103results about How to "Reduce stress buildup" patented technology

A structure of thermal stress compensation at least comprises a substrate, a first film and a second film. The substrate has a first positive coefficient of thermal expansion. The first film having a second positive coefficient of thermal expansion is over the substrate. The second film having a third negative coefficient of thermal expansion is over the substrate.

Provided are apparatuses and method for the thermal processing of a substrate surface, e.g., controlled laser thermal annealing (LTA) of substrates. The invention typically involves irradiating the substrate surface with first and second images to process regions of the substrate surface at a substantially uniform peak processing temperature along a scan path. A first image may serve to effect spike annealing of the substrates while another may be used to provide auxiliary heat treatment to the substrates before and/or after the spike annealing. Control over the temperature profile of the prespike and/or postspike may also reduce stresses and strains generated in the wafers. Also provided are microelectronic devices formed using the inventive apparatuses and methods.

The invention provides a preparation method of a titanium alloy thin-wall honeycomb structure. The preparation method comprises the steps that (a) a titanium alloy thin-wall honeycomb structure model is sliced and layered according to 20-30 mu m layer thickness; (2) titanium alloy powder is uniformly paved on a titanium alloy substrate, a laser beam which is emitted by a laser is used for selectively melting a titanium alloy powder layer according to the determined scan locus of the laser beam to complete the processing of one layer of titanium alloy thin-wall honeycomb structure; (c) the titanium alloy powder is paved on the layer of formed titanium alloy thin-wall honeycomb structure again, the laser beam which is emitted by the laser is used for selectively melting the titanium alloy powder layer according to the determined scan locus of the laser beam; (d) the titanium alloy thin-wall honeycomb structure is processed layer by layer, and the titanium alloy thin-wall honeycomb structure is finally formed. According to the method, the stress accumulation and the deformation of a forming piece in the forming process are reduced, the flexibility degree is high, and a thin-wall honeycomb component with variable honeycomb distance and a three-dimensional dot matrix structure can be prepared.

A turbine airfoil usable in a turbine engine with a cooling system and a compliant dual wall configuration configured to enable thermal expansion between inner and outer layers while eliminating stress formation is disclosed. The compliant dual wall configuration may be formed a dual wall formed from inner and outer layers separated by a compliant structure. The compliant structure may be configured such that the outer layer may thermally expand without limitation by the inner layer. The compliant structure may be formed from a plurality of pedestals positioned generally parallel with each other. The pedestals may include a first foot attached to a first end of the pedestal and extending in a first direction aligned with the outer layer, and may include a second foot attached to a second end of the pedestal and extending in a second direction aligned with the inner layer.

A force resistant panel system is provided where a window pane is bordered by a sash and magnetically attracted to an exterior flange. The exterior flange is attached to an opening in a wall, facing outward. An interior flange with a channel is attached to the inside and facing inward. The exterior flange and interior flange combine to form a channel for which the window pane can travel in the event of a blast. Decorative trim snaps into a groove on the interior flange and generates static outward pressure against the sash.

A piezoelectric element having a crystal structure that enables a piezoelectric film to be formed in an unstressed state is provided. The piezoelectric film contains an a-axis oriented crystal and a c-axis oriented crystal, where a difference in lattice constant between the a-axis oriented crystal and the c-axis oriented crystal is not more than 0.06 Å. The present inventors have newly found that a stress accumulated in the piezoelectric film can be reduced while maintaining favorable piezoelectric properties when a condition that the difference in lattice constant between the a-axis oriented crystal and the c-axis oriented crystal is not more than 0.06 Å is satisfied. When the condition is satisfied, the c-axis oriented crystal and the a-axis oriented crystal are properly balanced and as a result crystal particles of the piezoelectric film are closest-packed on its base in an ideal state, which contributes to a reduced stress.

A multiple quantum well structure includes a plurality of well-barrier sets arranged along a direction. Each of the well-barrier sets includes a barrier layer, at least one intermediate level layer, and a well layer. A bandgap of the barrier layer is greater than an average bandgap of the intermediate level layer, and the average bandgap of the intermediate level layer is greater than a bandgap of the well layer. The barrier layers, the intermediate level layers, and the well layers of the well-barrier sets are stacked by turns. Thicknesses of at least parts of the well layers in the direction gradually decrease along the direction, and thicknesses of at least parts of the intermediate level layers in the direction gradually increase along the direction. A method for manufacturing a multiple quantum well structure is also provided.

