53results about How to "Increase heat flow" patented technology

The invention discloses an energy-saving heat supply system with a function of reducing the temperature of heat supply return water, and belongs to the field of improvement of energy utilization efficiency. Heat exchange can be repeatedly carried out on heat sources by multistage heat exchangers, multistage absorption heat exchange units, multistage compression heat pumps and an ice making type refrigerator, accordingly, the heat supply areas can be enlarged, and the energy utilization efficiency can be improved. The energy-saving heat supply system has the advantages that the temperature of the return water of heat supply primary pipe networks can be reduced and reach 0 DEG C, the return water contains 10% of ice particles, accordingly, route heat loss of the return water of the heat supply primary pipe networks can be reduced, the temperature difference of the return water of the heat supply primary pipe networks can be increased and reaches 118 DEG C from the original 60 DEG C, the flow rate of circulating water of the heat supply primary pipe networks can be lowered, energy consumption of circulating pumps can be reduced, heat supply flow rates of a user side can be greatly increased, the delivery efficiency of the pipe networks can be improved, the heat supply scale can be expanded, waste heat of a cooling tower can be recycled, and the like.

A heat dissipation system includes a heat sink, a heat pipe, and a cooling assembly. The heat sink includes a substrate and a number of fins extending therefrom. The heat sink has a receiving portion. The heat pipe includes a shell, a wick, and a working fluid contained in the shell. The heat pipe has an evaporation section and a condensation section. The evaporation section is inserted into the receiving portion of the substrate while the condensation section is equipped with the cooling assembly. A hydrophilic layer is formed on the wick so that the capillarity of the wick is enhanced. The heat dissipation system has two mechanisms by which to dissipate heat from a heat-generating component, i.e., via the heat sink and the heat pipe. Therefore, an efficiency of heat dissipation of the heat dissipation system is improved.

A battery is provided with solid state cooling means so that it may operate within a predetermined operating temperature range is described. Suitably such a battery may be a high voltage-high current battery intended for use in a vehicle propelled by an electric motor such as a hybrid or electric vehicle. A plurality of thermoelectric assemblies is positioned in thermal contact with the assembled cells and / or modules which comprise the battery. These assemblies may be appropriately powered to pump heat from the battery responsive to a plurality of temperature sensors associated with individual cells or modules so that the battery temperature is maintained within the predetermined temperature range. The thermoelectric assemblies may also be powered to pump heat to the battery to more rapidly increase its temperature to the predetermined operating range under low temperature conditions.

Methods and systems are provided for exhaust catalyst temperature control by metering exhaust bypass flow from a dedicated EGR cylinder. A continuously variable bypass valve may be adjusted to vary an amount of exhaust directed to an exhaust catalyst from a dedicated EGR cylinder via a bypass passage relative to exhaust recirculated to the engine intake via an EGR passage. At lower catalyst temperatures, more exhaust is metered via the bypass passage to enable catalyst temperature to be maintained above an activation level.

A cast piston, for an internal combustion engine or pump has an integral coolant ring gallery, with localized extensions, to achieve a coolant interchange with the gallery upon piston reciprocation. At least a portion of an extension lies generally parallel to the longitudinal piston axis and towards an upper end of the piston adjacent the working fluid. This provides an attendant increase in surface area exposed to coolant allowing either a decrease in operational piston temperature or an increase in allowable heat flow into the piston from a working fluid.

An anemometer and method for analyzing fluid flow is described. In one embodiment, a transistor sensor is heated by applying power to cause its base-emitter junction to rise from an ambient first temperature to a second temperature. The power is removed, and the Vbe is measured at intervals as the junction cools. The Vbe equates to a temperature of the junction. The temperature exponentially decreases, and the time constant of the decay corresponds to the fluid flow velocity. A best fit curve analysis is performed on the temperature decay curve, and the time constant of the exponential decay is derived by a data processor. A transfer function correlates the time constant to the fluid flow velocity. The transistor is thermally coupled to a metal rod heat sink extending from the package, and the characteristics of the rod are controlled to adjust the performance of the anemometer.

