one embodiment of the present invention to achieve higher frequency performance as well as other benefits, the substrate is comprised of Low-Temperature Co-Fired Ceramics (LTCC). The variable capacitor is an electrostatically actuated micromechanical device and if fabricated on a LTCC multi-layered substrate material has continuous electrical connections through the layers. The same LTCC substrate material can also be used to enclose the device by selectively removing a portion of the upper substrate so as to form a cavity. The two substrates are then bonded together to enclose and protect the variable capacitor. An integrated circuit can be incorporation onto the multi-level substrate structure to enable a electronic closed-loop controlled variable capacitor module. The integrated circuit is flip-chip bonded at the bottom of the substrate structure with appropriate electrical connections between the integrated circuit and the MEMS variable capacitor device. A variation of the present invention utilizes a zipper actuation method wherein the tuning ratio of the variable capacitor is increased to very high levels. Yet another variation of the present invention utilizes a differential gap between the top and bottom electrodes such that the actuation electrodes do not physically contact one another. Yet another implementation of the present invention uses an extra set of electrodes or mechanical mechanism so as to lock the value of the capacitor indefinitely. Yet another implementation uses shaped actuation electrodes so as to linearize the relationship between the applied actuation voltage and the resultant capacitance of the device.

A novel ferroelectric ink comprising multiphase Barium Strontium Titanate (BST) in a polymer composite is described. The ink can be employed using direct-ink writing techniques to print high dielectric constant, low loss, and electrostatically-tunable dielectrics on substrates. The substrates can be flexible such as plastics or rigid, such as substrates comprising semiconductor materials or ceramics and the like. The dielectric ink is made by suspending pre-sintered nano / submicron-sized particles of BST in a thermoplastic polymer with a solvent. After printing with the ink, a low temperature curing process is performed at temperatures below 200° C., a temperature too low to sinter BST. Fully printed devices, such as a varactor and a phase shifter using direct ink writing methodologies are described.

A glass-ceramic is provided having a thermal expansion coefficient in a range of 4.0 to 8.5 ppm / ° C., a dielectric constant in a range of 5-7 and a Quality factor Q of at least 400. The glass-ceramic consists essentially of SiO2 in a range of 40-55 wt %, Al2O3 in a range of 7-22 wt %, MgO in a range of 6 to less than 26 wt %, and at least one of BaO in an amount up to 35 wt %, SrO in an amount up to 37 wt % and ZnO in an amount up to 17 wt %. An electronic package is also provided, including one of a metal and sintered ceramic base member and a glass-ceramic substrate bonded to the base member.

The invention relates to a rubber composition. The rubber composition is prepared from the ingredients in parts by mass: 80-120 parts of crude rubber, 1-5 parts of peroxide initiator, 2-15 parts of bridging agent, 0.1-1 part of free-radical absorption and release regulator and reinforcing and anti-aging agents, wherein the crude rubber comprises any one to any three of polybutadiene rubber, natural rubber and styrene-butadiene rubber and accounts for 70 percent or more of mass of the crude rubber. According to the rubber composition and the application thereof, a formula of the rubber composition and adjuvants for product cross-linking and the like is provided, so that the requirements of a technical scheme for representatives, i.e., tires, shoe materials and wear resisting plates on good properties and good industrial adaptability effect can be met; cost and environmentally-friendliness can be taken into account simultaneously.

The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9 and / or a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately −200° C., operate in wide range of atmospheric conditions and pressures (e.g., a high atmosphere, low vacuum condition such as that found in the outer-space as well as conditions similar to those found at sea level or below sea level). The dielectric materials of the present invention may be used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices such as RF interconnects.

A film transmission line includes a dielectric layer including at least one of a liquid crystal polymer (LCP) structure or a cyclo olefin polymer (COP) structure, and an electrode line on the dielectric layer. A signal loss level (S21) defined of the film transmission line is −1.5 dB or more at a frequency in a range from 20 GHz to 30 GHz. The film transmission line may be applied to a high frequency thin film antenna and an image display device.

The present invention comprises methods and compositions of dielectric materials. The dielectric materials of the present invention comprise materials having a dielectric constant of more than 1.0 and less than 1.9, or a dissipation factor of less than 0.0009, or a material having a dielectric constant of more than 1.0 and less than 1.9, and a dissipation factor of less than 0.0009. Other characteristics include the ability to withstand a wide range of temperatures, from both high temperatures of approximately +260° C. to low temperatures of approximately −200° C., operate in wide range of atmospheric conditions and pressures, such as a high atmosphere, low vacuum such as found in outer space as well as at sea level or below sea level, and is used in the manufacture of composite structures that can be used alone or in combination with other materials, and can be used in electronic components or devices.

The present invention provides a dielectric waveguide having excellent transmission efficiency. The dielectric waveguide includes a polytetrafluoroethylene molded article that has a permittivity of 2.05 or higher at 2.45 GHz or 12 GHz, a loss tangent of 1.20×10−4 or lower at 2.45 GHz or 12 GHz, and a hardness of 95 or higher.

The invention provides a porous glass ceramic material, a preparation method and a prepared metamaterial substrate. The preparation method comprises the following steps of: selecting ZnO-B2O3-P2O5-SiO2 system glass ceramic, adopting and adding a plastic pore-forming agent and sintering to prepare the porous glass ceramic material; the dielectric constant of the prepared porous glass ceramic material can be reduced to 2-3, and the loss tangent angle can also be reduced to about 0.0001; furthermore, the preparation method has the advantages of science, reasonableness and simplicity and easiness in operation; and the substrate with low dielectric constant and low loss, which is prepared by the porous glass ceramic material, can meet the requirements of the metamaterial substrate on the dielectric constant and the loss and be widely applied in the field of metamaterials.

Provided are a thermosetting resin composition whose cured product exhibits a low dielectric constant and a low loss tangent as well as excellent flame retardancy, heat resistance, and thermal decomposition resistance, a cured product obtained from the thermosetting resin composition, and an active ester resin for use in the thermosetting resin composition. Specifically, the thermosetting resin composition contains, as essential components, an epoxy resin and an active ester resin having a resin structure that has a structural segment represented by formula (I) below and monovalent aryloxy groups at both terminals:

The embodiment of the present invention provides a method for machining a signal transmission device, a signal transmission device, and a mobile terminal. The signal transmission device specifically includes a first conductive layer and a dielectric layer, wherein a first surface of the first conductive layer is connected to the dielectric layer; and the dielectric layer is a fiber woven structure. In the embodiment of the present invention, when configured to transmit a high-frequency signal, the signal transmission device can reduce the transmission loss of the high-frequency signal, and improve the integrity of the high-frequency signal. Moreover, the dielectric layer can achieve reliably support the first conductive layer, and improves the overall strength of the signal transmission device.

Provided are an adhesive film, a flat cable, and an insulating film excelling in toughness and adhesive strength, and capable of achieving a lower dielectric constant and a lower dielectric loss tangent. More specifically, an insulating film 4 is used in a flat cable 1. The insulating film 4 is formed from a resin composition containing: a polyarylene sulfide-based resin (A); a polyphenylene ether-based resin (B); and a modified elastomer (C) having a reactive group capable of reacting with the polyarylene sulfide-based resin (A) and / or the polyphenylene ether-based resin (B). In the resin composition, the content of the polyarylene sulfide-based resin (A) is 50-93 mass%, and the content of the polyphenylene ether-based resin (B) is 3-40 mass%.