64results about How to "Improve soldering effect" patented technology

The invention relates to a cable dipping tinning device, which includes first, second, third, and fourth feeding mechanisms, a base, a bracket, a carrier, a tin furnace, and a receiving mechanism. The first feeding mechanism includes a horizontal A first pallet and a first pen-shaped cylinder, the carrier is positioned on the first pallet, the first pallet is provided with a first guide groove, and the first pen-shaped cylinder is provided with a ballast bearing With a push rod that moves backwards, the second feeding mechanism includes a horizontal second pallet, a first cylinder, a clamping mechanism, a second cylinder and a second pen-shaped cylinder, the second support The plate is provided with a second guide groove, and the third feeding mechanism includes a third supporting plate and a third cylinder that are upright, the third supporting plate is provided with a third guiding groove, and the tin furnace is located in the third Below the pallet, the fourth feeding mechanism includes a fourth pallet and a fourth cylinder that are upright, the fourth pallet is provided with a fourth guide groove, and the receiving mechanism includes a third pen-shaped cylinder and receiving channel.

The invention relates to a lead-free environmentally friendly soldering flux and a preparation method thereof. The method comprises the following steps of: mixing synthetic organic acid, an activating agent and a mixed alcohol solvent at normal temperature according to a component formula; pouring an obtained mixture into a stainless steel container, and then adding modified rosin particles; stirring materials in the container until the rosins are all dissolved, and then stopping stirring; and standing still, filtering and hermetically packaging to obtain a soldering flux product. The lead-free environmentally friendly soldering flux is a no-clean soldering flux with low solid content, less rosin and no halide, has the characteristics of quick dry, bright and firm welding spot, uniform spreading, full structure, no corrosivity, excellent solderability, good soldering wetting, stable property, and the like, conforms to the property requirements of various electrical appliances and is suitable for soldering computers and peripheral equipment or high-precision multilayer board electronic assemblies. When in use, the soldering flux product has the advantages of low smoke, no pollutionto working environment, no influence on the human health, no pollution to tracks and clamps of a tinning furnace, higher insulating impedance, good environment friendly performance and stronger market competitiveness.

The invention discloses a method for synthesizing C-level polyurethane wire enamel. The C-level polyurethane wire enamel prepared by the method has high heat-resistant performance and solderability and physical performance, and the heat-resistant level reaches a C level. The method for synthesizing the C-level polyurethane wire enamel mainly comprises the following steps of: synthesizing polyester polyol, synthesizing a diphenylmethane diisocyanate (MDI) tripolymer and preparing polyurethane paint, wherein the polyester polyol is prepared by reacting dimethyl terephthalate, tri-(2-ethoxy) isocyanurate and dihydric alcohol which serve as raw materials under the action of a catalyst; and the dihydric alcohol is N-methyldiethanolamine, and part of dimethyl terephthalate is replaced by adding tetracarboxylic dianhydride for reaction.

The invention provides a preparation method of a solderable silver-coated nickel conductive layer and an automatic screen printing silver-coated device, wherein the preparation method is: dripping nano-silver paste on the printed nickel conductive pattern, and then drying and co-sintering to obtain a solderable silver-coated nickel conductive layer; wherein, the nano-silver paste has a silver content of 5-15%, a glass phase content of 0.5-1.5%, and a viscosity of 5-30mPa·s. By adopting the technical solution of the present invention, no special flux and solder materials are needed, and only one co-sintering method is required to obtain a nickel conductive layer with better soldering effect and solder bonding force, and the operation is simple and convenient , the consistency and stability of the production products are good, the discharge of three wastes is not increased, the product is green and environmentally friendly, and is suitable for industrial production.