127results about How to "Reduce floor area" patented technology

The invention relates to a method and its medium box for quantity measuring peculiar analysis substance by single capture medium. The method comprises the following steps: combining the tested analysis substance with solid phase capture medium, labeling analysis substance which has been captured by capture medium with report molecule, cleaning-up analysis substance from compound, recombining tested analysis substance with new solid phase capture medium, ascertaining content of analysis substance by report molecule's label signal. The medium box comprises capture device, testing device report molecule used as label and analysis substance eluent.

The present invention easily improves the accuracy of connection level alignment between an elevating guide rail and a fixed side guide rail in a path switching device which switches vertically a traveling path of a conveyance carriage or the like via an elevating guide rail, and in an upper and lower path switching device for a traveling body for transportation, including an elevating guide rail supported horizontally by an elevating body, upper fixed guide rails to be connected to the elevating guide rail at a lifted position of the elevating body, and lower fixed guide rails which are connected to the elevating guide rail at a lowered position of the elevating body, the elevating guide rail is supported movably vertically in a predetermined range with respect to the elevating body, and receiving members for receiving the elevating guide rail at a level at which the elevating guide rail is connected to the lower fixed guide rails before the elevating body reaches a lower limit thereof are provided.

The invention discloses a sliding plate conveying system which comprises a working conveying track, a return conveying device and a transfer device arranged between the working conveying track and the return conveying device and used for transferring sliding plates. The return conveying device is located under the working conveying track. The transfer device comprises a first lifting machine arranged between an outlet of the return conveying device and the input end of the working conveying track and a second lifting machine arranged between the output end of the working conveying track and an inlet of the returning conveying device. The first lifting machine and the second lifting machine are respectively provided with a high position enabling the corresponding lifting machine to be in abutting connection with the working conveying track and a low position enabling the corresponding lifting machine to be in abutting connection with the return conveying device. The returning conveying device is located under the working conveying track. The whole sliding plate conveying system is small in occupation plane area, suitable for being applied to workshops with limit space and capable of effectively expanding use range of the sliding plate conveying system.

The invention relates to the technical field of filters, in particular to a bulk acoustic wave filter element and a forming method thereof, a multiplexer and communication equipment, and the method comprises the following steps: arranging one part of resonators on an upper wafer, and arranging the other part of resonators on a lower wafer; wherein the upper wafer and the lower wafer are stacked; and the butt joint pin of the upper wafer is bonded with the butt joint pin of the lower wafer, so that the resonators of the upper wafer and the lower wafer are connected to form the filter. Accordingto the technical scheme of the invention, the resonators are respectively arranged on the upper wafer and the lower wafer, and the resonators on the upper wafer and the lower wafer are bonded throughthe butt joint pins to form the filter, so that the planar area occupied by the resonators in the upper wafer and the lower wafer can be reduced, and the size of the filter can be reduced.

A wire substrate, a display device including a wire substrate, and a method of fabricating a wire substrate are disclosed. The display device comprises: a first base; and a first wiring layer disposed on the first base and comprising a conductive metal layer and a metal oxide layer stacked on one another, wherein the metal oxide layer comprises MoxTayOz, wherein a content of tantalum is equal to or less than 2.0 at % (atomic percent) based on a total number of metal atoms.

The invention discloses a display substrate and a manufacture method thereof, a display device and a manufacture method thereof, and a mobile terminal, relates to the technical field of displaying andis intended to increase screen-to-body ratio of the mobile terminal. The display substrate comprises a rigid substrate, a flexible substrate, a pixel structure and a binding terminal, wherein the rigid substrate comprises a portion corresponding to a display area of the display substrate, the flexible substrate is positioned on the rigid substrate and comprises a portion corresponding to the display area of the display substrate and a portion corresponding to a binding area of the display substrate, the pixel structure is positioned in an area of the flexible substrate corresponding to the display area of the display substrate, the binding terminal is positioned in an area of the flexible substrate corresponding to the binding area of the display substrate, and the part of the flexible substrate corresponding to the binding area is flexible. After the display device with the display substrate provided herein is applied to the mobile terminal and the part of the flexible substrate corresponding to the binding area is bent, the screen-to-body ratio of the mobile terminal is increased.

