31 results about "Allotropes of carbon" patented technology

A carbon-based material containing an allotrope of carbon, such as single-walled carbon nanotubes, is capable of accepting and intercalated alkali metal. The material exhibits a reversible capacity ranging from approximately 650 mAh/g-1,000 mAh/g. The high capacity of the material makes it attractive for a number of applications, such as a battery electrode material. A method of producing a single-walled carbon nanotube material includes purifying an as-recovered nanotube material, and depositing the purified material onto a conductive substrate. The coated substrate is incorporated into an electrochemical cell, an its ability to accept intercalated materials, such as an alkali metal (e.g.-lithium) is measured.

The thin battery has an anode material and a cathode material applied as pastes on one or more separator paper layers there between. The battery also has an aqueous electrolyte solution, binders and additives. The cathode paste furthermore has conductive material at least partly of carbon nanotubes. The thin battery has an anode material and a cathode material applied as pastes on one or more separator paper layers there between. The battery also has an aqueous electrolyte solution, binders and additives. The cathode paste furthermore has a conductive material at least partly of carbon nanotubes. The conductive material can additionally have one or more other allotropes of carbon, such as carbon powder, e.g. graphite powder.

A method and system of physically solving the charge, mass, and current density functions of pharmaceuticals, allotropes of carbon, metals, silicon molecules, semiconductors, boron molecules, aluminum molecules, coordinate compounds, and organometallic molecules, and tin molecules, or any portion of these species using Maxwell's equations and computing and rendering the physical nature of the chemical bond using the solutions. The results can be displayed on visual or graphical media. The display can be static or dynamic such that electron motion and specie's vibrational, rotational, and translational motion can be displayed in an embodiment. The displayed information is useful to anticipate reactivity and physical properties. The insight into the nature of the chemical bond of at least one species can permit the solution and display of those of other species to provide utility to anticipate their reactivity and physical properties.

A thermal conductive resin composition comprises an additive reaction product (A) of a compound (a) presented by a formula (1) having two SiH groups in one molecule and a polycyclic hydrocarbon (b) having two addition reactive carbon-carbon double bonds in one molecule, wherein the additive reaction product (A) is an additive reaction product having two addition reactive carbon-carbon double bonds, and R is two-valent hydrocarbyl or alkoxy; an inorganic filler (B) selected from allotropes of metal, metal oxide, metal nitride, metal carbide and carbon; an organic hydrogen polysiloxane; and a platinum or platinum compound (D). The thermal conductive resin composition has excellent hardness and strength to inhibit the warping degree of a semiconductor packaging piece, and also can be softened within a range of high working temperature to be warpped accordingly, thereby preventing warping.

Provided are compositions containing 20 to 50% by volume of a nitride or carbide of a group IV metal, a polymer, and 1 to 9% by volume of an allotrope of carbon. The compositions are useful in manufacturing resistors with low temperature coefficients of resistivity.

According to various embodiments, a method may include: disposing a dopant in a semiconductor region; forming a radiation absorption layer including or formed from at least one allotrope of carbon over at least a portion of the semiconductor region; and activating the dopant at least partially by irradiating the radiation absorption layer at least partially with electromagnetic radiation to heat the semiconductor region at least partially.

The present invention discloses one kind of locating mechanism of bearing grinder. The locating mechanism includes one back locating plate and one back support piece, which are made with one identical diamond material with very high hardness of HV near 10000 and has service life as long as 6-8 times that of YG6 hard alloy. The present invention can ensure the long term stability of the grinder and greatly raised size precision of the workpiece.

The invention discloses a double-sided aluminum substrate with embedded high-thermal-conductivity graphite flakes and a manufacturing method of the double-sided aluminum substrate. The double-sided aluminum substrate comprises an aluminum substrate, the graphite flakes are respectively arranged on the upper and lower surfaces of the aluminum substrate, a copper foil layer is arranged outside the graphite flakes, an electroplating anticorrosive layer is arranged on the copper foil layer, through holes are formed among the aluminum substrate, the graphite flakes and the copper foil layer, and a metal conduction layer is electroplated on the inner side surface of each through hole. According to the double-sided aluminum substrate with embedded high-thermal-conductivity graphite flakes and the manufacturing method of the double-sided aluminum substrate, heat in the aluminum substrate can be absorbed through heat absorption pieces arranged in the aluminum substrate, the temperature in the aluminum substrate can be reduced; the graphite flakes are arranged on the two sides of the aluminum substrate, and the graphite flakes are an allotrope of carbon, are gray black and non-transparent solids, are stable in chemical property and resistant to corrosion, and the graphite has high temperature resistance and good electric conduction and heat conduction performance, and the absorbed heat is transferred to radiating fins from radiating holes and is radiated, so that electronic components can be prevented from losing efficacy due to high temperature, and the service life of a panel is prolonged.

The invention relates to semiconductor device assemblies and systems with improved thermal performance and methods for making the same. Semiconductor device assemblies are provided with one or more layers of thermally conductive material disposed between adjacent semiconductor dies in a vertical stack. The thermally conductive material can be configured to conduct heat generated by one or more of the semiconductor dies in laterally outward towards an outer edge of the assembly. The layer of thermally conductive material can comprise one or more allotropes of carbon, such as diamond, graphene, graphite, carbon nanotubes, or a combination thereof. The layer of thermally conductive material can be provided via deposition (e.g., sputtering, PVD, CVD, or ALD), or via adhering a film comprising the layer of thermally conductive material to one or more of the semiconductor dies.

Newly discovered allotrope of carbon having a multilayered nanocarbon array exhibits among other properties exceptional stability, electrical conductivity and electromagnetic frequency (emf) attenuation characteristics. Members of this new allotrope include nanocarbon structures possessing vast electron delocalization in multiple directions unavailable to known fullerene-characterized materials like carbon nano-onions (CNOs), multiwalled carbon nano-tubes (MWNTs), graphene, carbon nano-horns, and carbon nano-ellipsoids such that stabilizing electron delocalization crosses or proceeds between layers as well as along layers in multiple directions within a continuous cyclic structure having an advanced interlayer connectivity bonding system involving the whole carbon array apart from incidental defects.