Patterned articles can be prepared by applying a release polymer to a substrate in a desired pattern, applying a substrate-adherent polymer over the pattern and substrate, and mechanically removing the substrate-adherent polymer from the pattern without requiring solvent. Suitable mechanical removal methods include applying adhesive tape to the substrate-adherent polymer and peeling the tape and substrate-adherent polymer away from the pattern, and abrading the substrate-adherent polymer from the pattern using impact media.
A process for fabricating a multi-layer circuit assembly is provided comprising the following steps: (a) providing a perforate metal core; (b) applying a dielectricpolymer onto all exposed surfaces of the metal core to form a conformal coating of substantially uniform thickness on all exposed surfaces of the metal core; (c) ablating the surface of the dielectricpolymer in a predetermined pattern to expose sections of the metal core; (d) applying a layer of metal to all surfaces to form metallized vias through the metal core; and (e) applying a resinous photosensitive layer to the metal layer. Additional processing steps such as circuitization may be included. Circuit assemblies produced by the process of the present invention comprise component layers having high via density and thermal coefficients of expansion that are compatible with those of semiconductor chips and rigid wiring boards which may be attached as components of the circuit assembly.
Method of forming a multilayer interconnection structure that includes a contact hole for reliably connecting between layers, without damaging a substrate. A column shaped mask material is formed in a position for forming a contact hole using a resist, and an interlayer insulating film is applied to the whole surface of the substrate excluding the mask material. Then, the mask material is removed by a method such as peeling. As a result, a hole generated thereby is used as a contact hole.