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Photo-setting adhesive for press key bonding injection moulding

An injection molding, light curing technology, applied in the direction of adhesives, non-polymer adhesive additives, non-polymer organic compound adhesives, etc., can solve the problems of high mold design requirements, many equipment used, and high molding temperature, To achieve the effect of shortened processing time, energy saving, stable bonding and weather resistance

Inactive Publication Date: 2009-07-08
DONGGUAN POWERBOND NEW MATERIALS TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the first step, there are defects of high molding temperature and long time; in the second step, there are defects of high equipment cost and high mold design requirements; in the third step, one-component or two-component UV glue needs to be used, and there are Too many devices and poor stability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A light-curing adhesive for button bonding and molding, which contains: 50% of silicone acrylate, 15% of acrylate prepolymer, 30% of acrylate monomer, 1.6% of photoinitiator, and fumed silica 1.5%, coupling agent 0.2%, auxiliary agent 0.2%, wherein, the silicone acrylate main chain or side chain contains C=C—COO—organic silicon resin. The acrylate prepolymer is polyurethane acrylate. The acrylate monomer is acrylate or methacrylate. The photoinitiator is composed of cleavage-type free radical photoinitiator α-hydroxy ketones (trade name 184, 1173, etc.), acyl phosphorus oxide (trade name TPO, 819, etc.). The fumed silica is hydrophilic or lipophilic silica (trade name A200, A380, R202, etc.) produced by suspension method and precipitation method. The coupling agent is a silane coupling agent containing double bonds (such as KH-570, A-174, DCZ-6030, etc.), which is added to the glue system to improve the product's heat and humidity resistance and high and low temperatu...

Embodiment 2

[0018] A light-curing adhesive for button bonding and molding, which contains: 60% of silicone acrylate, 10% of acrylate prepolymer, 25% of acrylate monomer, 3.5% of photoinitiator, and fumed silica 0.5%, coupling agent 0.5%, auxiliary agent 0.5%, wherein, the silicone acrylate main chain or side chain contains C=C—COO—organic silicon resin. The acrylate prepolymer is a composition of polyurethane acrylate, polyester acrylate, polyether acrylate, polyacrylate and epoxy acrylate. The acrylate monomer is a composition of acrylate, diacrylate and multiacrylate. The photoinitiator is one or more than two kinds of α-hydroxy ketones (trade name: 184, 1173, etc.) and acyl phosphorus oxide (trade name: TPO, 819, etc.) composition. The fumed silica is hydrophilic or lipophilic silica (trade name A200, A380, R202, etc.) produced by suspension method and precipitation method. The coupling agent is a silane coupling agent containing double bonds (such as KH-570, A-174, DCZ-6030, etc.),...

Embodiment 3

[0020] A light-curing adhesive for button bonding and molding, containing by weight percentage: 40% of silicone acrylate, 30% of acrylate prepolymer, 25% of acrylate monomer, 3.1% of photoinitiator, and fumed silica 1.5%, coupling agent 0.2%, auxiliary agent 0.2%, wherein, the silicone acrylate main chain or side chain contains C=C—COO—organic silicon resin. The acrylate prepolymer is composed of polyurethane acrylate, polyester acrylate and polyether acrylate. The acrylate monomer is a composition of acrylate and multi-acrylate. The photoinitiator is a cleavage-type free radical photoinitiator α-hydroxy ketones (trade name 184, 1173, etc.). The fumed silica is hydrophilic or lipophilic silica (trade name A200, A380, R202, etc.) produced by suspension method and precipitation method. The coupling agent is a silane coupling agent containing double bonds (such as KH-570, A-174, DCZ-6030, etc.), which is added to the glue system to improve the product's heat and humidity resist...

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PUM

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Abstract

The invention discloses a photocuring adhesive for key-press splicing and injection molding. The photocuring adhesive comprises the following compositions in percentage by weight: 30 to 80 percent of organosilicon acrylate, 5 to 30 percent of acrylate oligomer, 2 to 30 percent of acrylate monomer, 0.1 to 10 percent of light evocating agent, 0.1 to 10 percent of aerosil, 0.1 to 10 percent of coupling agent and 0.1 to 5 percent of additive. The invention also discloses a method for preparing the photocuring adhesive for key-press splicing and injection molding, application of the adhesive to a key-press part and a simple injection molding process. The photocuring adhesive has good splicing property, elasticity, solvent resistance, and excellent electrical performance and weather resistance; and a product has good maneuverability such as levelling, defoaming, easy demoulding, and the like in injection molding.

Description

technical field [0001] The invention relates to a photocurable adhesive, in particular to a photocurable adhesive and a preparation method, process and application thereof. Background technique [0002] UV-curable adhesives have the characteristics of energy saving, high efficiency, pollution-free, fast curing speed, etc., and can realize industrialized large-scale production to meet the needs of enterprises for efficiency, environmental protection and cost. It is a kind of environmentally friendly material. [0003] The publication number is the invention patent of CN1199075, which discloses a photocurable adhesive, which is composed of elastomeric epoxy acrylic resin, monofunctional reactive diluent, multifunctional reactive diluent, photosensitizer and auxiliary agent. The resin is an elastomer-modified epoxy acrylic resin, and the weight percentages of the five components are 40-50, 40-50, 3-5, 1-5 and 5-10 respectively. According to the requirements of the performance ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/00C09J11/04C09J11/06
Inventor 吴国飞刘兆辉黄战光邰南生丘永振
Owner DONGGUAN POWERBOND NEW MATERIALS TECH DEV
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