This present invention provides a heating system utilizing microwave energy for an improved manufacture of high quality fibers such as carbon fiber and graphitic fiber while simultaneously simplifying construction and meeting a demand for saving electric energy.

The invention relates to an energy-saving heat supply system for decreasing temperature of heating return water and recovering waste heat of thermal power plant and aims to solve the problems such that waste heat of a cooling column in a power plant cannot be fully utilized, and energy for direct combustion of coal and natural gas is greatly wasted. According to the system, the waste heat of the cooling column in the power plant is recovered, return heat of a heating primary network is borrowed, and energy saving is significantly effective. An absorbing heat pump is driven to work by combustion of coal or natural gas, heat in return water of a primary network of a combined heat and power generation heating pipeline is borrowed, heating area can be effectively enlarged, and the waste heat of the cooling column in the power plant is delivered to an urban heat network place. A temperature difference between supply and return waters is 108 DEG C, along with another temperature difference generated by electric power, and overall heating temperature difference is up to 160-180 DEG C. Delivery efficiency of a pipeline network is greatly improved, great significance to continuously increasing urban energy conservation is achieved, and related cyclic energy consumption of the primary network is decreased to less than one fourth of the original consumption.

A heat dissipation system includes a heat sink, a heat pipe, and a cooling assembly. The heat sink includes a substrate and a number of fins extending therefrom. The heat sink has a receiving portion. The heat pipe includes a shell, a wick, and a working fluid contained in the shell. The heat pipe has an evaporation section and a condensation section. The evaporation section is inserted into the receiving portion of the substrate while the condensation section is equipped with the cooling assembly. A hydrophilic layer is formed on the wick so that the capillarity of the wick is enhanced. The heat dissipation system has two mechanisms by which to dissipate heat from a heat-generating component, i.e., via the heat sink and the heat pipe. Therefore, an efficiency of heat dissipation of the heat dissipation system is improved.

A method for controlling operation of a heat exchanger system comprises providing a heat exchanger system mountable to a rear door of a rack mounted computer system, circulating a heat transport medium through the heat exchanger system, detecting leaks in the heat exchanger system by comparing a first flow rate in an inflow line to a second flow rate in a return flow line, emitting a leakage alert and ceasing further circulation of the heat transport medium through the heat exchanger system when the first flow rate exceeds the second flow rate by a predetermined flow amount, optimizing operation of the rack mounted computer system by monitoring an interior temperature of the rack mounted computer system in a plurality of vertical zones, and optimizing operation of the heat exchanger system by comparing a second temperature measured by a second temperature sensor in the return flow line with a predetermined maximum return flow temperature value.

A reversible viscosity reducing polymer is provided that has a crosslinkage between subunits inclusive of a single Diels-Alder Such a reversible viscosity reducing polymer is particularly well suited as a matrix material for a heterogeneous propellant. A process for forming a reversible viscosity reducing polymer inclusive of a single Diels-Alder linkage includes reacting a native crosslinkable moiety with a crosslinker moiety having a Diels-Alder reactive moiety of a diene or dienophile to form a Diels-Alder reactive moiety capped polymer subunit. The Diels-Alder reactive moiety capped polymer subunit is then exposed to a Diels-Alder reactant inclusive of a complementary Diels-Alder reactive moiety where the reactant also includes at least one conventional crosslinkable moiety to form a crosslinkable moiety capped polymer subunit. Reaction of the crosslinkable moiety capped polymer subunit is then reacted with a conventional multifunctional crosslinking agent.

An LED having enhanced heat dissipation is disclosed. For example, an LED die can have extended bond pads that are configured to enhance heat flow from an active region of the LED to a lead frame. A heat transmissive substrate can further enhance heat flow away from the LED die. By enhancing heat dissipation, more current can be used to drive the LED. The use of more current facilitates the production of brighter LEDs.

