50results about How to "Reduce trace width" patented technology

To utilize effectively the panel space of the liquid crystal panel, this invention has provided a wiring structure, in which the seal material and BM are coated in a superposition and the UV light is irradiated from one side of the TFT substrate; this invention has also provided a wiring structure, in which the seal material can still be irradiated by the UV light with high efficiency, meanwhile, the drop of the resistance value of the metal wiring on the TFT substrate can be restricted to a specific range. The solution is: the liquid crystal dropped is sandwiched between the TFT substrate and the CF substrate, meanwhile the liquid crystal panel is formed by adhering the light cured seal material disposed at the peripheral area of two substrates. In the adhering-formed liquid crystal panel, for the wiring portion, which is the portion of wiring disposed on the TFT substrate superposing the light cured seal material, the wiring structure is formed as follows, that is, the region of the seal material is divided into three regions, an adjacent region, a middle region and an outer region. The function of the respective regions must be held, and the resistance of the metal wiring is minimized under the precondition that the respective function is satisfied sufficiently.

In a semiconductor integrated circuit including a plurality of cells, a supplementary power-supply wire is disposed between a lattice-shaped upper power-supply wire and a lower cell power-supply wire for cases in which power is supplied from the upper power-supply wire to the lower cell power-supply wire. The supplementary power-supply wire and the lower cell power-supply wire are connected by two vias. The supplementary power-supply wire and the upper power-supply wire are connected by a single via. Current from the supplementary power-supply wire is divided by the two vias and then supplied to the lower cell power-supply wire. Therefore, when power is supplied from the upper power-supply wire to the lower cell power-supply wire, current concentration at the connection points of the lower cell power-supply wire to the vias is decreased, thereby reducing wire breaks caused by EM (electro migration).

The inkjet head comprises: a plurality of ink discharge nozzles which are arranged two-dimensionally; a plurality of pressure chambers which are in communication with the ink discharge nozzles so as to store ink, the pressure chambers being two-dimensionally arranged in correspondence with the ink discharge nozzles; a plurality of piezoelectric elements; a common electrode which is disposed on pressure chamber sides of the piezoelectric elements; a plurality of discrete electrodes which are disposed on sides of the piezoelectric elements opposite to the common electrode; and a plurality of discrete lead electrodes which feed electricity to the discrete electrodes, wherein: each of the piezoelectric elements is deformed by applying voltage to the common electrode and the discrete electrode so that a volume of the pressure chamber is varied to discharge a droplet of the ink from the ink discharge nozzle; and with respect to each pair of the discrete electrode and discrete lead electrode corresponding to each of the pressure chambers, when T1 is a thickness of the discrete electrode and T2 is a thickness of the discrete lead electrode which feed electricity to the discrete electrode, the discrete electrode and the discrete lead electrode are configured so that T1 and T2 satisfy the following formula: T1<T2.

There is provided a laminate used as an underlayer layer for a photoresist in a lithography process of a semiconductor device and a method for manufacturing a semiconductor device by using the laminate. The method comprising: laminating each layer of an organic underlayer film (layer A), a silicon-containing hard mask (layer B), an organic antireflective film (layer C) and a photoresist film (layer D) in this order on a semiconductor substrate. The method also comprises: forming a resist pattern in the photoresist film (layer D); etching the organic antireflective film (layer C) with the resist pattern; etching the silicon-containing hard mask (layer B) with the patterned organic antireflective film (layer C); etching the organic underlayer film (layer A) with the patterned silicon-containing hard mask (layer B); and processing the semiconductor substrate with the patterned organic underlayer film (layer A).

The invention discloses a construction method for reducing temperature rise at an electrician busbar lap joint part, belonging to the field of electrical equipment, and specifically relates to construction and installation of an electrician busbar. The connection column is provided with a first cylindrical portion which is in interference fit with a pre-drilled hole in an electrician busbar, wherein the first cylindrical portion is provided with conductivity; a second cylindrical portion with conductivity is coaxially arranged in the first cylindrical portion; the first cylindrical portion is in interference fit with the second cylindrical portion; and the thermal expansion coefficient of the second cylindrical portion is greater than the thermal expansion coefficient of the first cylindrical portion. The connection column has the advantages that 1) the same lap joint length can generate larger conductive area, so that the current density can be reduced and the low temperature rise of the busbar can be realized; 2) the use level of the busbar is reduced so that the resource is saved; 3) the electric clearance or the phase spacing can be enlarged, so that the electrical safety of equipment is improved; and 4) the wiring width of the busbar is reduced, so that the occupied space of the busbar can be reduced.

