Method and device for stripping semiconductor device by ring-type contact unit

A technology of a ring-shaped contact and peeling device, which is applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve the problems of easily damaged silicon chips 16 and difficult to peel off silicon chips 16, etc.

Inactive Publication Date: 2003-04-30
SOCIONEXT INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

exist Figure 12 In the situation shown, it is difficult to peel off the silicon chip 16 from the dicing tape 24, and it is easy to damage the silicon chip 16.

Method used

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  • Method and device for stripping semiconductor device by ring-type contact unit
  • Method and device for stripping semiconductor device by ring-type contact unit
  • Method and device for stripping semiconductor device by ring-type contact unit

Examples

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Embodiment Construction

[0033] Embodiments of the present invention will be described below with reference to the drawings. specific reference Figure 10A-1 0F, a typical example illustrating a series of steps of a method of manufacturing a semiconductor device.

[0034] Figure 10A is a view showing a silicon wafer (semiconductor substrate) undergoing an integrated circuit manufacturing process. The silicon wafer 10 has a first surface 12 and a second surface 14 on which a number of semiconductor elements (silicon chips) 16 have been formed during the integrated circuit manufacturing process. exist Figure 10B In the process, the protective tape 18 is bonded on the first surface 12 of the silicon wafer 10 .

[0035] exist Figure 10C In the process, the second surface 14 of the silicon wafer 10 is ground while the protective tape 18 is adhered to the first surface 12 of the silicon wafer 10 . In this example, a diamond grinding wheel 22 serving as a machining tool grinds the second surface of ...

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PUM

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Abstract

In a semiconductor device manufacturing process, a semiconductor wafer is diced into a plurality of semiconductor chips, which are then peeled, from a dicing tape, using a peeling device. The peeling device includes a plurality of annular contact members arranged one after another from the outside to the inside, and the annular contact members are operated so that the semiconductor chip is successively peeled from the tape from the outer circumferential portion thereof toward the central portion thereof.

Description

technical field [0001] The present invention relates to a method for peeling off semiconductor chips used in the manufacturing process of semiconductor devices. Furthermore, the invention also relates to a device for this purpose. Background technique [0002] Conventional semiconductor devices are manufactured by, for example, forming many semiconductor elements on a first surface of a silicon wafer (semiconductor substrate) and then dicing the silicon wafer to separate the semiconductor elements (silicon chips) from each other. The silicon wafer is bonded to the dicing tape before dicing, and the silicon chips that have been separated from each other are still bonded to the dicing tape after the dicing is completed. Therefore, it is necessary to use a stripping device to peel off the silicon chip from the dicing tape, and then perform chip bonding. [0003] In order to peel the silicon wafer from the dicing tape, usually apply Figure 11 The needle device 34 is shown. T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/00H01L21/78
CPCH01L2221/68322Y10S156/943H01L21/67132Y10S438/976Y10T29/49824Y10T156/1179Y10T156/19Y10T156/1983H01L21/78
Inventor 吉本和浩手代木和雄吉田英治
Owner SOCIONEXT INC
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