36 results about "Microwave transistors" patented technology

A microwave transistor structure comprising: (1) a substrate having a top surface; (2) a silicon semiconductor material of a first conductivity type; (3) a conductive gate; (4) a channel region of a second conductivity type; (5) a drain region of the second conductivity type; (6) a body of the first conductivity type; (7) a source region of the second conductivity type; (8) a shield plate region formed on the top surface of the silicon semiconductor material over a portion of the channel region, wherein the shield plate is adjacent and parallel to the drain region, and to the conductive gate region; and (9) a conductive plug region formed in the body region of the silicon semiconductor material, wherein the conductive plug region connects a lateral surface of the body region to the top surface of the substrate.

A microwave / millimeter wave sensor apparatus can obtain sensitive detected information while attaining a simple constitution, low costs and high efficiency of power. In the sensor apparatus, a planar radiation type oscillator substrate (S1) having an inner layer GND (12) interposed between a front surface side dielectric substrate (10) and a rear surface side dielectric substrate (11) has a pair of conductor patches (4, 4) axisymmetrically on the side of a front surface layer (16). A gate (2) and a drain (3) of a microwave transistor (1) are respectively connected to the conductor patches (4,4) to supply power to the gate (2) and the drain (3) of the microwave transistor (1) by a gate-side RF choke circuit (5a) and a drain-side RF choke circuit (5b). An impedance line (9) satisfying an oscillation condition is connected to a source (8) to transmit a transmission RF signal in an RF zone as a planar radiation type oscillator and to receive a reception RF signal as reflected waves from a matter to be measured, thus obtaining an IF signal as detected information by homodyne mixing.

A universal test fixture for testing and characterization of high-power flange-packaged RF and microwave transistors and diodes includes a precision-machined heat sink having a built-in center cavity with a finger catch on either side of the cavity which uses a plurality of matching modules that are installed in the center cavity and designed as transistor or diode carrier modules to provide mounting for the high-power packaged RF and microwave devices in a wide variety of flange type packages, an adjustable clamping structure connected to a movable arm, and a plurality of non-conductive high temperature pressure clamps. Each carrier module is made of a gold-plated rectangular aluminum block having a center cavity that is machined to the package outline. A non-conductive black-anodized high-temperature resistant pressure clamp machined to the package outline holds the packaged device in the carrier module. When clamped down using the clamping structure, the pressure clamp holds the package leads on a printed circuit board ensuring excellent electrical contact between package leads and circuit traces and surrounding ground planes, obviating soldering and desoldering the leads to the circuit board. The pressure clamp also produces pressure along the device package to hold the packaged device to the carrier module which houses the device and which itself is bolted to the heat sink resulting in excellent thermal contact under the device.

Coaxial microwave transistor test fixtures provide lowest insertion loss possible and include, as part of the input and output sections, transformer networks in form of single stage λ / 4 segments bringing (pre-matching) the system 50Ω load closer to the conjugate internal impedance of power transistors. The transforming networks are flat, cylindrical or have oval or elliptical cross sections and have adjustable length, thus operating optimally for transistors with varying optimum frequency and internal impedance and / or capacitive or inductive impedance part. The change in length is done without affecting the overall fixture geometry and structure. The fixtures can be calibrated using standard TRL method.

The present invention is a dynamic emitter ballast resistor structure of a microwave power transistor. The structure is that the active area is divided into two adjacent areas, the emitter ballast resistor is placed between the two active areas, and the emitter and base electrodes adopt double The layer metal wiring leads out, and the two active areas share a ballast resistor. Advantages: The active area is divided into two adjacent areas, the emitter ballast resistor is placed between the two active areas, and the emitter and base electrodes are drawn out by double-layer metal wiring. Make the two active regions fully thermally coupled to the same ballast resistance, make the ballast resistance value increase with the increase of temperature, increase the additional ballast effect, and realize dynamic ballast. Share a ballast resistor, reduce the parasitic capacitance of the ballast resistor and the chip area. Increase the heat dissipation boundary of the active area and reduce the thermal resistance. For chips with the same power and ballast resistance, the peak junction temperature drops by 15°C-20°C. Meet the requirements of microwave power transistors for microwave performance and reliability.

To provide a microwave / milliwave UWB pulse wireless communication device that enables realization of structural simplification, high performance, compact integration, easy design, low power consumption, and low cost. A radiation type oscillator is configured by a radiation type oscillator substrate S1 equipped with a microwave transistor 1 for generating negative resistance by short-duration operation and a resonant cavity structure, a high-frequency pulse signal of an oscillation frequency / frequency bandwidth determined based on negative resistance produced by the short-duration operation of the microwave transistor 1 and the resonant cavity structure is generated as a transmitted RF signal and simultaneously radiated into space, and the radiation type oscillator is caused to perform oscillating operation when a received RF signal arriving from an external wireless communication device enters the radiation type oscillator, whereby a received data signal is established based on acquisition of an IF signal owing to mixing by the radiation type oscillator itself.

The invention discloses a high temperature aging device for a microwave transistor. The high temperature aging device comprises an aluminum shell, a lower ceramic substrate, two L-shaped copper columns and an upper ceramic substrate, wherein the upper ceramic substrate, the two L-shaped copper columns and the lower ceramic substrate are put into the aluminum shell sequentially from top to bottom;the two L-shaped copper columns are arranged in a groove between the upper ceramic substrate and the lower ceramic substrate; and two long arms of the two L-shaped copper columns extend out of two square holes in the front wall of the aluminum shell respectively and are used as transistor lead-out electrodes. In the whole design, all adopted materials have high temperature resistance; a high temperature lead wire is connected with a peripheral circuit, so a circuit board can be prevented from being heated; therefore, a high acceleration life test at temperature of over 400 DEG C can be realized.

The invention discloses a narrow pulse generating circuit based on a tunnel diode. Including the main circuit and the driving circuit, the main circuit is mainly composed of the upper circuit including the microwave transistor Q2, the lower circuit including the microwave transistor Q1 and the microwave transistor Q3, and the amplification circuit including the microwave transistor Q1; the upper circuit and the lower circuit are connected in parallel, The input terminals of the upper and lower circuits are connected to the drive circuit, and the output terminals of the upper and lower circuits are output narrow pulse signals through the amplifying circuit. The upper, lower and amplifying circuits are all connected to the DC power supply VCC. The invention has simple structure, high emission frequency, can realize narrow pulse signal of nanosecond level or even picosecond level, has large output voltage and high reliability, and can be widely used because of its low cost.