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Packaging substrate and manufacturing method thereof

A packaging substrate and bottom layer technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the difficulty of tin on the cut-off surface of solder feet, it is difficult to adhere to solder, and affect the operability and stability of packaged products And other problems, to achieve the effect that is not easy to be oxidized

Pending Publication Date: 2020-05-26
ASE SHANGHAI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Correspondingly, due to the small section of the solder fillet, it is difficult to adhere enough solder during soldering
Moreover, the cut-off surface of the exposed solder fillet is easy to oxidize after a period of time, which will further cause the difficulty of tin on the cut-off surface of the solder fillet, thereby affecting the operability and stability of the packaged product in application

Method used

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  • Packaging substrate and manufacturing method thereof
  • Packaging substrate and manufacturing method thereof
  • Packaging substrate and manufacturing method thereof

Examples

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Embodiment Construction

[0018] In order to better understand the spirit of the embodiments of the present application, it will be further described below in conjunction with some preferred embodiments of the present application.

[0019] Embodiments of the present application will be described in detail below. Throughout the specification of the present application, the same or similar components and components having the same or similar functions are denoted by like reference numerals. The embodiments described herein with respect to the accompanying drawings are illustrative, diagrammatic and are used to provide a basic understanding of the application. The examples of the present application should not be construed as limiting the present application.

[0020] As used herein, the terms "approximately," "substantially," "substantially," and "about" are used to describe and account for minor variations. When used in conjunction with an event or circumstance, the terms can refer to instances in whi...

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Abstract

The embodiment of the invention relates to a packaging substrate and a manufacturing method thereof. According to the packaging substrate in one embodiment, the packaging substrate comprises a circuittop layer, a circuit bottom layer, a first insulating layer and at least one stepped inclined side surface, wherein the first insulating layer is located between the circuit top layer and the circuitbottom layer; and the stepped inclined side surface is provided with a first stepped inclined side surface extending from the circuit top layer to the first insulating layer and a second stepped inclined side surface extending from the first insulating layer to the circuit bottom layer. According to the packaging substrate and the manufacturing method thereof provided by the embodiment of the invention, the soldering tin performance of the packaging substrate can be effectively evaluated from the appearance.

Description

technical field [0001] The embodiments of the present application generally relate to the semiconductor field, and more specifically, relate to a packaging substrate and a manufacturing method thereof. Background technique [0002] Land grid array (LGA) packaging technology is a "leap-forward technological revolution" in the field of semiconductor packaging technology, mainly because it uses metal contact packaging to replace the previous pin pins. However, it is generally difficult to judge whether the solder joints of the grid array package, especially the solder joints at the bottom, are in good condition from the appearance of the product. In addition, the solder pins on the side of the LGA package are only cut off at the connection of the package unit during the production process to expose the solder pin cut-off surface. Correspondingly, due to the small cross-section of the solder fillet, it is difficult to adhere enough solder during soldering. Moreover, the expose...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48
CPCH01L23/49822H01L23/49827H01L23/49838H01L21/4857H01L21/486
Inventor 欧宪勋廖顺兴程晓玲罗光淋王鹏
Owner ASE SHANGHAI
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