Pick-up method of die bonder and die bonder

一种裸片粘接机、裸片的技术，应用在胶粘剂、电气元件、电固体器件等方向，能够解决拾取错误增多、拾取不稳定等问题，达到可靠剥离的效果

Active Publication Date: 2012-09-26
FASFORD TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, depending on the position of the wafer or the situation of picking as described above, the picking is unstable, and picking errors increase.

Method used

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  • Pick-up method of die bonder and die bonder
  • Pick-up method of die bonder and die bonder
  • Pick-up method of die bonder and die bonder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0037] figure 1 It is a conceptual diagram of the die bonder 10 using one embodiment of the pick-up method and pick-up apparatus of this invention seen from above. The die bonder 10 roughly includes a wafer supply unit 1 , a workpiece supply and conveyance unit 2 , and a die bonding unit 3 .

[0038]The workpiece supply and conveyance unit 2 has a stacker 21 , a frame feeder 22 , and an unloader 23 . The workpieces (lead frames) supplied from the stacker 21 to the frame feeder 22 are conveyed to the unloader 23 through two processing positions on the frame feeder 22 .

[0039] The die attach part 3 has a preliminary processing part 31 and a bonding head part 32 . The preliminary processing unit 31 applies a die adhesive to the workpiece conveyed by the frame feeder 22 . The bonding head 32 picks up the die from the picker 12 and rises to move the die in parallel to the bondi...

Embodiment 2

[0077] according to Figure 9 and Figure 10 , Embodiment 2 of the present invention will be described. also, Figure 1 ~ Figure 4 , Figure 6 and Figure 7 Also used in Example 2. Figure 9 It is a flowchart showing the processing flow of the pick-up operation according to the embodiment of the present invention. in addition Figure 10 It is a diagram for explaining the correction of the tension at the time of picking up the central part and the peripheral part of the wafer in the wafer ring according to one embodiment of the present invention.

[0078] In Example 2 of the present invention, the load (reaction force) at the time of ejection was measured, and the amount of ejection could be changed so that the load at the time of ejection was constant.

[0079] exist Figure 10 In, through the upper and lower mechanism 1002 (refer to Figure 4 (a) working body 53 and drive shaft 57) push out the block main body upwards (refer to Figure 4 (a)) to perform ejection, th...

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PUM

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Abstract

The present invention provides a die bonder capable of stripping a die without fail, or a highly reliable die bonder or pick-up method using the die bonder. When a die to be stripped out of plural dies (semiconductor chips) bonded to a dicing film is to be tossed and stripped from the dicing film, the dicing film corresponding to predetermined positions out of the peripheral portion of the die is tossed to form stripping start points and then, the dicing film corresponding to portions other than the above predetermined positions is tossed to strip the die from the dicing film.

Description

technical field [0001] The invention relates to a pick-up method of a die bonding machine and the die bonding machine, in particular to a highly reliable picking-up method of the die bonding machine and a die bonding machine capable of reliably peeling off the die. Background technique [0002] Part of the process of mounting a bare chip (semiconductor chip, hereinafter referred to as a bare chip) on a substrate such as a wiring board or a lead frame to assemble a module includes a process of dividing a bare chip from a semiconductor wafer (hereinafter referred to as a wafer) and Die-attach process for mounting the divided die on the substrate. [0003] The bonding step includes a peeling step of peeling the dies separated from the wafer. In the peeling process, the dies are peeled off one by one from the dicing film held on the pickup device, and the dies are transported onto the substrate using a suction jig called a collet. [0004] As conventional techniques for perfor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67132H01L21/67271H01L2221/68322H01L2221/68336H01L2221/68354H01L2221/68381H01L2221/68386Y10S156/932Y10S156/943Y10T156/1132Y10T156/1179Y10T156/1944Y10T156/1983
Inventor 冈本直树山本启太
Owner FASFORD TECH
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