38results about How to "Reduce the chance of bad" patented technology

The invention discloses a manufacturing method of an array substrate, an array substrate and a liquid crystal display, thereby improving a picture quality of a thin film transistor liquid crystal display (TFT-LCD). The method comprises the following steps: forming a substrate at least containing a gate electrode, a gate insulation layer, an active layer, s source electrode, a drain electrode and a pixel electrode; forming a flat layer on the substrate; forming a groove on the flat layer; and arranging a first support in the groove.

The invention discloses a multiple wire turning cutting method and equipment. The multiple wire turning cutting equipment is a multiple wire cutting machine and comprises a square multiple wire cutting base plate and a working table; two or more multiple wire cutting machines can be used for performing combined cutting. Compared with the conventional multiple wire cutting method and equipment, the multiple wire turning cutting method and equipment has the benefits that rapid cutting is realized, time spent on the intermediate auxiliary section is cut down, the material turnover time is reduced generally, cosmetic defects possibly caused during the material turnover process can be reduced, and the product quality is improved.

The invention relates to a thin-film switch. The thin-film switch comprises an upper conducting circuit, a lower conducting circuit and an insulation part located between the upper conducting circuit and the lower conducting circuit; the lower conducting circuit comprises a base material and an etching metal circuit located above the base material; the base material is provided with at least a pair of through holes; conductive coatings are arranged at the inner parts of the through holes and the bottom of the base material which is located between the two through holes; and the base material and the etching metal circuit form a conductive closed loop. As a traditional circuit formed by silver lines printed on the base material is replaced by the etching metal circuit arranged above the base material and the conducting circuit is compactly concentrated on a metal layer, the probability of poor circuits during printing is reduced and the yield is increased; meanwhile, holes are drilled in the base material, the conductive coatings are arranged in the through holes and at the bottom of the base material and the formed conductive closed loop can replace an existing insulation layer and an existing jumper wire, so that production procedures are reduced, technology difficulty is decreased, production cost is greatly saved, and the saved cost is about 40% of a traditional thin-film switch.