The invention discloses a wafer edge grinding machining method and device, and belongs to the technical field of wafer machining. The device comprises an edge grinding mechanism and a fixing mechanism, the edge grinding mechanism comprises a first bottom plate and a grinding machine located on the first bottom plate, a first grinding wheel is arranged at the end, close to the fixing mechanism, of the grinding machine, the fixing mechanism comprises a second bottom plate and an adsorption device located on the second bottom plate, the adsorption device comprises a hollow motor and a vacuum adsorption pump, the end, close to the edge grinding mechanism, of the hollow motor is connected with a suction cup head used for adsorbing wafers, the suction cup head is connected with the vacuum adsorption pump through a pipeline, and the first grinding wheel comprises a first grinding ring and a second grinding ring. Grinding force and grinding heat in the wafer grinding process can be effectively reduced, the positions of the grinding machine and the wafer are convenient and stable to adjust, the angle can be finely adjusted when the wafers rotate, the edge grinding quality of the wafers is improved, steps of different shapes can be formed at the edges of the wafers, and the probability of edge breakage and fragmentation when the wafers are ground and thinned is reduced.