The invention relates to a
wireless packaging structure of a high-power
ceramic LED (Light-emitting
Diode). The invention resolves the problems that in the prior art, the
LED lamp adopts the bonding wire process, so that the process cost and the material cost are increased; and the bonding wire
electrode is arranged above a luminous
chip, so that the luminous efficiency of the light-emitting
chip is reduced. The LED comprises a base, two eutectic
electrode bonding wire pads, the luminous
chip, and a lampshade jet-molded on the base; an
anode end and a
cathode end are led from the two sides of the bottom of the luminous chip respectively; the luminous chip is arranged at the two eutectic
electrode bonding pads; the
anode end is connected with one eutectic electrode bonding pad; and the
cathode end is connected with the other eutectic electrode bonding pad. The invention has advantages as follows: as the
wireless packaging technology is used, the bonding wire process is reduced, the complexity of the technological process is reduced, the
dependability of the semi-finished product production is improved, and the cost is saved; and because the bonding wire is not arranged over the luminous chip, the luminous efficiency of the luminous chip is improved.