38results about How to "Reduce the chance of bad" patented technology

The embodiment of the invention provides material coating equipment and a control method thereof, relates to the field of preparation of display devices, and can improve the control precision of silica gel coating flow. The material coating equipment comprises a storage cavity, an air pressure cavity, a flow adjusting rod, an air pressure adjusting device and an air supply source. The flow adjusting rod penetrates through the storage cavity, and is provided with an adjusting head at one end near a discharge port of the storage cavity; and one end, deviated from the discharge port, of the flow adjusting rod is connected with a piston in the air pressure cavity. An output end of the air pressure adjusting device is connected with the air pressure cavity, and an input end of the air pressure adjusting device is connected with the air supply source for receiving a preset material flow of the discharge port to convert the preset material flow into a preset air pressure value, matched with the preset material flow, of the air pressure cavity and controlling the flow of gas output to the air pressure cavity by the air supply source according the preset air pressure value. The material coating equipment is used for coating materials.

A liquid crystal display panel and a manufacturing method thereof are provided. The liquid crystal display panel comprises: a first substrate and a second substrate bonded to each other; a liquid crystal layer filled between a display region of the first substrate and a display region of the second substrate; and a sealant formed between a periphery region of the first substrate and a periphery region of the second substrate. A reflective layer is formed in the periphery region of the first substrate or in the periphery region of the second substrate, and the reflective layer is adapted to reflect UV light to the sealant in a process of assembling the first substrate and the second substrate.

The invention discloses a novel method for manufacturing LED chips. The novel method includes performing MESA photoetching and NP (negative and positive) photoetching, and particularly includes performing vacuum evaporation on the surfaces of epitaxial slices to obtain ITO (indium tin oxide) layers, then coating photoresist on the surfaces of the epitaxial slices, then performing MESA photoetching on the epitaxial slices to obtain photoresist layers with MESA pattern layers, etching ITO of the ITO layers and downwardly etching the surfaces of the epitaxial slices; removing the photoresist layers with the MESA pattern layers; performing vacuum evaporation on steps of the ITO layers and N-GaN layers to obtain SiO<2> layers, coating photoresist on the steps of the ITO layers and the N-GaN layers, and performing NP photoetching on the photoresist layers to obtain photoresist layers with NP patterns; etching the SiO<2> layers; forming P electrodes and N electrodes in regions obtained after the SiO<2> layers are etched; removing the photoresist layers with the NP pattern layers. The novel method has the advantages that the production cost can be effectively reduced, the production cycle can be shortened, and the yield can be increased.

The invention discloses a manufacturing method of an array substrate, an array substrate and a liquid crystal display, thereby improving a picture quality of a thin film transistor liquid crystal display (TFT-LCD). The method comprises the following steps: forming a substrate at least containing a gate electrode, a gate insulation layer, an active layer, s source electrode, a drain electrode and a pixel electrode; forming a flat layer on the substrate; forming a groove on the flat layer; and arranging a first support in the groove.

An array substrate includes a substrate; scan lines and data lines arranged on the substrate and intersecting one another to define sub-pixels, each of which includes a pixel electrode including strip-like electrodes whose long axes of a same row are parallel to one another. Extension lines of long axes of strip-like electrodes in sub-pixels in any two adjacent rows intersect one another. The touch electrode is electrically connected to at least one touch signal line. Each touch signal line includes straight-line portions and fold-line portions. Two adjacent straight-line portions are connected by one fold-line portion. Any straight-line portion is parallel to long axes of strip-like electrodes in sub-pixels in a same row. Extension lines of fold-line portions intersect long axes of strip-like electrodes. Orthographic projections of fold-line portions on the substrate overlap orthographic projections of scan lines on the substrate. Fold-line portions are not perpendicular to scan lines.