A photoelectric semiconductor component with three families nitrogen compound semiconductor buffer layers is provided, which comprises a substrate, and at least two InGa<1-x>N layers and at least two InGa<1-y>N layers which superimposes on the substrate alternately, wherein the x not equals to the y. A luminescent epitaxial structure is located on the surface of the InGa<1-y>N layer which is at the upper layer. A superlattice buffer layer is formed by the InGa<1-x>N layer which is between the substrate and the luminescent epitaxial structure and the InGa<1-y>N layer to reduce stress.

The invention discloses a vehicle-mounted air condition air sweeping device driven by an electric control shape memory alloy. The vehicle-mounted air condition air sweeping device is composed of a drive part, a control part, a transmission part and an execution mechanism. The drive part adopts the shape memory alloy as a drive element, the shape memory alloy shrinks when electrified to be heated and is lengthened when cooled, and output of displacement and force of a driver is achieved. The control part is composed of a sensor, a single-chip microcomputer and a manual control key, the current on a shape memory alloy wire is controlled, and therefore the temperature of the shape memory alloy wire is controlled. The transmission part is mainly composed of a clutch device or a reset device. The execution mechanism is vehicle-mounted air conditioner air sweeping blades. The vehicle-mounted air condition air sweeping device has the beneficial effects of being small in size, simple in structure, convenient to install, easy to achieve, free of electromagnetic interference, good in periodical control effect and the like.

The invention discloses a TC4 titanium alloy multi-channel valve body laser selective area melting forming method. A multi-channel valve body three-dimensional model is established, manufacturabilitycompensation is added, and the size precision and the shape precision are improved; meanwhile, the valve body character and a complex stress and strain environment formed in the valve body in the forming process are aimed, a stress/strain simulation result is utilized, and the forming direction is determined, a specially-made process support is arranged, alleviating the stress concentration phenomenon is optimized, and machining parameters with the minimum stress strain are selected; and then laser scanning path data of each slice layer are obtained by means of slicing software, and laser selective area melting forming is carried out according to the scanning path data; and finally, after the valve body removes floating powder and is subjected to thermal stress treatment, a substrate plateof the valve body is separated, and the problem that the size precision of the forming valve body is low by utilizing the laser selective area melting forming technology is solved.

Screw dowel for concreting into a railway sleeper or ballastless track and frictionally connecting to a sleeper screw, containing a threaded portion (14) with external thread flights (18) arranged on the outside of the screw dowel (10) and with internal thread flights (19) arranged on the inside of the screw dowel; and an upper subportion (16) without external thread that is situated close to the dowel opening (26) in the installed state; the screw dowel containing two constituent parts made of different materials, namely a basic body made of plastic and a cylindrical ring (20) made of a steel material and mounted with a form fit and/or force fit.

The invention provides a selective laser melting and forming method of a titanium alloy asymmetric protection shield. The method includes the following steps of (1) design of an additional constraint structure; (2), preparation of titanium alloy powder; (3), selective laser melting and forming of a protection shield product; (4), distressing and annealing; (5), linear cutting to take off the product and removal of the additional constraint structure. Stress deformation of a thin wall flexible component is controlled through an additional constraint condition; due to the fact that the product is of a thin wall flexible structure, buckling deformation is generated easily through direct forming, the additional constraint structure is added to the opening portion of the protection shield, the overall rigidity of the product is improved, and forming quality is guaranteed. Distressing and annealing treatment is performed, an optimized heat treatment system is adopted to perform distressing treatment on a forming part with the additional constraint structure, liner cutting is performed after residual stress is eliminated to remove the additional constraint structure, and product size precision is guaranteed.

The invention discloses a hybrid-electrode Pockel's cell and a time-sharing loop-sharing driving method. Efficient cooling and low-voltage fast-response driving of the Pockel's cell are realized. The basic structure of the hybrid-electrode Pockel's cell is a sandwich structure in which a z-cut DKDP crystal is sandwiched between a discharge chamber and a high-reflectivity mirror. Longitudinal electro-optic effect use and longitudinal conduction cooling are adopted. The discharge chamber is used as an electrode at the laser incidence side. The high-reflectivity mirror integrates the functions of a mirror, a heat sink and an electrode. The diameter of the Pockel's cell can be calibrated and amplified. The Pockel's cell can bear high average power density, and can operate at high throughput and at repeated frequency. The Pockel's cell has low driving voltage, and is quick in response. The Pockel's cell is applicable to a high-energy repeated-frequency laser system.