The invention belongs to the technical field of wireless communication, and relates to a phased array antenna based on a continuously adjustable substrate integrated waveguide phase shifter. The phased array antenna comprises a feed network, a phase shifter and a radiation unit, wherein the feed network is connected between the phase shifter and the radiation unit; the feed network comprises a converter, a T-shaped power divider and a Y-shaped power divider; the output end of the converter is connected with the input end of the T-shaped power divider, the output ends of the T-shaped power divider are respectively connected with the input ends of the Y-shaped power divider, and the output end of the Y-shaped power divider is connected with the phase shifter. The antenna has the advantages of low cost, compact structure, high integration level and large continuous scanning angle range.

The present invention provides a short-circuit unit comprising: a plurality of signal lines divided into a plurality of groups, each group comprising multiple signal lines, and the multiple signal lines in a same group are not adjacent to each other; a plurality of short-circuit lines, each group of the signal lines correspond to one short-circuit line, and the short-circuit line electrically connects all of the signal lines in the group corresponding to the short-circuit line, the plurality of short-circuit lines are disposed in different layers and the short-circuit lines in different layers are insulated from each other. The present invention also provides an array substrate. In the short-circuit unit of the present invention, the short-circuit lines are disposed in different layers. Compared to the existing solutions in which the short-circuit lines are provided in a same layer, the width occupied by the short-circuit unit of the present invention is smaller.

Provided is a heat medium heating apparatus, which can reduce the thermal contact resistance between flat heat exchanger tubes and PTC heaters, improve the heat transfer performance, efficiently cool and control heat-generating electrical components on a board of the the PTC heaters and realize reduction in weight and low cost. The heat medium heating apparatus includes: the plurality of flat heat exchanger tubes 12; the PTC heaters 13 that are respectively incorporated between flat tube parts of the flat heat exchanger tubes 12; a heat exchanger holding member 15 that press-fixes the flat heat exchanger tubes 12 and the PTC heaters 13, from one side of the flat heat exchanger tubes 12 to an inner surface of a casing 11; and a control board 17 that has a surface on which a control circuit 21 is mounted, the control circuit 21 including heat-generating electrical components 20 that control the PTC heaters 13, in which the control board 17 includes heat penetration parts that are formed so as to pass through the control board 17 correspondingly to mounting positions of the heat-generating electrical components 20, and the heat-generating electrical components 20 are mounted so as to be cooled via the heat penetration parts.

A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed to be stacked on the first output unit; and a controller configured to control the output units.

The invention provides an equal-directional array type rectifier bridge stack which is compact in structure and more reasonable in whole layout, so that the volume and the cost of a product are effectively reduced. The equal-directional array type rectifier bridge stack comprises a chip I, a chip II, a chip III and a chip IV, a framework I, a framework II, a framework III and a framework IV, a jumper wire I, a jumper wire II, a jumper wire III and a jumper wire IV; each one of the framework I, the framework II, the framework III and the framework IV is formed by a respective body and a pin; the four frameworks are in an opposite-side layout; the bodies of the framework I and the framework III are rectangular; an insulating distance is kept between the bodies and the bodies are located at one side of the opposite-side layout; the bodies of the framework II and the framework IV are C-shaped, and the bodies are in an occlusion position relation; an insulating distance is kept between the bodies and the bodies are located at the other side of the opposite-side layout; the chip I is distributed on the front face of the body of the framework I; the chip II and the chip IV are respectively distributed on the front face of the body of the framework IV; the chip III is distributed on the front face of the body of the framework III; and the directions of polarities of the chip I, the chip II, the chip III and the chip IV are the same. According to the equal-directional array type rectifier bridge stack disclosed by the invention, the quality of a product is stable and the cost is greatly reduced.