88 results about "Polycide" patented technology

A process for fabricating an electronic device structure on or in a substrate. A storage and dispensing vessel is provided, containing a solid-phase physical sorbent medium having physically adsorbed thereon a fluid for fabrication of the electronic device structure, e.g., a source fluid for a material constituent of the electronic device structure, or a reagent such as an etchant or mask material which is utilized in the fabrication of the electronic device structure but does not compose or form a material constituent of the electronic device structure. In the process, the source fluid is desorbed from the physical sorbent medium and dispensing source fluid from the storage and dispensing vessel, and contacted with the substrate, under conditions effective to utilize the material constituent on or in the substrate. The contacting step of the process may include process steps such as ion implantation; epitaxial growth; plasma etching; reactive ion etching; metallization; physical vapor deposition; chemical vapor deposition; cleaning; doping; etc. The process of the invention may be employed to fabricate electronic device structures such as transistors; capacitors; resistors; memory cells; dielectric material; buried doped substrate regions; metallization layers; channel stop layers; source layers; gate layers; drain layers; oxide layers; field emitter elements; passivation layers; interconnects; polycides; electrodes; trench structures; ion implanted material layers; via plugs; precursor structures for the foregoing electronic device structures; and device assemblies comprising more than one of the foregoing electronic device structures. The electronic device structure fabricated by such process may in turn may be employed as a component of an electronic product such as a telecommunications device or electronic appliance.

Described are MEMS mirror arrays monolithically integrated with CMOS control electronics. The MEMS arrays include polysilicon or polysilicon-germanium components that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies. CMOS circuits used with the polysilicon or polysilicon-germanium MEMS structures use interconnect materials that can withstand the high temperatures used during MEMS fabrication. These interconnect materials include doped polysilicon, polycides, and tungsten metal.

A surface of a semiconductor substrate comprises at least one electrical conduction structure and at least one eFuse. The electrical conduction structure comprises a first poly silicon layer and a first poly silicide layer formed in the first poly silicon layer. The eFuse comprises a second poly silicon layer and a second poly silicide layer formed on the second poly silicon layer. The area of the second poly silicide layer is smaller than the area of the first poly silicide layer.

An array of DRAM cells having Y-shaped multi-fin stacked capacitors with increased capacitance is achieved. A planar first insulating layer is formed over the semi-conductor devices on the substrate. Polycide bit lines are formed on the first insulating layer, and a second insulating layer and a silicon nitride (Si3N4) etch-stop layer are conformally deposited. A multilayer, composed of a alternating insulating and polysilicon layers, is conformally deposited over the bit lines. Capacitor node contact openings are etched in the multilayer and in the underlying layers to the substrate. A fourth polysilicon layer is deposited sufficiently thick to fill the node contact openings and to form the node contacts. The multilayer is then patterned to leave portions over the node contacts, and an isotropic etch is used to remove the insulating layers exposed in the sidewalls of the patterned multilayer to provide Y-shaped multi-fin capacitor bottom electrodes over the bit lines. These Y-shaped multi-fin capacitors increase the capacitance by 37% over T-shaped multi-fin capacitors. The DRAM capacitors are then completed by forming an interelectrode dielectric layer on the bottom electrodes and by depositing a fifth polysilicon layer to form the capacitor top electrodes.

A p-type well and an n-type well surrounding the p-type well are formed in a p-type semiconductor substrate under a field insulating film. A polysilicon resistance film is formed on the field insulating film simultaneously with a floating gate formed in a memory cell region. A polycide conductive film is formed on a interlayer insulating film simultaneously with an auxiliary bit line formed in the memory cell region, and the polycide conductive film is connected to the resistance film by a contact formed in a via hole. A wiring line formed on an interlayer insulating film is connected to the polycide conductive film by a contact formed in a via hole penetrating the interlayer insulating film. The two via holes are formed at positions corresponding to regions in the p-type well. A negative voltage is applied to the wiring line, and the potential of a predetermined point on the resistance film is measured.

