80results about How to "Prevent electrical short circuit" patented technology

The present invention discloses a all-solid lithium secondary battery that has large chare and discharge output current denseness and excellent charge and discharge cycle life which can be easily manufactured at low cost. In the manufacturing process of the all-solid lithium secondary battery, a new lithium ion conductor with ionic conduction improved can be obtained through vitrification to mixed electrolytes by mixing Alpha-oxide of alumina in various sulfide system lithium ion conductivity solid electrolyte. The electrolytes layer 8 used the lithium ion conductor, and positive and negative electrode (I), (II) are formed by positive and negative electrode material 3, 7 are constituted. Subsequently, cascading at least 1 layer in positive and negative electrode (I), (II) with electrolytes layer, and producing battery while electrolytes not crystallizes by heating and compressing as a whole.

Disclosed herein is a battery pack wherein a rectangular battery having an electrode assembly and an electrolyte contained therein in a sealed state is received in a pack case, and an insulating material is filled in a space defined between the inner surface of the upper end of the pack case and the upper end of the battery, whereby the battery pack is manufactured with a reduced thickness, the assembly process of the battery pack is very simple, and short circuit of the battery pack or suspension of power supply from the battery pack, which may occur as the battery is moved, is effectively prevented even when the battery pack falls down or external impacts are applied to the battery pack.

The invention relates to a manufacturing method of an array substrate for a liquid crystal display, and the method comprises steps of: a) forming a grid on the substrate; b) forming a gate insulation layer on the substrate comprising the grid; c) forming a semiconductor layer on the gate insulation layer; d) forming a source electrode/drain electrode on the semiconductor layer; and e) forming a pixel electrode connected with the drain electrode; the step a) comprises steps of: forming a copper based metal film on the substrate, a multi-layer of a copper based metal layer and a metal oxide film, or a multi-layer of a copper based metal layer and a molybdo-based metal layer; and etching the film to form the grid through etching agent composition; the step d) comprises steps of: forming a copper based metal layer on the semiconductor, a multi-layer of a copper based metal layer and a metal oxide film, or a multi-layer of a copper based metal layer and a molybdo-based metal layer; and etching the film to from the source electrode/drain electrode through the etching agent composition.

The present invention relates to an IC packaging and its multi-layer conductor frame. The IC packaging has been defined with a wire-bonded region which mainly includes a multi-layer conductor frame with pins, a wafer, even numbers of welding lines in this region and at least an electric-transferred component. At least one of these pins carries a transferred finger which is insulating to the corresponding pin and does not cover inner terminal of the pin. The electric-transferred component has at least one part which is formed outside the wire-bonded region, and the transferred finger is connected to one pin which is not under the transferred finger. The shortest distance between staggered welding lines can be added, or staggered points of these welding lines can be reduced, thus staggered short circuit of welding lines can be avoided during colloid sealing.

Provided is a three-dimensional semiconductor memory device. The device may include a substrate that includes a cell array region and a connection region; an electrode structure provided on the substrate to extend in a first direction and include electrodes that are vertically stacked on the substrate and include pad portions which are stacked on the connection region to have a staircase structure; cell vertical structures provided on the cell array region to penetrate the electrode structure; dummy vertical structures provided on the connection region to penetrate the pad portion of each electrode; and cell contact plugs coupled to the pad portions of the electrodes. Each cell contact plug may have a non-circular top surface, and the dummy vertical structures may be arranged to surround each cell contact plug, in a plan view.

The invention relates to a sound transducer (1) comprising a plurality of single transducers (10), wherein the single transducers (10) have a carrier (12) and a piezoelectrical element (14) with a first electrode (16) and a second electrode (18). According to the invention, the single transducer (10) is adhered to a flexible film (30) in the form of an array, and the surfaces of the single transducers (10) that are not connected to the flexible film (30) are surrounded by an encapsulation material (60) having vibration damping properties. The invention also relates to a method for producing a sound transducer (1) of this type.

The invention provides a semiconductor package with an electrical connection structure and a manufacturing method thereof, and the semiconductor package comprises a conducting wire layer, a chip, a welding wire, a packaging colloid, an anti-welding layer and welding balls, wherein the conducting wire layer comprises a chip carrier and a plurality of conducting wires annularly arranged on the periphery of the chip carrier; the packaging colloid comprise a plurality of recesses which are used for embedding the chip carrier and the conducting wires, in the depth of greater than the thickness of the chip carrier and the conducting wires and further exposed on the surface of the conducting wires and the chip carrier; the anti-welding layer is formed in the recesses of the packaging colloid, and the anti-welding layer comprises a plurality of open holes of the anti-welding layer for exposing all conducting wire terminals and part of the chip carrier; and the welding balls are formed in all the open holes of the anti-welding layer to electrically connect with the corresponding conducting wire terminals. Therefore, the adhesion strength of the anti-welding layer is improved by mutual embedding and clamping between the anti-welding layer and the packaging colloid, a path for enabling wet gas to infiltrate into the package is prolonged, and the product reliability is enhanced.

A precursor material for lithium ion batteries and a method for manufacturing lithium ion batteries are provided. The precursor material is UV-curable and printable and can be used as a separator anda solid electrolyte. The precursor material includes a lithium salt dissolved in one or more organic solvents; UV-curable monomer in an amount from approximately 4 weight percent to approximately 10 weight percent, a UV-initiator; one or more host ion conductive polymers in an amount less than approximately 5 weight percent of the precursor material; and a ceramic powder. The precursor material, when cured, has sufficient mechanical rigidity to act as a separator preventing electrical shorting between a lithium ion battery cathode and a lithium ion battery anode, and also has sufficient electrical conductivity to function as an electrolyte for a lithium ion battery. The provided method enables the formation of batteries with complex shapes through printing.

An electrosurgical instrument is disclosed having a jaw part composed of instrument branches which are movable towards each other and on each mutually facing side of which one or more electrode surfaces are arranged/formed, wherein the movement of the instrument branches relative to each other can be limited by at least one proximal spacer acting on proximal end portions of the instrument branches, at least one medial spacer acting on a medial portion, and at least one distal spacer acting on distal end portions of the instrument branches. According to the invention, the proximal and/or the distal spacer are made of electrically non-conductive material and the at least one medial spacer is composed of at least one electrode made of an electrically conductive material and connected electrically conductively to the electrode. Furthermore, the at least one medial spacer interacts with a local insulation component made of a non-conductive material, which insulation component is arranged in an electrically insulating manner on at least one opposite electrode.

Disclosed is a hot melt adhesive with quick tack loss and superior heat resistance that is capable of contributing to improvements in the productivity and safety of electric power equipment. Additionally disclosed is electric power equipment that is produced using the hot melt adhesive. The hot melt adhesive for the electric power equipment comprises (A) a copolymer of an ethylene and a carboxylic acid derivative with an ethylene double bond, (B) a polypropylene wax, (C) a polyethylene wax, and (D) a Fischer-Tropsch wax. (A) An ethylene-vinyl acetate copolymer is preferable as the copolymer. The electronic power equipment can be excellently produced by using the abovementioned hot melt adhesive.