56results about How to "Increase floor area" patented technology

The invention provides an electric motor, which can provide a less irregularity of winding and a high space factor when lead wire is wound around a plurality of teeth via an insulator to make a stator. The electric motor is provided with a rotator and a stator disposed on an outer diameter side of the rotator. The stator includes a cylindrical stator iron core provided with a plurality of teeth radially projecting from an inner circumferential side of an annular yoke toward a center, insulators made of an insulation material disposed on both ends of the stator iron core in an axial direction, and lead wire wound around the teeth via the insulators. First grooves disposed on an inner circumferential side of the insulator and second grooves disposed on an inner circumferential side of the stator iron core are formed to communicate with each other. A part of a connection line connecting the windings with each other is embedded in the first grooves and the second grooves.

The invention discloses a quakeproof support of a collection showcase. The quakeproof support of the collection showcase comprises a supporting device and a plane structure bearing the supporting device. The supporting device is of a flat plate shape and is installed at the bottom of the collection showcase. Frictional contact forms between the supporting device and the plane structure and is gapless contact. According to the quakeproof support of the collection showcase, the design concept that the collection quakeproof safety is improved is provided, the structure of the quakeproof support of the collecting showcase is provided, the supporting device is installed at the bottom of the collection showcase, the supporting device and the plane structure form the frictional contact, and therefore the purposes that the area of the ground occupied by an existing collection showcase is increased, the center of gravity of the existing collection showcase is lowered, and the overturn-resistance of the existing collection showcase is improved are achieved. Earthquake force is released through the stable frictional contact formed between the supporting device and the plane structure, so that the collection quakeproof safety is improved. Quakeproof modification can be conveniently conducted on the basis of the existing collection showcase, the reinvestment cost is low, and the economic index is high.

The invention discloses an adaptive extended high-efficiency permeable facial mask, which belongs to the field of facial masks. An adaptive extended high-efficiency permeable facial mask includes a facial mask body. The facial mask body includes an outer film layer, an inner film layer and a lateral extension layer. The outer film layer There are a plurality of closely distributed multi-layer broken-ball laminated nets filled between the inner film layer and the multi-layer broken-ball-style laminated net. Fractures fall off, and the volume of the multi-layer broken ball-type stacking net is reduced due to faults, so that the local thickness of the mask body is reduced, the local side ends are extended outward, and the plane area is increased, so as to realize adaptive adjustment according to the shape and size of the face. , so that it can be applied to the face more fully and comprehensively, and the adaptability to the face can be improved. Moreover, while pressing the multi-layer ball breaking net, it can realize the inflating of the inside of the mask body, so that the essence can flow in the air. Under the action, it quickly penetrates into the skin and accelerates the skin's absorption of essence.

Provided is a cylindrical iron core, in which a gap in the whole section of a stationary electromagnetic induction-type circular core of a transformer or a reactor can be reduced and iron loss due to leakage flux on the outer circumferential surface can be suppressed. The cylindrical iron core comprises a plurality of core blocks (2) formed by concentrically laminating cylindrical core elements (2A, 2B, 2C) which are formed by laminating a plurality of magnetic steel plates (21), each of which is provided with a curved portion (211) having a curved section in the width direction, while shifting from each other in the width direction.

The invention discloses a non-welding assembly type finished open ditch which comprises open ditch assemblies and connecting fasteners. The open ditch assemblies include stainless steel finished open ditch assemblies (1) and a sewer integrated open ditch assembly (6), and the stainless steel finished open ditch assemblies (1) are integrally connected with one another by the corresponding connecting fasteners and are integrally connected with the sewer integrated open ditch assembly (6) by the corresponding connecting fasteners; the edges of the stainless steel finished open ditch assemblies (1) and the edges of the sewer integrated open ditch assembly (6) are bent to form U-shaped open ditch assembly bent portions, the connecting fasteners are platy, and two fastening side edges of each connecting fastener are bent to form U-shaped fastener bent portions; the open ditch assembly bent portions are oppositely fastened with the fastener bent portions, and impermeable rubber mats (4) are arranged among the open ditch assembly bent portions and the fastener bent portions. The non-welding assembly type finished open ditch has the advantages that the non-welding assembly type finished open ditch is good in waterproof effect, is free of water leakage after being used for a long time and is favorable for cleaning; blockage due to the fact that sundries drop into the non-welding assembly type open ditch can be prevented.

The invention discloses an inductor in a three-dimensional stack package chip, comprising: a first wafer including a first inductor; a second wafer including a second inductor; the first wafer is bonded to the second wafer Taken together, the first inductor and the second inductor are connected in series. The invention also improves a method for preparing the inductor. In the above inductance, the first inductance and the second inductance are connected in series to increase the inductance value of the inductance without increasing the planar area of ​​the chip.