A sensor having a temperature dependent resistor mounted within a protective housing. The resistor is connected to external circuitry via a pair of connecting wires. In use, variations in temperature of the exhaust gas cause a variation in the temperature experienced by the resistor and consequently, the resistance of the resistor also varies. The resistor is mounted in a projecting end portion of the housing which is of narrower cross-section than the bulk of the housing. The housing is filled with a filler material. The filler material provides support to the resistor and the wires. In the present invention, unlike in prior art sensors, the filler material does not completely fill the housing. Instead a gap is provided which is crossed by the wires. The gap interrupts heat flow through the filler material and thus improves the thermal isolation of the resistor and thereby the accuracy of the sensor. In an alternative embodiment, the sensor additionally comprises an additional heat exchange element. The provision of the additional heat exchange element improves the flow of heat from the exhaust gas to the resistor, thus providing a faster response when the temperature rapidly changes and higher measurement accuracy.

One or more of three different measures are taken to preheat a wafer before it is loaded into direct contact with a wafer holder, in order to provide optimal throughput while reducing the risk of thermal shock to the wafer. The first measure is to move the wafer holder to a raised position prior to inserting the wafer into the reaction chamber and holding the wafer above the wafer holder. The second measure is to provide an increased flow rate of a heat-conductive gas (such as Hs purge gas) through the chamber prior to inserting the wafer therein. The third measure is to provide a power bias to radiative heat elements (e.g., heat lamps) above the reaction chamber.

A thin film magnetic head having one or more magneto-resistive (MR) elements. A thermally conductive stud is incorporated in an underlayer of the head, below the bottom shield of the MR element. This stud acts as a heat sink, and enhances the heat flow from the bottom shield to the substrate to thereby reduce thermal contact noise in the device, as well as allowing use of higher bias currents when reading signals from the media.

According to the disclosed embodiments, an advanced crucible support system is described that allows for greater heat flow to and from the bottom of a crucible, preferably while also preventing excessive heat from reaching a heat exchanger. In particular, a support base is described that includes one or more vents enabling improved heat flow throughout the system. Also, according to one or more additional embodiments, the functionality of the crucible support is adapted to be leveraged by a crucible manipulating device. For example, the support plate may have a plurality of slots for insertion of a “lifting arm”, such that the entire support plate assembly, as well as the crucible itself while on the support assembly, may be lifted and transported as a single unit.

There is described a vane wheel of a turbine comprising at least one vane, the footing thereof being held on a wheel disk. At least one cooling channel is arranged between the wheel disk and the vane footing. Said vane wheel having a plurality of turbulators is embodied on at least one of the walls of the cooling channel, said turbulators being configured in such a way that the turbulence and thus the heat transfer of a cooling fluid flowing through the cooling channel are increased.

A device emitting mid-infrared light that comprises a semiconductor substrate of GaSb or closely related material. The device can also comprise epitaxial heterostructures of InAs, GaAs, AlSb, and related alloys forming light emitting structures cascaded by tunnel junctions. Further, the device can comprise light emission from the front, epitaxial side of the substrate.

The invention relates to an efficient heat exchange fin. The efficient heat exchange fin comprises a base plate. The surface of the base plate is provided with at least two heat exchange pipe holes at intervals and provided with at least two flow disturbing rings at intervals. The efficient heat exchange fin is characterized in that the heat exchange pipe holes are arranged in two rows, the upper row of heat exchange pipe holes and the lower row of heat exchange pipe holes are staggered, the flow disturbing rings are also arranged in two rows, the upper row of flow disturbing rings and the lower row of flow disturbing rings are staggered, each flow disturbing ring is located above the corresponding heat exchange pipe hole, the two side edges of the base plate are each provided with a turnup protruding outwards, the portion, located between the two rows of flow disturbing rings, of each turnup is recessed inwards, so that an energy gathering arc is formed, the portions, corresponding to the energy gathering arcs, of the surface of the base plate are provided with flow guide channels, the flow guide channels are located between the upper flow disturbing rings and the lower flow disturbing rings, a first end opening of each flow guide channel faces the lower row of flow disturbing rings, and a second end opening of each flow guide channel faces the upper row of flow disturbing rings. The efficient heat exchange fin can greatly improve the heat exchange intensity and the heat exchange efficiency.