The invention relates to a circuit board and application thereof. The circuit board comprises a substrate and an etching metal circuit located over the substrate. The substrate is provided with at least one pair of through holes, inside of the through holes and substrate base between the two through holes are provided with a conductive coating, and the substrate and the etching metal circuit form a conducted closed loop. According to the circuit board provided by the invention, the etching metal circuit is arranged over the substrate to replace the conventional circuit formed by printing silver circuits on the substrate, conductive circuits are compactly concentrated on a metal layer, probability of generating defective circuits while printing is reduced, and yield is increased; and the substrate is drilled, the inside of the through holes and the substrate base are provided with the conductive coating, the formed conducted closed loop can replace the existing jumper technology, production processes can be decreased, difficulty in process is reduced, and production cost is saved greatly. Application of the circuit board provided by the invention comprises using the circuit board as a light guide plate of an illuminant keyboard, and just by directly using the circuit board in cooperation with a light-emitting diode, light emitting at base of the keyboard can be realized.

The invention relates to an edge-removing optical resist device which comprises a device main body. A racking pipe for pumping residual liquid on the edge of a glass substrate through negative pressure is arranged in the device main body; an upper spray needle and a lower spray needle for spraying chemical liquid medicine at the end part of the glass substrate in a sloping direction from the upper part and the lower part are connected to the device body. By changing an inlet pipe duct and the spray direction of the chemical liquid medicine, and arranging the racking pipe with the negative pressure, the invention avoids gas liquid interference appearing in the use of the prior device, reduces ill probability formation caused by sputtering the chemical liquid medicine on the glass substrate, saves nitrogen at the same time, and reduces manufacture cost.

The invention provides a method for detecting the flatness of a wafer table. The method comprises the steps of putting a selected detection wafer on a standard wafer table and etching a first layer ofnesting graphics; putting the detection wafer etched with the first layer of nesting graphics on an actual wafer table and etching a second layer of nesting graphics; calculating the nesting accuracyof the second layer of nesting graphics relative to the first layer of nesting graphics; and comparing the calculated nesting accuracy with a threshold, and if the nesting accuracy exceeds the threshold, judging that the flatness of the wafer table does not reach a standard value. According to the method for detecting the flatness of the wafer table provided by the invention, the value of the nesting accuracy is calculated and recorded through measuring the nesting accuracy of the wafer, and whether the wafer table needs to be cleaned or not is judged through judging whether the nesting accuracy exceeds the threshold or not. According to the method, the flatness of the wafer table can be detected, so that the probability of a bad wafer caused by the flatness is finally reduced.

The invention discloses a multiple wire turning cutting method and equipment. The multiple wire turning cutting equipment is a multiple wire cutting machine and comprises a square multiple wire cutting base plate and a working table; two or more multiple wire cutting machines can be used for performing combined cutting. Compared with the conventional multiple wire cutting method and equipment, the multiple wire turning cutting method and equipment has the benefits that rapid cutting is realized, time spent on the intermediate auxiliary section is cut down, the material turnover time is reduced generally, cosmetic defects possibly caused during the material turnover process can be reduced, and the product quality is improved.

The invention relates to a thin-film switch. The thin-film switch comprises an upper conducting circuit, a lower conducting circuit and an insulation part located between the upper conducting circuit and the lower conducting circuit; the lower conducting circuit comprises a base material and an etching metal circuit located above the base material; the base material is provided with at least a pair of through holes; conductive coatings are arranged at the inner parts of the through holes and the bottom of the base material which is located between the two through holes; and the base material and the etching metal circuit form a conductive closed loop. As a traditional circuit formed by silver lines printed on the base material is replaced by the etching metal circuit arranged above the base material and the conducting circuit is compactly concentrated on a metal layer, the probability of poor circuits during printing is reduced and the yield is increased; meanwhile, holes are drilled in the base material, the conductive coatings are arranged in the through holes and at the bottom of the base material and the formed conductive closed loop can replace an existing insulation layer and an existing jumper wire, so that production procedures are reduced, technology difficulty is decreased, production cost is greatly saved, and the saved cost is about 40% of a traditional thin-film switch.