The invention discloses a design method of a connecting column for reducing temperature rise at an overlap position between electric bus bars, belongs to the field of power equipment, and particularly relates to a design method of a connecting column. The design method of the connecting column disclosed by the invention comprises the following steps: providing first columnar parts which are in interference fit with prefabricated holes in the electric bus bars, wherein the first columnar parts are electrically conductive; coaxially arranging second columnar parts which are electrically conductive in the first columnar parts; making the first columnar parts be in interference fit with the second columnar parts; and making thermal expansion coefficients of the second columnar parts be greater than the thermal expansion coefficients of the first columnar parts. The connecting column made by the design method disclosed by the invention has the beneficial effects that 1, more electric conduction area is formed at a same overlap length, so that the current density is lowered, and low temperature rise of the bus bars is realized; 2, a using quantity of the bus bars is reduced, and resources are saved; 3, electric clearances or space distances are increased, and the electrical safety of equipment is enhanced; and 4, arrangement widths of the bus bars are reduced, so that space occupied by the bus bars can be reduced.

In a semiconductor physical quantity sensor of electrostatic capacitance type, mutually facing peripheral areas (bonding areas) of a glass substrate and a silicon substrate are contacted for anodic bonding, while at the same time, both substrates have an anodic bonding voltage applied therebetween so as to be integrated. A fixed electrode is formed on a bonding face-side surface of the silicon substrate, while a movable electrode is formed on a bonding face-side surface of the semiconductor substrate. An equipotential wiring, which short-circuits the fixed electrode to the movable electrode as a countermeasure to discharge in anodic bonding, is formed on the bonding face-side surface of the glass substrate inside the bonding area before the anodic bonding. After the anodic bonding, the equipotential wiring is cut and removed. By manufacturing the sensor in this manner, the fixed electrode of the insulating substrate is made equipotential to the movable electrode of the semiconductor substrate when the insulating substrate is anodically bonded to the semiconductor substrate, thereby preventing discharge from occurring. Accordingly, it is possible to obtain a high bonding strength and desired sensor characteristics without causing bonding voids to occur and a sensor chip to increase in size.

A magnetoresistance effect element includes a recording layer containing a ferromagnetic body, and including a first fixed and second magnetization regions having magnetization components fixed substantially in a direction antiparallel to the in-plane direction to each other, and a free magnetization region disposed between the first and second fixed magnetization regions and having a magnetization component invertible in the in-plane direction, a domain wall disposed between the first fixed magnetization region and the free magnetization region, and being movable within the free magnetization region, and a magnetic nanowire having a width of 40 nm or less. The thickness of the recording layer is 40 nm or less and at least half but no more than twofold the width of the magnetic nanowire. The element further includes a barrier layer disposed on the recording layer, and a reference layer disposed on the barrier layer and containing a ferromagnetic body.

A wiring board includes an insulating base; an adhesive layer formed on the surface of the insulating base; a conductor wiring formed on the surface of the adhesive layer; and a bump formed crossing the longitudinal direction of the conductor wiring over regions on the adhesive layer on both sides of the conductor wiring, wherein the back face at a part of the conductor wiring where the bump is formed, and the back faces and parts of the side faces of the bump formed above the regions of the adhesive layer on both sides of the conductor wiring, are embedded in the surface of the adhesive layer so as to be adhered to the adhesive layer. Even when the wiring width of the conductor wiring is decreased, the conductor wiring can be adhered to the wiring board firmly.

An indication lighting device provided is capable of reducing the number of electric wiring from a fixed, part to a moving part when an indication part is provided in the moving part's side. The indication lighting device makes indication by emitting light from a light source arranged in a fixed part to an optical waveguide arranged in a moving part, reflecting the light incident on the optical waveguide by reflection surfaces of prisms of the optical waveguide to an indication part provided in a tip side of the optical waveguide to be propagated, and emitting the light propagated inside the optical waveguide through the indication part.