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456results about How to "Increase cell density" patented technology

Polypropylene foaming material and production method thereof

The invention discloses a polypropylene foaming material. The polypropylene foaming material comprises the following components according to proportioning by weight: 60-99 parts of polypropylene resin; 0.1-10 parts of nucleating agent; 0.1-5 parts of antioxidant; 0-5 parts of colorant; 0-5 parts of lubricant; and 0-20 parts of filling material; and the melt index of the polypropylene resin is 0.1-20 g / 10 min, and the foaming process adopts supercritical fluid as the foaming agent, i.e. 0.1-20 parts of supercritical fluid (proportioning by weight). The invention also discloses a production method of the foaming material. Compared with the prior art, the invention has the advantages that the universal polypropylene can be adopted as a base material, no polymer is provided, the cross-linking reaction does not occur, the foaming process is free from environmental pollution, and the production method is safe; the quality of the obtained foaming material is stable, the foaming percentage and the cell density are high, the distribution is uniform, and the invention is suitable for the industrial production at a large scale; and meanwhile, the overall production method is simple, the operation is easy, and the production cost is relatively lower.
Owner:合肥朗润中科材料有限公司

High density hybrid MOSFET device

A hybrid semiconductor power device that includes a plurality of closed power transistor cells each surrounded by a first and second trenched gates constituting substantially a closed cell and a plurality of stripe cells comprising two substantially parallel trenched gates constituting substantially an elongated stripe cell wherein the closed cells and stripe cells constituting neighboring cells sharing trenched gates disposed thereinbetween as common boundary trenched gates. The closed MOSFET cell further includes a source contact disposed substantially at a center portion of the closed cell wherein the trenched gates are maintained a critical distance (CD) away from the source contact.
Owner:M MOS SEMICON

Voltage-controlled magnetic anisotropy (VCMA) switch and magneto-electric memory (MERAM)

ActiveUS20140177327A1High cell densityGood scalabilityGalvano-magnetic device detailsDigital storageMagnetoDomain wall dynamics
Voltage controlled magnetic tunnel junctions and memory devices are described which provide efficient high speed switching of non-volatile magnetic devices at high cell densities. Implementations are described which provide a wide range of voltage control alternatives with in-plane and perpendicular magnetization, bidirectionally switched magnetization, and control of domain wall dynamics.
Owner:RGT UNIV OF CALIFORNIA

Self-aligned trench transistor using etched contact

A trench-gated MOSFET formed using a super self aligned (SSA) process employs an insulating layer such as a glass layer and a contact mask to define contact openings for electrical connections to source regions of the MOSFET. Use a contact mask and an intervening glass in otherwise self-aligned process reduces the coupling capacitance between source metal and the top of the embedded trench gate. A metal layer deposited to make electrical contact to source regions can be planarized, for example, ground flat using chemical-mechanical polishing to provide a flat surface to avoid formation of conductive traces that extend over the steps that the glass layer forms.
Owner:ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

Trench MOSFET having low gate charge

A trench MOSFET device comprising: (a) a silicon substrate of a first conductivity type (preferably N-type conductivity); (b) a silicon epitaxial layer of the first conductivity type over the substrate, the epitaxial layer having a lower majority carrier concentration than the substrate; (c) a body region of a second conductivity type (preferably P-type conductivity) within an upper portion of the epitaxial layer; (d) a trench having trench sidewalls and a trench bottom, which extends into the epitaxial layer from an upper surface of the epitaxial layer and through the body region of the device; (f) an oxide region lining the trench, which comprises a lower segment covering at least the trench bottom and upper segments covering at least upper regions of the trench sidewalls; (g) a conductive region within the trench adjacent the oxide region; and (h) a source region of the first conductivity type within an upper portion of the body region and adjacent the trench. The lower segment of the oxide region is thicker than the upper segments of the oxide region in this embodiment.
Owner:GEN SEMICON
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