Method and system for monitoring surface roughness of magnetic control spattering target

Abstract

The invention relates to a method and a system for monitoring surface roughness of a magnetic control spattering target. The method comprises the following steps of: step 1, before applying voltage between the target and the substrate to plate a film on the substrate, testing the surface roughness of each testing area of the target in the current state; step 2, according to the surface roughness of each testing area of the target under the current state, generating a surface roughness change curve of the target, and comparing the surface roughness change curve and a preset standard surface roughness change curve of the target to obtain the roughness deviation of each testing area of the target; step 3, when the roughness deviation exceeds a preset threshold, outputting the alarming information for promoting the abnormal surface roughness of the target; otherwise, outputting the information for promoting the normal surface roughness of the target. The invention is favorable for decreasing the rate of defective product caused by the abnormal surface roughness of the target and enhancing the in-time property and efficiency of the monitoring of the surface roughness of the magnetic control spattering target.

Description

technical field [0001] The invention relates to semiconductor technology, in particular to a method and system for monitoring the surface roughness of a magnetron sputtering target. Background technique [0002] Magnetron sputtering (Magnetic Sputtering) technology is a coating technology commonly used in semiconductor manufacturing processes. Its working principle is that the plasma (Plasma) formed by RF power (RF Power) or DC power (DC Power) has High-energy gas ions (Gas Ion) hit the surface of the target (Target), and the particles (Particle) are ejected from the surface of the target and attached to the surface of the substrate, thereby forming a film layer on the surface of the substrate. [0003] In the coating process using magnetron sputtering technology, there are certain requirements for the roughness of the target surface. If there is a large foreign matter on a certain part of the target surface, or there is a small but sharp foreign matter on the target surfac...

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Problems solved by technology

[0005] The inventor found in the process of realizing the present invention that the monitoring equipment in the prior art can only obtain the monitoring results after the abnormal discharge phenomenon occurs, and it is impossible to avoid the abnormal discharge caused by the foreign matter on the target during the coating process using the magnetron sputtering technology. The products are not good, so there are defects such as the lagging of the monitoring program of the surface roughness of the magnetron sputtering target and the low efficiency.

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