The invention provides a multi-
wire cutting device applied to block forming of a
silicon ingot. The multi-
wire cutting device comprises a base, a bearing table arranged on the base for bearing the
silicon ingot to be
cut and a
cutting mechanism. The bearing table is provided with a plurality of bearing assemblies which are arranged in parallel, and a
cutting clearance is reserved between every two adjacent bearing assemblies. Each bearing
assembly comprises a pair of bearing supports, a traction roller, a
traction belt arranged on the traction roller in a sleeving manner, and a first
drive motor. The
cutting mechanism comprises a cutting support arranged on the base, at least one pair of cutting rollers erected on the cutting support, cutting wires and a second
drive motor. The cutting wires are correspondingly wound on at least one pair of cutting rollers to form a cutting net. The cutting wires on the cutting rollers are used for cutting the
silicon ingot to be
cut on the bearing table under the drive of the second
drive motor, and the cutting wires are located in the cutting clearances when cutting the silicon ingot. According to the multi-
wire cutting device, a workpiece can be
cut into blocks, the workpiece to be cut is controlled by a
microcontroller to rotate,
automatic control is achieved in the whole process, and the cutting effect is good.