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54results about How to "Manufacturing process is complicated" patented technology

Semiconductor device and manufacturing method thereof

A semiconductor device and its manufacturing method are offered to increase the number of semiconductor devices obtained from a semiconductor wafer while simplifying a manufacturing process. After forming a plurality of pad electrodes in a predetermined region on a top surface of a semiconductor substrate, a supporter is bonded to the top surface of the semiconductor substrate through an adhesive layer. Next, an opening is formed in the semiconductor substrate in a region overlapping the predetermined region. A wiring layer electrically connected with each of the pad electrodes is formed in the opening. After that, a stacked layer structure including the semiconductor substrate and the supporter is cut by dicing along a dicing line that is outside the opening.
Owner:SEMICON COMPONENTS IND LLC

Double-sided chip on film packaging structure and manufacturing method thereof

InactiveUS20160133550A1Manufacturing process be complicateEnhance production yieldSemiconductor/solid-state device detailsSolid-state devicesChip on filmElectrical and Electronics engineering
A double-sided chip on film (COF) packaging structure and a manufacturing method thereof are disclosed. The double-sided COF structure includes a metal layer, a first insulating layer, a second insulating layer, a chip, and an encapsulant. The first insulating layer and second insulating layer are disposed on a first surface and a second surface of metal layer respectively. The first surface and second surface are opposite. The first insulating layer includes a first part and a second part separated from each other. An accommodating space is existed between the first part and the second part and a part of the first surface is exposed. The chip is accommodated in the accommodating space and disposed on the exposed part of the first surface. The encapsulant fills the spaces between the chip and the first part and between the chip and the second part to form the double-sided COF packaging structure.
Owner:RAYDIUM SEMICON

Electrostatic Transformer

An electrostatic transformer includes: a first fixed electrode; a second fixed electrode; a movable electrode displaceably supported by a flexible member within a space between the first fixed electrode and the second fixed electrode; and permanently charged films disposed on electrode surfaces of the movable electrode. And: an AC output voltage corresponding to a change in an electric charge induced at the second fixed electrode by displacing the movable electrode in response to an AC input voltage applied between the first fixed electrode and the movable electrode is extracted; and a ratio of the AC input voltage and the AC output voltage is determined based upon a ratio of an electromechanical coupling factor at an input-side electrostatic actuator, configured with the first fixed electrode and the movable electrode, and an electromechanical coupling factor at an output-side electrostatic actuator, configured with the second fixed electrode and the movable electrode.
Owner:AOI ELECTRONICS CO LTD
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