A substrate (3) and two or more different chips (1a, 1b) having different heating properties (e.g. caused by different dimensions (surface area and / or thickness), heat capacity (C1, C2), absorptivity, conductivity, number and / or size of solder bonds) are provided. A solder material (2) is disposed between the chips (1a, 1b) and the substrate (3). A flash lamp (5) generates a light pulse (6) for heating the chips (1a, 1b), wherein the solder material (2) is at least partially melted by contact with the heated chips (1a, 1b). A masking device (7) is disposed between the flash lamp (5) and the chips (1a, 1b) causing different light intensities (1a, 1b) in different areas (6a, 6b) of the light pulse (6) passing the masking device (7), thereby heating the chips (1a, 1b) with different light intensities (1a, 1b). This may compensate the different heating properties to reduce a spread in temperature between the chips (1a, 1b) as a result of the heating by the light pulse (6). The chips (1a, 1b) may be releasably carried by a chip carrier disposed between the flash lamp (5) and the substrate (3) before being positioned on the substrate (3), wherein the light (6a, 6b) of the light pulse (6) transmitted by the masking device (7) is projected onto the chips (1a, 1b) held by the chip carrier for heating the chips (1a, 1b), releasing them from the chip carrier and transferring them to the substrate (3), wherein the heated chips (1a, 1b) cause melting of the solder material (2) between the chips (1a, 1b) and the substrate (3) for attaching the chips (1a, 1b) to the substrate (3).

A battery module includes a battery module housing that defines an interior space. The battery module housing includes at least one interior wall that segregates the interior space into at least two cavities. The battery module housing and the at least one interior wall are formed of a flexible laminate material, and an electrochemical cell is disposed in one of the at least two cavities. The cell may include a housing formed of a flexible laminate material, or alternatively may be housing-free.

A liner for a turbine section includes a first wall, a plurality of webs interconnected with and projecting from the first wall, and a plurality of cooling channels, each of the cooling channels being delimited by two adjacent webs and the first wall, wherein each cooling channel presents a height corresponding to the height of its delimiting webs, and a width corresponding to the distance between its delimiting webs. At least one of the cooling channels has a width / height ratio of below 5 or / and the material of the webs has a higher thermal conductivity than the material of the first wall. A turbine section, a gas turbine engine and an aeroplane provided with such a liner are also disclosed.

The invention discloses a combustor provided with an integral fire cover. The combustor at least comprises a combustor main body, a large fire cover and a small fire cover; the integral fire cover at least comprises a fire cover main body and a fire cover seat; three spokes are arranged between the large fire cover and the small fire cover of the fire cover main body to connect the large fire cover and the small fire cover into an integer; a cavity communicating with the inner cavity of the small fire cover in the center is arranged below the spokes; fire holes communicating with the cavity are formed in two sides of the spokes; the fire cover main body is provided with a fire cover seat mounting surface in which mounting holes with screw threads are formed; an open hole is formed in the center of the fire cover seat, and mounting holes are formed in the periphery of the fire cover seat; and the fire cover seat is connected with the fire cover main body into an integer through a threaded connecting structure. Not only can the thermal efficiency and combustion performance of the combustor be remarkably improved, but also the appearance is novel and attractive, the visual impact is very strong, a Benz-logo series fire cover and the like can be formed; and the combustor is convenient to dismount and mount and beneficial to cleaning and maintenance.

The invention discloses a lower air inlet gas burner for a cooking appliance. The lower air inlet gas burner comprises a base and a fire cover, and the fire cover comprises an outer fire cover and aninner fire cover; the outer fire cover is provided with outer fire holes, and the inner fire cover is provided with inner fire holes; both the outer fire cover and the inner fire cover are arranged onthe base, and the base is provided with ejector pipes including an inner fire ejector pipe and an outer fire ejector pipe; the outer fire ejector pipe is provided with an outer fire nozzle, and the inner fire ejector pipe is provided with an inner fire nozzle; the base and the ejector pipes are of separate structures, and the ejector pipes are in threaded connection with the base; the base is manufactured through an aluminum die casting technology, and the ejector pipes are manufactured through a machining technology; finish machining of the ejector pipes is achieved, so that the surfaces ofthe inner walls of the ejector pipes are smooth, and the resistance of the ejector pipes to mixing flow is reduced; the ejection effect is improved, and the expected primary air coefficient can be achieved; and combustion is more sufficient.