90results about How to "Increase plate thickness" patented technology

The present invention provides a hidden type split hinge. First and second curved tracks are provided on a curved seat body for respectively limiting a first and second curved blocks of first and second rotating members in a way of being relatively swung. First and second torsion units are symmetrical and adjacently provided to a first side of the curved seat body, and one end of the first and second torsion units is respectively provided with first and second pivoting holes, and the first and second pivoting holes are respectively in communication with first and second elongated opening holes, first and second tooth portions are respectively provided around peripheries of the first and second pivoting holes, and the first tooth portion is engaged with the second tooth portion, and the first and second pivoting hole are axially connected to the first and second shaft ends of a first lateral surface.

A cable or the like protection and guide device is disclosed in which inadvertent disconnection in a coupling portion of a side plate due to the repetition of flexional movements is avoided. Stress concentration is reduced in a flexion portion during restriction of flexional movements whereby excellent endurance on repeated flexion fatigue can be exhibited and in which the number of parts and the assembly operation can be reduced. Plates disposed in a right and left pair are integrally formed by a front side plate portion 111, a rear side plate portion 112, and a flexible coupling portion 113 interposed between the front side plate portion 111 and the rear side plate portion 112. The coupling portion 113 includes a thin plate-shaped central flexion allowable region 113a and base end continuous regions 113b, 113b with gradually increased plate thickness from the central flexion allowable region 113a side toward the front side plate portion 111 and rear side portion 112, respectively.

An inter-battery connection device for connecting terminals of two batteries (1a, 1b) arranged with their axes parallel to each other. The inter-battery connection device includes an inter-battery connection plate (11) that connects the battery case bottom (2) and the sealing plate (3) of the two batteries. The inter-battery connection plate (11) includes welding portions (4) at the ends of its base plate (6) for welding to the case bottom (2) and the sealing plate (3), respectively. An intermediate metal plate (7) is joined to the middle part of the base plate (6) between the welding portions (4, 4) to form an intermediate portion (5) having a greater thickness than each welding portion (4). The inter-battery connection device has reduced electric resistance while achieving improved weldability.

To provide a heat dissipation substrate for mounting an electric component, said substrate making it possible, even in the case of a circuit using a power semiconductor, etc. in which a large current flows, to achieve an improvement in heat dissipation and a reduction in wiring resistance due to high power operation. This heat dissipation substrate 100(d) for mounting an electric component is formed such that: the substrate is composed of lead frames that are formed into a wiring pattern shape from a conductor plate, and an insulating material 130 that is provided between the lead frames 110; the lead frames have at least two types of thicknesses that are different from each other, wherein a thick lead frame 110H is used for a large current signal and a thin lead frame 110L is used for a small current signal; a component disposition surface plate surface of the lead frames 110 and a component disposition surface-side plate surface of the insulating material 130 form one continuous surface; and the plate surface of the lead frames on the rear surface of the component disposition surface and the plate surface of the insulating material on the rear surface side of the component disposition surface side are formed on the same plane so as to match the plate surface on the rear surface of the component disposition surface of the thickest lead frame from among the lead frames.

In order to provide a sound-absorbing material and a sound-absorbing panel which can be produce at a low-cost and have excellent beauty or appearance and excellent sound-absorbing characteristics, the sound-absorbing material is applied which is made from a metallic plate member (2), and multiple pierced apertures of 200 [mu] m or smaller diameter are arranged along a board thickness on the plate-shaped member (2).

The present invention provides a hidden type split hinge. First and second curved tracks are provided on a curved seat body for respectively limiting a first and second curved blocks of first and second rotating members in a way of being relatively swung. First and second torsion units are symmetrical and adjacently provided to a first side of the curved seat body, and one end of the first and second torsion units is respectively provided with first and second pivoting holes, and the first and second pivoting holes are respectively in communication with first and second elongated opening holes, first and second tooth portions are respectively provided around peripheries of the first and second pivoting holes, and the first tooth portion is engaged with the second tooth portion, and the first and second pivoting hole are axially connected to the first and second shaft ends of a first lateral surface.

A terminal fitting includes a case (20) provided with an opening (31) into which a mating contact (91) is inserted, and an electrical contact member (60) disposed in the case (20) to face the opening (31) and configured to retreat while rotating to compress a resilient member (40) by being biased toward the opening (31) and pressed against the mating contact (91) by the resilient member (40).

An electronic substrate with heat dissipation structure includes a substrate plate and at least one heat pipe. The substrate plate includes a wiring layer, a grounding layer and an insulation layer from top to bottom. The wiring layer has at least one heat-producing element mounted thereon, and is formed with a receiving hole for the heat pipe to tightly fit therein. Heat produced by the heat-producing element and distributed over a high-temperature zone of the substrate plate surrounding the heat-producing element is absorbed by the heat pipe and then transferred to a low-temperature zone of the substrate plate distant from the heat-producing element, from where the heat is dissipated into ambient air to achieve cooling effect at upgraded heat dissipation efficiency.