Aluminum-containing film layer pattern, manufacturing method and post processing method therefor
A production method and film layer technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., to achieve the effect of shortening the processing time, saving waiting time, and prolonging the cycle of daily maintenance
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[0028] The specific implementation manners of the aluminum-containing film layer pattern provided by the embodiments of the present invention, its manufacturing method and its post-processing method will be described in detail below with reference to the accompanying drawings.
[0029] Specifically, due to the use of chlorine gas (Cl 2 ) gas, therefore, after dry etching, there will be residual chlorine gas on the surface of the patterned film layer containing aluminum (Al), and the metal aluminum in the patterned film layer will absorb the residual chlorine gas and carry out the following reaction : 2Al+3Cl 2 →2AlCl 3 ↑.
[0030] Therefore, if the dechlorination treatment is not carried out, when the patterned film layer is exposed to the air, the residual chlorine reacts with the metal aluminum in the patterned film layer to generate AlCl 3 Reacts with moisture in the atmosphere to form HCl. HCl will react with Al to form Al x Cl y . Al x Cl y Then react with moistu...
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