A self-aligned bipolar semiconductor device and a fabrication method thereof are provided. After a silicon layer and a collector contact are formed on a buried collector layer, an oxide dummy pattern is formed on the silicon layer to define both an extrinsic base and an intrinsic base. A polycide layer used as the extrinsic base is formed thereon and selectively removed to expose the dummy pattern. After the exposed dummy pattern is removed, an epitaxial layer used as the intrinsic base is grown on both the silicon layer and the polycide layer, and selectively removed from the top of the polycide layer. An oxide layer and a nitride layer are deposited in sequence thereon, and the nitride layer is blanket-etched to form spacers defining an emitter. After a photoresist pattern is formed to mostly cover the oxide layer and partly expose the oxide layer between the spacers over the intrinsic base, the oxide layer is etched by using the photoresist pattern and the spacers as an etch mask.

Non-oxidizing spacer densification method for producing semiconductor devices, such as MOSFET devices, and that may be implemented during semiconductor fabrication with little or substantially no polycide adhesion loss experienced during spacer densification. The method may be implemented to provide good polycide adhesion characteristics with reduced process complexity over conventional methods by eliminating the need for additional process steps such as metal silicide encapsulation or polysilicon surface treatments.

NAND flash memory cell array and fabrication process in which cells having memory gates and charge storage layers are densely packed, with the memory gates in adjacent cells either overlapping or self-aligned with each other. The memory cells are arranged in rows between bit line diffusions and a common source diffusion, with the charge storage layers positioned beneath the memory gates in the cells. The memory gates are either polysilicon or polycide, and the charge storage gates are either a nitride or the combination of nitride and oxide. Programming is done either by hot electron injection from silicon substrate to the charge storage gates to build up a negative charge in the charge storage gates or by hot hole injection from the silicon substrate to the charge storage gates to build up a positive charge in the charge storage gates. Erasure is done by channel tunneling from the charge storage gates to the silicon substrate or vice versa, depending on the programming method. The array is biased so that all of the memory cells can be erased simultaneously, while programming is bit selectable.

The invention discloses a radio frequency silicon on insulator(SOI) laterally diffused metal oxide semiconductor (LDMOS) device provided with a low potential barrier body lead-out, which comprises a bottom layer silicon, a concealed oxide layer, a top layer silicon, a P-region, a N-region, a gate oxide layer, a polysilicon gate layer, a gate polycrystalline silicon carbide layer, a gate electrode, a side wall, a N-drift region, a drain region, a drain region silicate layer, a leakage electrode, a source region, a low potential barrier body lead-out region, a body region, a source region silicide layer, and a source electrode. In the invention, the radio frequency LDMOS device is manufactured on an SOI substrate, and a low potential barrier body lead-out is in a short circuit with the source region is formed by utilizing a heavily doped region homotypic with the P- region; the source/body, leakage/ body as well as a gate is interconnected with each electrode by utilizing a silicide; a plurality of grate bars are in interdigital type parallel connection so as to enlarge the driving power of the device; and the invention provides a method for rectifying, back gate injection, N-region injection as well as N-drift region injection compatible with a complementary metal-oxide-semiconductor (CMOS) technology, as well as a N-drift region silicide conceal method compatible with the CMOS technology.

Self-aligned polysilicon process is implemented on a common source polar line to reduce the surface resistance and the contact resistance, thereby improving the unit current characteristics. Therefore, the size of the chip is reduced and the chip of each wafer is increased, thereby obtaining high yield. In addition, the structure limit of a flash unit is overcome when a semiconductor storing device is integrated highly and reduced.

