The invention discloses an
LED packaging technical process based on an iron substrate, and belongs to the technical field of an
LED packaging process, for solving the technical problem of providing an
LED packaging technical process based on an iron substrate. For a lamp bead with power of 0.5 W below, the iron substrate is used to replace a
copper substrate support, the heat dissipation requirement is met, the material cost can also be reduced, the
economic benefits are improved, and after the surface of the iron substrate is plated with
nickel, the iron substrate is also plated with silver so as to maintain the excellent performance of a product. The technical scheme employed by the invention is as follows: the LED packaging technical process based on the iron substrate comprises the steps of
crystal expanding,
crystal solidifying, baking, wire
welding, dispensing, material stripping, light splitting, dehumidifying, bagging, examining and packaging. The LED packaging technical process is carried out on the substrate prepared by taking iron as a
raw material. The LED packaging technical process based on the iron substrate can be applied to the technical field of the LED packaging process.