The present invention provides a method for manufacturing a wiring substrate, which can increase the finished product rate in a developing working procedure and can actually form a fine wiring pattern layer with excellent shape. In the method for manufacturing a wiring substrate K according to the invention,
metal layers (20, 21) are formed on the surface of resin insulation
layers (16, 17) firstly. Then the
exposure and develping based on alkali are executed after affixing photosensitive dry film materials (22, 23) with aliki resistance on the
metal layers (20, 21) for forming plating resits (22a, 22b) with a preset pattern. Then plating is executed for forming wiring pattern layers (28, 29) on the openings (24, 25) of plating resists (22a, 22b). Afterwards, the plating resists (22a, 22b) are stripped with organic amine stripping liquid. Lastly, the
metal layers (20, 21) positioned at the right lower part of plating resists (22a, 22b) are eliminated.