The invention relates to the field of ionizing radiation dose measurement and discloses a PMOS radiation dosimeter which is based on SOI technology and can be recycled. The radiation dosimeter comprises a back-gate electrode, a multicrystalline silicide layer, a semiconductor substrate, a buried oxide layer, a toplevel silicon film, a body contact zone, a source zone, a drain region, a source electrode, a drain electrode, a front gate oxide, a front gate polycrystalline silicon layer and a front gate electrode. In the invention, the dosimeter is manufactured on an SOI substrate and is provided with two electrode probes to measure different dose rates; tuned-grid injections of a front gate and a back gate with different modes are adopted to adjust the measurement range of the probe; a high doping region which has the same shape as the toplevel silicon film is utilized to form the body contact which is short connected with the source zone; source/body, drain/body, the front gate and the back gate are connected with the respective electrode by the multicrystalline silicide; the front gate adopts a plurality of grid bars which are connected in parallel in an interdigital mode to enlarge the sensitive zone of the probe; the invention also provides annealing process control, bias condition, annealing temperature and time control and a circuit measuring method and a structure of a stacking dosimeter capable of adjusting the measuring range.

Mutual diffusion of impurities in a gate electrode is suppressed near a boundary between an n-channel type MISFET and a p-channel type MISFET, which adopt a polycide's dual-gate structure. Since a gate electrode of an n-channel type MISFET and a gate electrode of a p-channel type MISFET are of mutually different conductivity types, they are separated to prevent the mutual diffusion of the impurities and are electrically connected to each other via a metallic wiring formed in the following steps. In a step before a gate electrode material is patterned to separate the gate electrodes, the mutual diffusion of the impurities before forming the gate electrodes is prevented by performing no heat treatment at a temperature of 700° C. or higher.

The invention discloses a process for manufacturing a surface channel PMOS device with polycide, which comprises the following steps of: 1, doping an N-type impurity on a P-type silicon substrate to form an N-type channel; 2, depositing a layer of oxidized silicon nitride on the surface of a silicon wafer; 3, depositing a layer of polysilicon on the surface of the silicon wafer and doping a P-type impurity in a gate region of the layer of polysilicon to form P-type polysilicon; 4, forming the polycide on the surface of the silicon wafer; 5, etching the polycide, the P-type polysilicon and the oxidized silicon nitride except for the polycide, the P-type polysilicon and the oxidized silicon nitride outside the gate region until the N-type channel is exposed; 6, depositing a layer of silicon nitride on the surface of the silicon wafer and etching the layer of silicon nitride until the N-type channel is exposed and part of silicon nitride side wall is reserved on the side wall of the P-type polysilicon; and 7, performing ion implantation of the P-type impurity on the silicon wafer to form a source region and a drain region of the PMOS device. The surface channel PMOS device manufactured by the invention can realize low leakage of electricity under a lower threshold voltage.

A method of forming an integrated circuit, and an integrated circuit, are provided. A gate dielectric is formed on a semiconductor substrate, and a gate is formed over the gate dielectric. A sidewall spacer is formed around the gate and a source/drain junction is formed in the semiconductor substrate using the sidewall spacer. A bottom silicide metal is deposited on the source/drain junction and then a top silicide metal is deposited on the bottom silicide metal. The bottom and top silicide metals are formed into their silicides. A dielectric layer is deposited above the semiconductor substrate and a contact is formed in the dielectric layer to the top silicide.

A selective spacer to prevent metal oxide formation during polycide reoxidation of a feature such as an electrode and a method for forming the selective spacer are disclosed. A material such as a thin silicon nitride or an amorphous silicon film is selectively deposited on the electrode by limiting deposition time to a period less than an incubation time for the material on silicon dioxide near the electrode. The spacer is deposited only on the electrode and not on surrounding silicon dioxide. The spacer serves as a barrier for the electrode during subsequent oxidation to prevent metal oxide formation while allowing oxidation to take place over the silicon dioxide.

Variable-resistance material memories include a buried salicide word line disposed below a diode. Variable-resistance material memories include a metal spacer spaced apart and next to the diode. Processes include the formation of one of the buried salicide word line and the metal spacer. Devices include the variable-resistance material memories and one of the buried salicided word line and the spacer word line.